Abstract: A light-emitting device includes: a first light source including a first light-emitting element having a peak emission wavelength in a range of 430 nm to 480 nm; a second light source including a second light-emitting element having a peak emission wavelength in a range of 430 nm to 480 nm; a third light source; and an encapsulant containing a phosphor. In a 1931 CIE chromaticity diagram, the light-emitting device has: a first chromaticity point when only the first light source is operated, a second chromaticity point different from the first chromaticity point when only the second light source is operated, and a third chromaticity point when only the third light source is operated, the third chromaticity point having a y-value larger than a y-value on a straight line passing the first chromaticity point and the second chromaticity point.

Abstract: A light emitting device includes one or more light emitting elements; a first lead on which the one or more light emitting elements are disposed; a second lead electrically connected to the one or more light emitting elements; a resin member supporting the first lead and the second lead, and including one or more projected portions; and a resin frame surrounding the light emitting elements, and covering at least a portion of each of the projected portions.

Abstract: A light-emitting device includes a light-emitting element with a peak emission wavelength in a range of 400 nm to 410 nm and a fluorescent member that contains a first phosphor with a peak emission wavelength in a range of 440 nm to 470 nm containing a Eu-activated alkaline-earth phosphate that contains Cl in a composition, a second phosphor with a peak emission wavelength in a range of 500 nm to 530 nm containing a Eu-activated halogen-containing alkaline-earth silicate, a third phosphor with a peak emission wavelength in a range of 530 nm to 600 nm containing a Ce-activated rare-earth aluminate, and a fourth phosphor with a peak emission wavelength in a range of 600 nm to 660 nm containing a Eu-activated silicon nitride containing Al and at least one of Sr and Ca in a composition.

Abstract: A light emitting device includes: a base comprising a first lead, a second lead, and a supporting member; a light emitting element mounted on the first lead; a protection element mounted on the second lead; a wire including a first end and a second end, wherein the first end is connected to an upper surface of the first lead, and the second end is connected to a first terminal electrode of the protection element; a resin frame located on an upper surface of the base, wherein the resin frame covers at least part of the protection element and surrounds the light emitting element and the first end of the wire; a first resin member surrounded by the resin frame and covering the light emitting element and the first end of the wire; and a second resin member covering the resin frame and the first resin member.

Abstract: A light-emitting device includes a light-emitting element with a peak emission wavelength in a range of 400 nm to 410 nm and a fluorescent member that contains a first phosphor with a peak emission wavelength in a range of 440 nm to 470 nm containing a Eu-activated alkaline-earth phosphate that contains Cl in a composition, a second phosphor with a peak emission wavelength in a range of 500 nm to 530 nm containing a Eu-activated halogen-containing alkaline-earth silicate, a third phosphor with a peak emission wavelength in a range of 530 nm to 600 nm containing a Ce-activated rare-earth aluminate, and a fourth phosphor with a peak emission wavelength in a range of 600 nm to 660 nm containing a Eu-activated silicon nitride containing Al and at least one of Sr and Ca in a composition.

Abstract: A light emitting device includes: a base member including: a first lead, a second lead, and a resin member supporting the first lead and the second lead, wherein each of a surface of the first lead that includes a first surface, a surface of the second lead, and a surface of the resin member that includes a second surface are positioned at an upper surface of the base member; a light emitting element located at the surface of the first lead that forms a portion of the upper surface of the base member; a resin frame located at the upper surface of the base member so as to surround the light emitting element, and configured such that the first surface and at least a portion of the second surface are exposed inward of the resin frame; and a reflective member covering at least a portion of the second surface.

Abstract: A light emitting device includes: a base comprising a first lead, a second lead, and a supporting member; a light emitting element mounted on the first lead; a protection element mounted on the second lead; a wire including a first end and a second end, wherein the first end is connected to an upper surface of the first lead, and the second end is connected to a first terminal electrode of the protection element; a resin frame located on an upper surface of the base, wherein the resin frame covers at least part of the protection element and surrounds the light emitting element and the first end of the wire; a first resin member surrounded by the resin frame and covering the light emitting element and the first end of the wire; and a second resin member covering the resin frame and the first resin member.

Abstract: A light emitting device includes a plurality of light emitting elements and a package. The package includes two metal parts on which the plurality of light emitting elements are disposed, and a resin body securing the two metal parts. The resin body has four sides and four connecting parts alternately connected to one another in a top view. Two subsequent sides are perpendicular to each other. Each of the two metal parts includes a die-pad on which one or more of the plurality of light emitting elements are disposed, and two extending portions extending from the die-pad. An end portion of each of the two extending portions is extended laterally outward from a respective one of the connecting parts of the resin body, and the end portion of each of the two extending portions is located inward of virtual extension lines of corresponding two sides of the resin body.

Abstract: A light emitting device includes a base member, a light emitting element, a wire, a protective film, first and second resin members, and a light shielding portion. The base member has a conductive member. The wire connects the light emitting element and the conductive member. The protective film covers the conductive member to be spaced apart from a portion of a connecting portion. The first resin member continuously covers at least a portion of each of the protective film, a portion of the conductive member around the connecting portion, and the wire. The first resin member contains first light reflecting particles to reflect light emitted by the light emitting element. The second resin member covers the light emitting element and the first resin member. The light shielding portion is disposed on the base member and disposed on a line connecting the light emitting element and the first resin member.

Abstract: A light emitting device includes: a base member including: a first lead, a second lead, and a supporting member, the base member having an upper surface including a first surface, which is a surface of the first lead, a second surface, which is a surface of the second lead, and a third surface, which is a surface of the supporting member; a light emitting element located on the first surface; a protective element located on the second surface; a wire having a first end connected to the first surface, and a second end connected to a terminal electrode of the protective element; a resin frame located on the upper surface of the base member; a first resin part surrounded by the resin frame and covering the light emitting element and the first end of the wire; and a second resin part covering the resin frame and the first resin part.

Abstract: A light-emitting device includes a light-emitting element with a peak emission wavelength in a range of 400 nm to 410 nm and a fluorescent member that contains a first phosphor with a peak emission wavelength in a range of 440 nm to 470 nm containing a Eu-activated alkaline-earth phosphate that contains Cl in a composition, a second phosphor with a peak emission wavelength in a range of 500 nm to 530 nm containing a Eu-activated halogen-containing alkaline-earth silicate, a third phosphor with a peak emission wavelength in a range of 530 nm to 600 nm containing a Ce-activated rare-earth aluminate, and a fourth phosphor with a peak emission wavelength in a range of 600 nm to 660 nm containing a Eu-activated silicon nitride containing Al and at least one of Sr and Ca in a composition.

Abstract: A light emitting device includes a base member, a light emitting element, a wire, a protective film, first and second resin members, and a light shielding portion. The base member has a conductive member. The wire connects the light emitting element and the conductive member. The protective film covers the conductive member to be spaced apart from a portion of a connecting portion. The first resin member continuously covers at least a portion of each of the protective film, a portion of the conductive member around the connecting portion, and the wire. The first resin member contains first light reflecting particles to reflect light emitted by the light emitting element. The second resin member covers the light emitting element and the first resin member. The light shielding portion is disposed on the base member and disposed on a line connecting the light emitting element and the first resin member.

Abstract: Provided is a light emitting device with improved light extracting efficiency and further higher heat releasing performance. A light emitting device includes a planar lead frame having a first lead and a second lead, and includes a light emitting element mounted on the first lead, a resin frame surrounding a periphery of the light emitting element, a first sealing resin filled in the inner side of the resin frame and sealing the light emitting element, and a second sealing resin covering the resin frame and the first sealing resin. Lower end of inner surface of the resin frame is arranged only on the first lead, and at an outside of the resin frame, and the second resin member covers at least a part of the first lead and the second lead. Of the back-surface of the first lead, a region directly under the blight emitting element is exposed.

Abstract: A light emitting device includes: a base comprising a first lead, a second lead, and a supporting member; a light emitting element mounted on the first lead; a protection element mounted on the second lead; a wire including a first end and a second end, wherein the first end is connected to an upper surface of the first lead, and the second end is connected to a first terminal electrode of the protection element; a resin frame located on an upper surface of the base, wherein the resin frame covers at least part of the protection element and surrounds the light emitting element and the first end of the wire; a first resin member surrounded by the resin frame and covering the light emitting element and the first end of the wire; and a second resin member covering the resin frame and the first resin member.

Abstract: A light emitting device includes a base member, a light emitting element, a wire, a protective film, first and second resin members, and a light shielding portion. The base member has a conductive member. The wire connects the light emitting element and the conductive member. The protective film covers the conductive member to be spaced apart from a portion of a connecting portion. The first resin member has a first gas barrier property with respect to hydrogen sulfide and a first light resistance. The second resin member has a second gas barrier property with respect to hydrogen sulfide lower than the first gas barrier property and a second light resistance higher than the first light resistance. The light shielding portion is disposed on a surface of the base member and disposed on a line connecting the light emitting element and the first resin member.

Abstract: A light emitting device includes a base member, a light emitting element, a wire, a protective film, first and second resin members, and a light shielding portion. The base member has a conductive member. The wire connects the light emitting element and the conductive member. The protective film covers the conductive member to be spaced apart from a portion of a connecting portion. The first resin member has a first gas barrier property with respect to hydrogen sulfide and a first light resistance. The second resin member has a second gas barrier property with respect to hydrogen sulfide lower than the first gas barrier property and a second light resistance higher than the first light resistance. The light shielding portion is disposed on a surface of the base member and disposed on a line connecting the light emitting element and the first resin member.

Abstract: A light emitting device includes one or more light emitting elements; a first lead on which the one or more light emitting elements are disposed; a second lead electrically connected to the one or more light emitting elements; a resin member supporting the first lead and the second lead, and including one or more projected portions; and a resin frame surrounding the light emitting elements, and covering at least a portion of each of the projected portions.

Abstract: A light emitting device includes a base member including a conductive member; a light mining element arranged on the base member, the light emitting element having a first surface, a second surface opposing the first surface, and at least one lateral surface between the first surface and the second surface; a die-bonding resin bonding the base member and the second surface; a first protective film continuously covering the base member, the die-bonding resin, the at least one lateral surface, and the first surface; and a second protective film continuously covering the base member, the die-bonding resin, the at least one lateral surface and the first surface of the light emitting element, over the first protective film, the second protective film having a linear expansion coefficient that is smaller than a linear expansion coefficient of the die-bonding resin and larger than a linear expansion coefficient of the first protective film.

Abstract: A light emitting device includes a base member including a conductive member containing silver. A light emitting element has an upper surface below an upper surface of a side wall portion. A wire electrically connects the light emitting element and the conductive member. A protective film covers the conductive member to be spaced apart from at least a part of at least one connecting portion connecting the wire and the conductive member. A first resin member continuously covers at least a portion of each of the protective film, a portion of the conductive member around the connecting portion, and the wire. The first resin member has a first gas barrier property with respect to hydrogen sulfide. A second resin member covers the light emitting element and the first resin member and has a second gas barrier property with respect to hydrogen sulfide lower than the first gas barrier property.

Abstract: Provided is a light emitting device with improved light extracting efficiency and further higher heat releasing performance. A light emitting device includes a planar lead frame having a first lead and a second lead, and includes a light emitting element mounted on the first lead, a resin frame surrounding a periphery of the light emitting element, a first sealing resin filled in the inner side of the resin frame and sealing the light emitting element, and a second sealing resin covering the resin frame and the first sealing resin. Lower end of inner surface of the resin frame is arranged only on the first lead, and at an outside of the resin frame, and the second resin member covers at least a part of the first lead and the second lead. Of the back-surface of the first lead, a region directly under the blight emitting element is exposed.