Patents by Inventor Hideyuki Abe

Hideyuki Abe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11926152
    Abstract: A printing apparatus includes a carriage mounted with a printing unit; a first motor configured to move the carriage in a predetermined direction; a second motor configured to move the carriage in the predetermined direction; and a control unit. The control unit executes a first mode in which, when causing the printing unit to perform printing under a first printing condition, the first motor is driven in a first direction and the second motor is driven in the first direction, and a second mode in which, when causing the printing unit to perform printing under a second printing condition different from the first printing condition, the first motor is driven in the first direction and the second motor is driven in the first direction while changing an output ratio between the first motor and the second motor.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: March 12, 2024
    Assignee: Canon Kabushiki Kaisha
    Inventors: Ryohei Maruyama, Daigo Kuronuma, Masakazu Nagashima, Tomohito Abe, Kenta Iimura, Hiromasa Yoneyama, Naoaki Wada, Kichinosuke Hirokawa, Akira Fujikake, Toshiaki Yamaguchi, Hideyuki Nozawa
  • Patent number: 11912290
    Abstract: A self-position estimation accuracy verification method includes a step of moving a mobile object to a first check point, a step of acquiring first check information, a step of starting a self-position estimation using the first check information as an initial value, a step of moving the mobile object to a second check point while continuing the self-position estimation, a step of acquiring second check information, and a step of calculating a deviation between a position and a posture of the mobile object on the map estimated by the self-position estimation at the second check point and a position and a posture of the mobile object on the map indicated in the second check information, and verifying the accuracy of the self-position estimation based on the deviation.
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: February 27, 2024
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kazuhiko Kamikado, Taichi Kawanai, Sadayuki Abe, Hideyuki Matsui
  • Publication number: 20150314385
    Abstract: A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided. A temporary bonding agent 55 is applied onto multiple substrates 50a, 50b, and a heater 33 heats the substrates while the substrates are temporarily bonded with the temporary bonding agent 55 interposed therebetween, and before the solder 54 is melted or while the solder 54 is melted, the temporary bonding agent 55 is evaporated, and the substrates 50a, 50b are bonded with solder with the melted solder 54 interposed therebetween.
    Type: Application
    Filed: July 15, 2015
    Publication date: November 5, 2015
    Inventors: Hideyuki ABE, Kazuaki MAWATARI
  • Patent number: 9119336
    Abstract: A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided. A temporary bonding agent 55 is applied onto multiple substrates 50a, 50b, and a heater 33 heats the substrates while the substrates are temporarily bonded with the temporary bonding agent 55 interposed therebetween, and before the solder 54 is melted or while the solder 54 is melted, the temporary bonding agent 55 is evaporated, and the substrates 50a, 50b are bonded with solder with the melted solder 54 interposed therebetween.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: August 25, 2015
    Assignee: AYUMI INDUSTRY CO., LTD.
    Inventors: Hideyuki Abe, Kazuaki Mawatari
  • Patent number: 9101995
    Abstract: Provide is an apparatus for thermal melting processes that is capable of directly cooling the process object without requiring a separate cooling plate. The apparatus for thermal melting process according to the present invention is an apparatus 1 for thermal melting process that thermally melts objects 100 including solder in an atmosphere containing carbonic acid vapor, and the hand part 4 for carrying and transferring the thermally melted process objects 100 is used as a cooling plate as well.
    Type: Grant
    Filed: September 12, 2014
    Date of Patent: August 11, 2015
    Assignee: Ayumi Industry Co., Ltd.
    Inventor: Hideyuki Abe
  • Publication number: 20150001282
    Abstract: Provide is an apparatus for thermal melting processes that is capable of directly cooling the process object without requiring a separate cooling plate. The apparatus for thermal melting process according to the present invention is an apparatus 1 for thermal melting process that thermally melts objects 100 including solder in an atmosphere containing carbonic acid vapor, and the hand part 4 for carrying and transferring the thermally melted process objects 100 is used as a cooling plate as well.
    Type: Application
    Filed: September 12, 2014
    Publication date: January 1, 2015
    Applicant: AYUMI INDUSTRY CO., LTD.
    Inventor: Hideyuki Abe
  • Patent number: 8864011
    Abstract: Provide is an apparatus for thermal melting processes that is capable of directly cooling the process object without requiring a separate cooling plate. The apparatus for thermal melting process according to the present invention is an apparatus 1 for thermal melting process that thermally melts objects 100 including solder in an atmosphere containing carbonic acid vapor, and the hand part 4 for carrying and transferring the thermally melted process objects 100 is used as a cooling plate as well.
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: October 21, 2014
    Assignee: Ayumi Industry Co., Ltd.
    Inventor: Hideyuki Abe
  • Publication number: 20140246481
    Abstract: A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided. A temporary bonding agent 55 is applied onto multiple substrates 50a, 50b, and a heater 33 heats the substrates while the substrates are temporarily bonded with the temporary bonding agent 55 interposed therebetween, and before the solder 54 is melted or while the solder 54 is melted, the temporary bonding agent 55 is evaporated, and the substrates 50a, 50b are bonded with solder with the melted solder 54 interposed therebetween.
    Type: Application
    Filed: May 12, 2014
    Publication date: September 4, 2014
    Inventors: Hideyuki ABE, Kazuaki MAWATARI
  • Patent number: 8757474
    Abstract: A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided. A temporary bonding agent 55 is applied onto multiple substrates 50a, 50b, and a heater 33 heats the substrates while the substrates are temporarily bonded with the temporary bonding agent 55 interposed therebetween, and before the solder 54 is melted or while the solder 54 is melted, the temporary bonding agent 55 is evaporated, and the substrates 50a, 50b are bonded with solder with the melted solder 54 interposed therebetween.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: June 24, 2014
    Assignee: Ayumi Industry Co., Ltd.
    Inventors: Hideyuki Abe, Kazuaki Mawatari
  • Patent number: 8481776
    Abstract: The present invention relates to a functional substance-releasing agent containing a silicic acid ester compound represented by formula (1) below, a process for producing the functional substance-releasing agent, and a composition containing the functional substance-releasing agent. wherein R1 represents a residue of an alcohol which results from removal of one hydroxyl group therefrom, the alcohol being selected from a functional alcohol having a log P value of 2.0 or less and an alcohol having a log P value of 2.1 or more, a plurality of R1s may be the same or different, provided that the silicic acid ester compound has, in one molecule, at least one residue resulting from removal of one hydroxyl group from a functional alcohol having a log P value of 2.0 or less and at least one residue resulting from removal of one hydroxyl group from an alcohol having a log P value of 2.1 or more.
    Type: Grant
    Filed: March 12, 2009
    Date of Patent: July 9, 2013
    Assignee: Kao Corporation
    Inventors: Hideyuki Abe, Akiyoshi Kimura, Makiko Shigehisa
  • Publication number: 20130105558
    Abstract: A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided. A temporary bonding agent 55 is applied onto multiple substrates 50a, 50b, and a heater 33 heats the substrates while the substrates are temporarily bonded with the temporary bonding agent 55 interposed therebetween, and before the solder 54 is melted or while the solder 54 is melted, the temporary bonding agent 55 is evaporated, and the substrates 50a, 50b are bonded with solder with the melted solder 54 interposed therebetween.
    Type: Application
    Filed: June 24, 2011
    Publication date: May 2, 2013
    Applicant: AYUMI INDUSTRY CO., LTD.
    Inventors: Hideyuki Abe, Kazuaki Mawatari
  • Patent number: 8420845
    Abstract: Disclosed are: a functional material release agent including 35% to 95% by mass of the silicate ester compound represented by formula (1) and 0% to 40% by mass of the silicate ester compound represented by formula (2); a method for manufacturing the release agent; and compositions containing the release agent. (In the formula, R1 is an aliphatic hydrocarbon group with a total of 4 to 22 carbon atoms, that may contain a phenyl group, a hydroxyl group, or an alkoxy group as a substituent; R2 is the residue of functional alcohol minus one hydroxyl group; and R3 is a hydrogen atom or an alkyl group with one to six carbon atoms.
    Type: Grant
    Filed: February 18, 2009
    Date of Patent: April 16, 2013
    Assignee: Kao Corporation
    Inventors: Hideyuki Abe, Makiko Shigehisa
  • Publication number: 20120299359
    Abstract: There is provided a vehicle seat which includes a pad support which includes a net for supporting a cushion pad, and a wire harness which is wired while being hung on the net via a clip attached to the net in a state of not causing a foreign-body feeling to a seated person.
    Type: Application
    Filed: May 22, 2012
    Publication date: November 29, 2012
    Applicant: TOYOTA BOSHOKU KABUSHIKI KAISHA
    Inventor: Hideyuki ABE
  • Patent number: 8297708
    Abstract: An assembling structure for a vehicle seat includes: an assembly frame having a frame shape and configured to be detachably attached to a seat main body of the vehicle seat, the seat main body having a backbone frame having a frame shape; a planar elastic body configured to elastically support a body of an occupant and is stretched on the assembly frame; an elastic latching unit configured to be detachably attached to a part of the backbone frame, the elastic latching unit formed on a part of a periphery of the assembly frame, wherein the assembly frame further includes a hook portion, the backbone frame further includes a portion to be hooked, and the planar elastic body is prevented from moving in an out-of-plane direction of the planar elastic body when the hook portion of the assembly frame is hooked on the portion to be hooked of the backbone frame.
    Type: Grant
    Filed: April 7, 2010
    Date of Patent: October 30, 2012
    Assignee: Toyota Boshoku Kabushiki Kaisha
    Inventors: Hiroshi Mizobata, Hideyuki Abe
  • Publication number: 20120153010
    Abstract: Provide is an apparatus for thermal melting processes that is capable of directly cooling the process object without requiring a separate cooling plate. The apparatus for thermal melting process according to the present invention is an apparatus 1 for thermal melting process that thermally melts objects 100 including solder in an atmosphere containing carbonic acid vapor, and the hand part 4 for carrying and transferring the thermally melted process objects 100 is used as a cooling plate as well.
    Type: Application
    Filed: August 24, 2010
    Publication date: June 21, 2012
    Inventor: Hideyuki Abe
  • Publication number: 20120133193
    Abstract: A support member has a first part that abuts against a frame member to be engaged with the frame member, and a second part to which an edge of upholstery is attached. The first part and the second part are formed at one side of the support member in a row. The first part is formed by bending a portion of the one side of the support member so as to curve toward a first side of the frame member that is different from a second side of the frame member, at which a cushioning material is arranged. The second part is formed by bending another portion of the one side of the support member so as to curve in the opposite direction from the first part and so as to protrude toward the center of the frame member.
    Type: Application
    Filed: November 9, 2011
    Publication date: May 31, 2012
    Applicant: TOYOTA BOSHOKU KABUSHIKI KAISHA
    Inventors: Hideyuki ABE, Hiroshi MIZOBATA
  • Publication number: 20110028366
    Abstract: Disclosed are: a functional material release agent including 35% to 95% by mass of the silicate ester compound represented by formula (1) and 0% to 40% by mass of the silicate ester compound represented by formula (2); a method for manufacturing the release agent; and compositions containing the release agent. (In the formula, R1 is an aliphatic hydrocarbon group with a total of 4 to 22 carbon atoms, that may contain a phenyl group, a hydroxyl group, or an alkoxy group as a substituent; R2 is the residue of functional alcohol minus one hydroxyl group; and R3 is a hydrogen atom or an alkyl group with one to six carbon atoms.
    Type: Application
    Filed: February 18, 2009
    Publication date: February 3, 2011
    Applicant: KAO CORPORATION
    Inventors: Hideyuki Abe, Makiko Shigehisa
  • Publication number: 20110016636
    Abstract: The present invention provides the textile treatment composition containing (a) the compound represented by the formula (1) and (b1) the fragrance having a logPow value not less than 3.0 and not more than 5.0 at a mass ratio of (a)/(b1)=98/2 to 20/80, and the method for facilitating adsorption of the component (b1) on a textile product by contacting the textile treatment composition with the textile product in water as a medium: (wherein, X represents —OH, —R1 (R1 represents an aliphatic hydrocarbon group having total 1 to 22 carbon atoms that may be substituted with a phenyl, hydroxy, or alkoxy group) or —OR2 (R2 represents a hydrocarbon group having 6 to 22 carbon atoms); Y represents X or —OSi (X) 3; and n is an average number from 0 to 15; a plurality of X and a plurality of Y may be independently same or different, with a proviso that the compound has at least one —OR2 in a molecule.
    Type: Application
    Filed: April 13, 2009
    Publication date: January 27, 2011
    Inventors: Makiko Shigehisa, Noriko Yamaguchi, Hideyuki Abe
  • Publication number: 20110015421
    Abstract: The present invention relates to a functional substance-releasing agent containing a silicic acid ester compound represented by formula (1) below, a process for producing the functional substance-releasing agent, and a composition containing the functional substance-releasing agent. wherein R1 represents a residue of an alcohol which results from removal of one hydroxyl group therefrom, the alcohol being selected from a functional alcohol having a log P value of 2.0 or less and an alcohol having a log P value of 2.1 or more, a plurality of R1s may be the same or different, provided that the silicic acid ester compound has, in one molecule, at least one residue resulting from removal of one hydroxyl group from a functional alcohol having a log P value of 2.0 or less and at least one residue resulting from removal of one hydroxyl group from an alcohol having a log P value of 2.1 or more.
    Type: Application
    Filed: March 12, 2009
    Publication date: January 20, 2011
    Applicant: Kao Corporation
    Inventors: Hideyuki Abe, Akiyoshi Kimura, Makiko Shigehisa
  • Publication number: 20100259089
    Abstract: An assembling structure for a vehicle seat includes: an assembly frame having a frame shape and configured to be detachably attached to a seat main body of the vehicle seat, the seat main body having a backbone frame having a frame shape; a planar elastic body configured to elastically support a body of an occupant and is stretched on the assembly frame; an elastic latching unit configured to be detachably attached to a part of the backbone frame, the elastic latching unit formed on a part of a periphery of the assembly frame, wherein the assembly frame further includes a hook portion, the backbone frame further includes a portion to be hooked, and the planar elastic body is prevented from moving in an out-of-plane direction of the planar elastic body when the hook portion of the assembly frame is hooked on the portion to be hooked of the backbone frame.
    Type: Application
    Filed: April 7, 2010
    Publication date: October 14, 2010
    Applicant: TOYOTA BOSHOKU KABUSHIKI KAISHA
    Inventors: Hiroshi MIZOBATA, Hideyuki ABE