Patents by Inventor Hiroki Goto

Hiroki Goto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11512370
    Abstract: This free-cutting copper alloy contains Cu: 58.5 to 63.5%, Si: more than 0.4% and 1.0% or less, Pb: 0.003 to 0.25%, and P: 0.005 to 0.19%, with the remainder being Zn and inevitable impurities, a total amount of Fe, Mn, Co and Cr is less than 0.40%, a total amount of Sn and Al is less than 0.40%, a relationship of 56.3?f1=[Cu]?4.7×[Si]+0.5×[Pb]?0.5×[P]?59.3 is satisfied, constituent phases of a metal structure have relationships of 20?(?)?75, 25?(?)?80, 0?(?)<2, 20?(?)1/2×3+(?)×(?0.5×([Si])2+1.5×[Si])?78, and 33?(?)1/2×3+(?)×(?0.5×([Si])2+1.5×[Si])+([Pb])1/2×33+([P])1/2×14, and a compound including P is present in ? phase.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: November 29, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
  • Publication number: 20220362661
    Abstract: A controller includes a key top, a substrate, and an elastic member. The elastic member includes a pressed portion, a base, a skirt portion, and a pressing member. The substrate includes a contact. When viewed in the first direction, the pressing member is surrounded by an outer peripheral edge of a prescribed region. In the second direction, a distance between an end of the outer peripheral edge of the prescribed region on a side of a swing center of the key top and an end of a top surface on the side of the swing center is longer than a distance between an end of the outer peripheral edge of the prescribed region opposite to the swing center and an end of the top surface opposite to the swing center. In the second direction, the contact is located closer to the swing center than the top surface.
    Type: Application
    Filed: September 1, 2021
    Publication date: November 17, 2022
    Inventors: Kazuki EBIHARA, Hiroki GOTO, Noboru WAKITANI
  • Publication number: 20220340134
    Abstract: A vehicle includes a traveling information acquiring device configured to recognize a first vehicle that travels in the same lane as the vehicle and in front of the vehicle, recognize a second vehicle that travels in the same lane as the vehicle and travels in front of the first vehicle and acquire traveling information of the first vehicle and the second vehicle; and a control device configured to control the behavior of the vehicle acceleration or deceleration based on a vehicle speed difference between a vehicle speed of the first vehicle and the vehicle speed of the second vehicle when the second vehicle is recognized during the execution of the follow-up control that controls the vehicle speed of the vehicle and adjusts the distance between the vehicle and the first vehicle.
    Type: Application
    Filed: February 28, 2022
    Publication date: October 27, 2022
    Inventor: Hiroki GOTO
  • Patent number: 11479834
    Abstract: This free-cutting copper alloy includes Cu: more than 61.0% and less than 65.0%, Si: more than 1.0% and less than 1.5%, Pb: 0.003% to less than 0.20%, and P: more than 0.003% and less than 0.19%, with the remainder being Zn and unavoidable impurities, a total content of Fe, Mn, Co, and Cr is less than 0.40%, a total content of Sn and Al is less than 0.40%, a relationship of 56.5?f1=[Cu]?4.5×[Si]+0.5×[Pb]?[P]?59.5 is satisfied, constituent phases of a metallographic structure have relationships of 20?(?)?80, 15?(?)?80, 0?(?)<8, 18×(?)/(?)<9, 20?(?)1/2×3+(?)×([Si])1/2?88, and 33?(?)1/2×3+(?)×([Si])1/2+([Pb])1/2×35+([P])1/2×15, and a compound including P is present in ? phase.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: October 25, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
  • Publication number: 20220275479
    Abstract: This copper alloy casting includes, in terms of mass %: Cu: higher than 58.5% and lower than 65.0%; Si: higher than 0.40% and lower than 1.40%; Pb: higher than 0.002% and lower than 0.25%; P: higher than 0.003% and lower than 0.19%; and Bi: 0.001% to 0.100% as an optional element, with the balance being Zn and inevitable impurities, the total content of Fe, Mn, Co, and Cr is lower than 0.45% and the total content of Sn and Al is lower than 0.45%, a relationship of 56.0?f1=[Cu]?5×[Si]+0.5×[Pb]+0.5×[Bi]?0.5×[P]?59.5 is satisfied, when Bi is included, a relationship of 0.003<f0=[Pb]+[Bi]<0.25 is further satisfied.
    Type: Application
    Filed: February 17, 2020
    Publication date: September 1, 2022
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
  • Patent number: 11421302
    Abstract: This free-cutting copper alloy comprises 76.0-78.7% Cu, 3.1-3.6% Si, 0.40-0.85% Sn, 0.05-0.14% P, and at least 0.005% to less than 0.020% Pb, with the remainder comprising Zn and inevitable impurities. The composition satisfies the following relations: 75.0?f1=Cu+0.8×Si?7.5×Sn+P+0.5×Pb?78.2; 60.0?f2=Cu?4.8×Si?0.8×Sn?P+0.5×Pb?61.5; and 0.09?f3=P/Sn?0.30. The area percentage (%) of respective constituent phases satisfies the following relations: 30???65; 0???2.0; 0???0.3; 0???2.0; 96.5?f4=?+?; 99.4?f5=?+?+?+?; 0?f6=?+??3.0; and 35?f7=1.05×?+6×?1/2+0.5×??70. ? phase is present in ? phase, the long side of the ? phase is at most 50 ?m, and the long side of the ? phase is at most 25 ?m.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: August 23, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto, Shinji Tanaka
  • Patent number: 11422299
    Abstract: An electronic device includes a housing, a display, a light source, a light guide plate, and a mark portion. The light source is provided inside the housing and below the display. The mark portion is provided in the rear surface of the housing and includes a portion that shines as light from the light source passes therethrough. A lower end of the mark portion is defined as a first end and an upper end of the mark portion is defined as a second end. When viewed in a direction from the rear surface toward the front surface, the light source is located between the first end and the second end, and a distance from the second end to the light source is longer than a distance from the first end to the light source.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: August 23, 2022
    Assignee: Nintendo Co., Ltd.
    Inventors: Kazuki Ebihara, Fumihiko Inoue, Shinji Yamamoto, Hiroki Goto, Noboru Wakitani
  • Publication number: 20220259711
    Abstract: This free-cutting copper alloy contains Cu: more than 57.5% but less than 64.5%, Si: more than 0.20% but less than 1.20%, Pb: more than 0.001% but less than 0.20%, Bi: more than 0.10% but less than 1.00%, and P: more than 0.001% but less than 0.20%, with the balance being Zn and unavoidable impurities, wherein the total amount of Fe, Mn, Co and Cr is less than 0.45%, the total amount of Sn and Al is less than 0.45%, relationships of 56.3?f1=[Cu]?4.8×[Si]+0.5×[Pb]+0.5×[Bi]?0.5×[P]?59.5 and 0.12?f2=[Pb]+[Bi]<1.0 are satisfied.
    Type: Application
    Filed: March 16, 2020
    Publication date: August 18, 2022
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
  • Publication number: 20220206145
    Abstract: A first optical path length from an emission surface of a first optical system to a reflection surface of a target object is calculated on the basis of first reflected light received by the first optical system and reference light generated by a splitter. A second optical path length from an emission surface of the second optical system to a reflection surface of a reflector is calculated on the basis of second reflected light reflected by the reflector and received by the second optical system and the reference light generated by the splitter A refractive index of a space is calculated on the basis of the second optical path length, and a distance from the emission surface of the first optical system to the reflection surface of the target object is calculated on the basis of the refractive index and the first optical path length.
    Type: Application
    Filed: March 17, 2022
    Publication date: June 30, 2022
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takanori YAMAUCHI, Hiroki GOTO, Kiyoshi ONOHARA, Naoki SUZUKI
  • Publication number: 20220186352
    Abstract: This free-cutting copper alloy includes Cu: more than 58.0% and less than 65.0%, Si: more than 0.30% and less than 1.30%, Pb: more than 0.001% and 0.20% or less, Bi: more than 0.020% and 0.10% or less, and P: more than 0.001% and less than 0.20%, with the remainder being Zn and unavoidable impurities, a total amount of Fe, Mn, Co and Cr is less than 0.45%, a total amount of Sn and Al is less than 0.45%, relationships of 56.5?[Cu]?4.7×[Si]+0.5×[Pb]+0.5×[Bi]?0.5×[P]?59.5, and 0.025?[Pb]+[Bi]<0.25 are satisfied, in constituent phases of a metallographic structure, relationships of 20?(?)<85, 15<(?)?80, 0?(?)<5, 8.0?([Bi]+[Pb]?0.002)1/2×10+([P]?0.001)1/2×5+((?)?7)1/2×([Si]?0.1)1/2×1.2+(?)1/2×0.5?17.0, and 0.9?([Bi]+[Pb]?0.002)1/2×((?)?7)1/2×([Si]?0.1)1/2?4.0 are satisfied, and a particle containing Bi is present in ? phase.
    Type: Application
    Filed: December 23, 2019
    Publication date: June 16, 2022
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
  • Patent number: 11346651
    Abstract: The optical distance measurement device is configured in such a manner that the frequency-swept light output unit outputs frequency-swept light during a time period from when frequency sweeping of frequency-swept light being output is completed to when the next frequency sweeping becomes possible, the frequency-swept light output during the time period being frequency swept at a different frequency from the frequency-swept light being output.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: May 31, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kiyoshi Onohara, Hiroki Goto, Naoki Suzuki
  • Patent number: 11318691
    Abstract: A mold includes: a first molding surface configured to form a lens surface of a scanning lens being elongated in a main-scanning direction; and a first coolant passage, which is disposed within the mold and through which a coolant to control the temperature of the first molding surface flows, wherein the first coolant passage includes: a first passage portion corresponding to a first lens portion which is a portion protruding most in an optical axis direction in the lens surface; and a second passage portion corresponding to a second lens portion which is a portion retreated most in the optical axis direction in the lens surface, and the second passage portion is located to be closer to the second lens portion than a virtual plane, which passes through the first passage portion and is orthogonal to the optical axis direction.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: May 3, 2022
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Yasuomi Jibu, Hiroki Goto
  • Patent number: 11285893
    Abstract: An electric wire includes a core wire made of a conductive metal, and an insulating covering that covers an outer circumference of the core wire. A part of at least one of the core wire and the insulating covering is formed with a flat part flatter than a rest of the at least one of the core wire and the insulating covering.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: March 29, 2022
    Assignee: YAZAKI CORPORATION
    Inventor: Hiroki Goto
  • Publication number: 20220090249
    Abstract: This free-cutting copper alloy includes Cu: more than 61.0% and less than 65.0%, Si: more than 1.0% and less than 1.5%, Pb: 0.003% to less than 0.20%, and P: more than 0.003% and less than 0.19%, with the remainder being Zn and unavoidable impurities, a total content of Fe, Mn, Co, and Cr is less than 0.40%, a total content of Sn and Al is less than 0.40%, a relationship of 56.5?f1=[Cu]?4.5×[Si]+0.5×[Pb]?[P]?59.5 is satisfied, constituent phases of a metallographic structure have relationships of 20?(?)?80, 15?(?)?80, 0?(?)<8, 18×(?)/(?)<9, 20?(?)1/2×3+(?)×([Si])1/2?88, and 33?(?)1/2×3+(?)×([Si])1/2+([Pb])1/2×35+([P])1/2×15, and a compound including P is present in ? phase.
    Type: Application
    Filed: December 11, 2019
    Publication date: March 24, 2022
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
  • Patent number: 11248902
    Abstract: An optical distance measurement device includes: a photodetector including PDs for receiving interference light output from an optical interference unit and outputting detection signals of the interference light; and a switch for selecting one of the detection signals output from the PDs, in which a distance calculation unit calculates a distance to a measurement object on the basis of the detection signal selected by the switch.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: February 15, 2022
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hiroki Goto, Yoshihiro Matsumoto, Kiyoshi Onohara, Naoki Suzuki, Takayuki Yanagisawa
  • Publication number: 20220042141
    Abstract: This free-cutting copper alloy contains Cu: 58.5 to 63.5%, Si: more than 0.4% and 1.0% or less, Pb: 0.003 to 0.25%, and P: 0.005 to 0.19%, with the remainder being Zn and inevitable impurities, a total amount of Fe, Mn, Co and Cr is less than 0.40%, a total amount of Sn and Al is less than 0.40%, a relationship of 56.3?f1=[Cu]?4.7×[Si]+0.5×[Pb]?0.5×[P]?59.3 is satisfied, constituent phases of a metal structure have relationships of 20?(?)?75, 25?(?)?80, 0?(?)<2, 20?(?)1/2×3+(?)×(?0.5×([Si])2+1.5×[Si])?78, and 33?(?)1/2×3+(?)×(?0.5×([Si])2+1.5×[Si])+([Pb])1/2×33+([P])1/2×14, and a compound including P is present in ? phase.
    Type: Application
    Filed: December 11, 2019
    Publication date: February 10, 2022
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
  • Publication number: 20210396880
    Abstract: An optical distance measurer includes: a beam splitter splitting a laser beam and outputting as measurement light and reference light; a measurement light beam splitter splitting the measurement light and outputting as first measurement light and second measurement light; a reference light beam splitter splitting the reference light and outputting as first reference light and second reference light; a first optical system having a first Rayleigh length, the first optical system emitting the first measurement light to a target object; and a second optical system having a second Rayleigh length different from the first Rayleigh length, the second optical system emitting the second measurement light to the target object; a first receiver receiving the first reference light and first reflection light that is the first measurement light reflected by the target object and outputting a first receiving signal indicating the first reference light and the first reflection light; and a second receiver receiving the seco
    Type: Application
    Filed: September 1, 2021
    Publication date: December 23, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takanori YAMAUCHI, Hiroki GOTO, Tsuyoshi YOSHIDA, Kiyoshi ONOHARA, Naoki SUZUKI
  • Patent number: 11155909
    Abstract: This high-strength free-cutting copper alloy comprises 75.4-78.0% Cu, 3.05-3.55% Si, 0.05-0.13% P and 0.005-0.070% Pb, with the remainder comprising Zn and inevitable impurities, wherein the amount of Sn existing as inevitable impurities is at most 0.05%, the amount of Al is at most 0.05%, and the total amount of Sn and Al is at most 0.06%. The composition satisfies the following relations: 78.0?f1=Cu+0.8×Si+P+Pb?80.8; and 60.2?f2=Cu?4.7×Si?P+0.5×Pb?61.5. The area percentage (%) of respective constituent phases satisfies the following relations: 29???60; 0???0.3; ?=0; 0???1.0; 98.6?f3=?+?; 99.7?f4=?+?+?+?; 0?f5=?+??1.2; and 30?f6=?+6×?1/2+0.5×??62. The long side of the ? phase is at most 25 ?m, the long side of the ? phase is at most 20 ?m, and the ? phase is present within the ? phase.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: October 26, 2021
    Assignee: Mitsubishi Materials Corporation
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
  • Patent number: 11131009
    Abstract: This high-strength free-cutting copper alloy comprises 75.4-78.0% Cu, 3.05-3.55% Si, 0.05-0.13% P and 0.005-0.070% Pb, with the remainder comprising Zn and inevitable impurities, wherein the amount of Sn existing as inevitable impurities is at most 0.05%, the amount of Al is at most 0.05%, and the total amount of Sn and Al is at most 0.06%. The composition satisfies the following relations: 78.0?f1=Cu+0.8×Si+P+Pb?80.8; and 60.2?f2=Cu?4.7×Si?P+0.5×Pb?61.5. The area percentage (%) of respective constituent phases satisfies the following relations: 29???60; 0???0.3; ?=0; 0???1.0; 98.6?f3=?+?; 99.7?f4=?+?+?+?; 0?f5=?+??1.2; and 30?f6=?+6×?1/2+0.5×??62. The long side of the ? phase is at most 25 ?m, the long side of the ? phase is at most 20 ?m, and the ? phase is present within the ? phase.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: September 28, 2021
    Assignee: Mitsubishi Materials Corporation
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
  • Patent number: D958251
    Type: Grant
    Filed: October 2, 2020
    Date of Patent: July 19, 2022
    Assignee: Nintendo Co., Ltd.
    Inventors: Hiroki Goto, Fumihiko Inoue, Shinji Yamamoto