Abstract: Provided is a light emitting device with improved light extracting efficiency and further higher heat releasing performance. A light emitting device includes a planar lead frame having a first lead and a second lead, and includes a light emitting element mounted on the first lead, a resin frame surrounding a periphery of the light emitting element, a first sealing resin filled in the inner side of the resin frame and sealing the light emitting element, and a second sealing resin covering the resin frame and the first sealing resin. Lower end of inner surface of the resin frame is arranged only on the first lead, and at an outside of the resin frame, and the second resin member covers at least a part of the first lead and the second lead. Of the back-surface of the first lead, a region directly under the blight emitting element is exposed.

Abstract: A light emitting device includes a base member including a conductive member containing silver. A light emitting element has an upper surface below an upper surface of a side wall portion. A wire electrically connects the light emitting element and the conductive member. A protective film covers the conductive member to be spaced apart from at least a part of at least one connecting portion connecting the wire and the conductive member. A first resin member continuously covers at least a portion of each of the protective film, a portion of the conductive member around the connecting portion, and the wire. The first resin member has a first gas barrier property with respect to hydrogen sulfide. A second resin member covers the light emitting element and the first resin member and has a second gas barrier property with respect to hydrogen sulfide lower than the first gas barrier property.

Abstract: Provided is a light emitting device that reduces color unevenness between a plurality of light emitting elements. A light emitting device 1 includes a base substrate 10, a first frame body 11 disposed at an upper surface 10a of the base substrate 10, and a second frame body 12 disposed at the upper surface 10a of the base substrate 10 and surrounding the first frame body 11 while being spaced away from the first frame body 11. A plurality of light emitting elements 2 is disposed within a region surrounded by the first frame body 11. A first sealing resin 21 is disposed within the region surrounded by the first frame body 11 to cover the light emitting elements 2. The first sealing resin 21 includes a wavelength conversion member that converts a wavelength of light emitted from the light emitting elements 2. A second sealing resin 22 is disposed within the region surrounded by the second frame body 12 to cover the first sealing resin 21.

Abstract: A light emitting device includes a base member including a conductive member; a light mining element arranged on the base member, the light emitting element having a first surface, a second surface opposing the first surface, and at least one lateral surface between the first surface and the second surface; a die-bonding resin bonding the base member and the second surface; a first protective film continuously covering the base member, the die-bonding resin, the at least one lateral surface, and the first surface; and a second protective film continuously covering the base member, the die-bonding resin, the at least one lateral surface and the first surface of the light emitting element, over the first protective film, the second protective film having a linear expansion coefficient that is smaller than a linear expansion coefficient of the die-bonding resin and larger than a linear expansion coefficient of the first protective film.

Abstract: Provided is a light emitting device that reduces color unevenness between a plurality of light emitting elements. A light emitting device 1 includes a base substrate 10, a first frame body 11 disposed at an upper surface 10a of the base substrate 10, and a second frame body 12 disposed at the upper surface 10a of the base substrate 10 and surrounding the first frame body 11 while being spaced away from the first frame body 11. A plurality of light emitting elements 2 is disposed within a region surrounded by the first frame body 11. A first sealing resin 21 is disposed within the region surrounded by the first frame body 11 to cover the light emitting elements 2. The first sealing resin 21 includes a wavelength conversion member that converts a wavelength of light emitted from the light emitting elements 2. A second sealing resin 22 is disposed within the region surrounded by the second frame body 12 to cover the first sealing resin 21.

Abstract: Provided is a light emitting device with improved light extracting efficiency and further higher heat releasing performance. A light emitting device includes a planar lead frame having a first lead and a second lead, and includes a light emitting element mounted on the first lead, a resin frame surrounding a periphery of the light emitting element, a first sealing resin filled in the inner side of the resin frame and sealing the light emitting element, and a second sealing resin covering the resin frame and the first sealing resin. Lower end of inner surface of the resin frame is arranged only on the first lead, and at an outside of the resin frame, and the second resin member covers at least a part of the first lead and the second lead. Of the back-surface of the first lead, a region directly under the blight emitting element is exposed.

Abstract: Provided is a light emitting device with improved light extracting efficiency and further higher heat releasing performance. A light emitting device includes a planar lead frame having a first lead and a second lead, and includes a light emitting element mounted on the first lead, a resin frame surrounding a periphery of the light emitting element, a first sealing resin filled in the inner side of the resin frame and sealing the light emitting element, and a second sealing resin covering the resin frame and the first sealing resin. Lower end of inner surface of the resin frame is arranged only on the first lead, and at an outside of the resin frame, and the second resin member covers at least a part of the first lead and the second lead. Of the back-surface of the first lead, a region directly under the blight emitting element is exposed.

Abstract: Provided is a light emitting device with improved light extracting efficiency and further higher heat releasing performance. A light emitting device includes a planar lead frame having a first lead and a second lead, and includes a light emitting element mounted on the first lead, a resin frame surrounding a periphery of the light emitting element, a first sealing resin filled in the inner side of the resin frame and sealing the light emitting element, and a second sealing resin covering the resin frame and the first sealing resin. Lower end of inner surface of the resin frame is arranged only on the first lead, and at an outside of the resin frame, and the second resin member covers at least a part of the first lead and the second lead. Of the back-surface of the first lead, a region directly under the blight emitting element is exposed.

Abstract: The present invention provides a light emitting device which has high reliability and long service life by suppressing the sealing resin from peeling off the inner edge of the opening of the recess of the housing.

Abstract: The present invention provides a semiconductor device capable of preventing an adhesive for die bonding from flowing to wire bonding area.

Abstract: The present invention provides a light emitting device which has high reliability and long service life by suppressing the sealing resin from peeling off the inner edge of the opening of the recess of the housing.

Abstract: The present invention provides a semiconductor device capable of preventing an adhesive for die bonding from flowing to wire bonding area.