Patents by Inventor Hiroki Tanaka

Hiroki Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11983495
    Abstract: An evaluation device includes a first calculation unit configured to calculate feature quantities of respective words, the feature quantities corresponding to text data in which a target of any goal of the SDGs is described and text data in which an outline of one or more first services for which a contribution to the goal that is clear is described, a generation unit configured to generate a sentence feature matrix based on the feature quantities of the respective words, a second calculation unit configured to calculate, when text data in which an outline of a second service is described is input, feature quantities of respective words, and an evaluation unit configured to evaluate a degree of a contribution of the second service to the goal based on the feature quantities of the respective words relevant to the second service and the sentence feature matrix.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: May 14, 2024
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Takashi Furutani, Machiko Shinozuka, Xiaoxi Zhang, Hiroki Oka, Katsuya Hayashi, Yuriko Tanaka
  • Patent number: 11982961
    Abstract: A fixing device includes an endless belt, a rotatable pressing member, a pad member inside of the belt, and a sliding member held by the pad member and sliding on an inner circumferential surface of the belt in a nip. The rotatable pressing member nips and feeds a recording material in the nip in cooperation with the belt and fixes a toner image on the recording material by applying heat and pressure. The sliding member includes a base material layer on which a plurality of projections projecting toward the rotatable pressing member are formed on a side sliding with the belt and a sliding layer provided on an outer surface of the plurality of projections. A shape of a surface of the sliding layer is a curved surface and a radius of curvature R of the curved surface satisfies 300 ?m?R?850 ?m.
    Type: Grant
    Filed: February 9, 2023
    Date of Patent: May 14, 2024
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hiroki Kawai, Yasuharu Toratani, Hiroshi Miyamoto, Akiyoshi Shinagawa, Ayano Ogata, Daigo Matsuura, Misa Kawashima, Masanobu Tanaka, Asuna Fukamachi
  • Publication number: 20240152004
    Abstract: A display device (1) includes a light-emitting device (10), a reflective liquid crystal element (20), and an optical member (30). The light-emitting device (10) includes a plurality of light-emitting units (142) and a light-transmitting unit (144) located between the light-emitting units (142) adjacent to each other. The light-emitting device (10) is located between the reflective liquid crystal element (20) and the optical member (30). The plurality of light-emitting units (142) emit light toward the reflective liquid crystal element (20). The light emitted from the plurality of light-emitting units (142) is reflected by the reflective liquid crystal element (20), transmitted through the light-emitting unit (142) of the light-emitting device (10), and formed into an image by the optical member (30).
    Type: Application
    Filed: January 12, 2024
    Publication date: May 9, 2024
    Inventors: Shinsuke TANAKA, Noriaki WAKI, Katsuhiro KANAUCHI, Hiroki TAN
  • Publication number: 20240149252
    Abstract: An object of the present invention is to provide an exhaust gas purifying catalyst composition and an exhaust gas purifying catalyst, each of which has improved exhaust gas purification performance, and the present invention provides an exhaust gas purifying catalyst composition containing a Ce-based oxide particle, a Ce—Zr-based composite oxide particle, and a noble metal element, wherein the Ce-based oxide particle contains at least one type of additional element selected from Al, Mg, La, Pr, Y, and Nd, and wherein an amount of the at least one type of additional element in terms of oxide in the Ce-based oxide particle is 0.1% by mass or more and 20% by mass or less based on a mass of the Ce-based oxide particle.
    Type: Application
    Filed: March 1, 2022
    Publication date: May 9, 2024
    Inventors: Itaru MORITA, Hiroki TANAKA, Yuki NAGAO, Yoshinori ENDO
  • Patent number: 11976859
    Abstract: A refrigeration cycle apparatus includes a refrigeration cycle, an adsorption section, and a first bypass flow path. The refrigeration cycle includes a compressor, a radiator, an expansion mechanism, and an evaporator, and uses a non-azeotropic refrigerant mixture including a first refrigerant and a second refrigerant. The adsorption section includes an adsorbent and stores the first refrigerant adsorbed by the adsorbent. The adsorbent adsorbs the first refrigerant, and does not adsorb the second refrigerant or the adsorption performance thereof for the second refrigerant is lower than the adsorption performance thereof for the first refrigerant. The first bypass flow path connects a first end which is a high-pressure part of the refrigeration cycle and a second end which is a low-pressure part of the refrigeration cycle. The adsorption section and a valve are disposed in the first bypass flow path.
    Type: Grant
    Filed: September 29, 2023
    Date of Patent: May 7, 2024
    Assignee: Daikin Industries, Ltd.
    Inventors: Hiroki Ueda, Atsushi Yoshimi, Eiji Kumakura, Masaki Tanaka, Masaki Nakayama, Ryuhei Kaji
  • Patent number: 11975379
    Abstract: A hot press forming die includes a die main body (2) made of alloy tool steel, and a number of forming projections (3) projecting on the die main body and configured to form a forming surface (5) that comes into contact with a heated metal plate material that is an object to be formed and form a refrigerant passage through which a cooling medium flows. The die main body includes a first forming portion (14) in which the forming surface is formed to extend in a direction intersecting a forming direction of the metal plate material, a second forming portion (15) in which the forming surface is formed to extend in the forming direction, and a third forming portion (16) configured to connect the first forming portion and the second forming portion such that the forming surface becomes a convex surface. The forming projection provided on the third forming portion is formed to be a projecting strip extending between the first forming portion and the second forming portion.
    Type: Grant
    Filed: December 14, 2022
    Date of Patent: May 7, 2024
    Assignee: G-TEKT CORPORATION
    Inventors: Naoki Takahashi, Hiroki Itoi, Makoto Tanaka, Hirokazu Maita
  • Patent number: 11975796
    Abstract: A driving support system (1) for motorcycles including: an external sensor unit (2) which recognizes a road state ahead of one's own vehicle; a collision risk determination unit (62) which determines a level of collision risk between one's own vehicle and an object ahead of one's own vehicle based on a recognition result of the external sensor unit 2; an automatic braking control unit (61) which executes automatic braking to automatically operate a brake device (83) in response to the determination result by the collision risk determination unit (62); and a departure risk determination unit (64) which determines a level of departure risk of one's own vehicle to outside of one's own vehicle travel lane in a case of executing the automatic braking. The automatic braking control unit (61) ends execution of the automatic braking in a case of being determined that the departure risk is high.
    Type: Grant
    Filed: February 23, 2022
    Date of Patent: May 7, 2024
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Makoto Katayama, Hiroki Tanaka, Hiroshi Maeda
  • Patent number: 11970390
    Abstract: The present disclosure provides a method for producing a microchannel device, which can form a channel that has high hydrophobicity, high solvent resistance as well, and also resistance to heat and damage, on demand with high accuracy, and produces the microchannel device at a low cost, while having high productivity. The method for producing a microchannel device includes: forming a channel pattern from a hydrophobic resin on a porous substrate by an electrophotographic method; melting the channel pattern by heat to allow the channel pattern to permeate into the porous substrate, thereby forming a channel in the inside of the porous substrate.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: April 30, 2024
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takeshi Yamamoto, Jun Miura, Keiji Miyazaki, Hiroki Tanaka, Makoto Fukatsu, Akihisa Matsukawa, Takayuki Kanazawa, Keigo Mizusawa, Masanori Seki, Masanori Tanaka
  • Patent number: 11971288
    Abstract: A level meter includes light emission segments forming an emission region, a register portion to register a default emission condition and an emission-condition specified value, and a control portion. The control portion controls the light emission so that the emission region spreads in an emission proceeding direction according to an increase in numerical quantity to be expressed. An emission-condition specified value indicates a command to apply a predetermined specified emission condition concerning a subsequent segment positioned on a more upstream side than a foremost segment positioned on a most downstream side in the emission proceeding direction. The control portion allows all the light emission segments forming the emission region to emit light based on the default emission condition, and the control portion allows the foremost segment to emit light based on the default emission condition whereas allowing the subsequent segment to emit light based on the specified emission condition.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: April 30, 2024
    Assignee: PATLITE CORPORATION
    Inventor: Hiroki Tanaka
  • Publication number: 20240132187
    Abstract: A ship monitoring system includes: a shipboard information processing apparatus and including a shipboard communication unit and an information acquisition unit; and a support information processing apparatus and including: a support side communication unit capable of communicating with the shipboard communication unit; a time lag identification unit; and a state prediction unit. The time lag identification unit identifies a time from transmission of the ship motion information from the shipboard communication unit to reception of the ship motion information by the support side communication unit as a reception time lag. The state prediction unit inputs the ship motion information and the reception time lag to a ship motion model related to the ship motion of the ship to predict a motion state of the ship ahead of a motion state of the ship indicated by the ship motion information by a period of time based on the reception time lag.
    Type: Application
    Filed: October 24, 2023
    Publication date: April 25, 2024
    Inventors: Toru KAWATANI, Hiroki TANAKA, Takatsugu SAKAKIBARA, Naoyuki KAWASAKI, Ryo YAMAGUCHI, Hironobu UETAKE, Naoki SHIMADA, Kenta ABE
  • Publication number: 20240134077
    Abstract: A fiber sensing system according to the present disclosure includes a submarine cable, and a plurality of relaying apparatuses being connected in series to one another via the submarine cable. The relaying apparatus includes a DAS interrogator being connected to a relaying apparatus at a subsequent stage via a sensing optical fiber in the submarine cable, and a terminator being connected to a relaying apparatus at a preceding stage via the sensing optical fiber. The DAS interrogator outputs probe light to the sensing optical fiber. The terminator terminates probe light being output from the DAS interrogator in the relaying apparatus at the preceding stage to the sensing optical fiber. The DAS interrogator receives backscattered light of probe light from the sensing optical fiber, and acquires the DAS data from the received backscattered light.
    Type: Application
    Filed: October 10, 2023
    Publication date: April 25, 2024
    Applicant: NEC Corporation
    Inventors: Masafumi EMURA, Yuta Sawai, Hiroki Tanaka, Minoru Kobayashi
  • Publication number: 20240134377
    Abstract: In a ship control system of one embodiment, a main engine controller performs, when controlling the rotational frequency of a main engine based on a target ship speed of a ship, feedback control of an actual ship speed of the ship to perform ship speed control for bringing the actual ship speed closer to the target ship speed. A turning judgment unit judges whether or not the ship will turn. A control change unit performs, when the turning judgment unit has judged that the ship will turn, lowering processing for lowering the responsiveness of the ship speed control.
    Type: Application
    Filed: October 24, 2023
    Publication date: April 25, 2024
    Inventors: Toru KAWATANI, Hiroki TANAKA, Takatsugu SAKAKIBARA, Naoyuki KAWASAKI, Ryo YAMAGUCHI, Hironobu UETAKE, Naoki SHIMADA, Kenta ABE
  • Publication number: 20240132186
    Abstract: In a ship control system of one embodiment, a route command unit outputs a route command including a target ship position and a target bow direction of a ship. An information detector detects ship information including an actual ship position and an actual bow direction of a ship. An external force vector estimation unit estimates an external force vector received by a ship, using the ship information and a hull motion model related to a hull motion of the ship. A control command unit controls both rotational frequency of a main engine and a rudder angle of a ship, based on the route command, the ship information, and the external force vector.
    Type: Application
    Filed: October 24, 2023
    Publication date: April 25, 2024
    Inventors: Toru KAWATANI, Hiroki TANAKA, Takatsugu SAKAKIBARA, Naoyuki KAWASAKI, Ryo YAMAGUCHI, Hironobu UETAKE, Naoki SHIMADA, Kenta ABE
  • Patent number: 11964479
    Abstract: A medium feeding device includes a feeding roller that is provided in a medium feeding path through which a medium is fed and that feeds a medium downstream by rotating in the forward direction in response to power of a motor, a nip roller that is provided in the medium feeding path and that nips a medium in cooperation with the feeding roller and rotates, and a controller configured to control the motor. Based on an increase in a variation value varying in accordance with a drive load of the motor, the controller controls the motor and causes the feeding roller to start a medium feeding operation.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: April 23, 2024
    Assignee: Seiko Epson Corporation
    Inventors: Keisuke Sasaki, Takayuki Tanaka, Hiroki Shinagawa
  • Publication number: 20240128247
    Abstract: Embodiments described herein enable a microelectronic assembly that includes: a first substrate comprising glass and at least one inductor, the first substrate having a first side and an opposing second side; a second substrate coupled to the first side of the first substrate; and a plurality of integrated circuit (IC) dies. A first subset of the plurality of IC dies is directly coupled to the second side of the first substrate, a second subset of the plurality of IC dies is directly coupled to the second substrate adjacent to the first substrate, and a third subset of the plurality of IC dies is embedded in the second substrate between the first substrate and the second subset of the plurality of IC dies.
    Type: Application
    Filed: October 14, 2022
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Brandon C. Marin, Kristof Kuwawi Darmawikarta, Srinivas V. Pietambaram, Gang Duan, Jeremy Ecton, Suddhasattwa Nad, Hiroki Tanaka
  • Publication number: 20240128181
    Abstract: Embodiments of a microelectronic assembly that includes: a package substrate comprising a plurality of layers of organic dielectric material and conductive traces alternating with conductive vias in alternate layers of the organic dielectric material; and a plurality of integrated circuit dies coupled to a first side of the package substrate by interconnects, in which: the plurality of layers of the organic dielectric material comprises at least a first layer having a conductive via and a second layer having a conductive trace in contact with the conductive via, the second layer is not coplanar with the first layer, sidewalls of the conductive via are orthogonal to the conductive trace, and two opposing sidewalls of the conductive via separated by a width of the conductive via protrude from respectively proximate edges of the conductive trace by a protrusion that is at least ten times less than the width of the conductive via.
    Type: Application
    Filed: October 17, 2022
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Jeremy Ecton, Brandon C. Marin, Srinivas V. Pietambaram, Hiroki Tanaka, Haobo Chen
  • Patent number: 11962654
    Abstract: A communication system according to an embodiment includes a server system and one or more communication apparatuses. The server system includes a first hardware processor. The first hardware processor determines frequency information indicating processing frequency of predetermined processing executed by the communication apparatuses. The frequency information is determined on the basis of determination information affecting the predetermined processing. The first hardware processor transmits processing frequency of the predetermined processing to the communication apparatuses. The processing frequency is determined on the basis of the frequency information. The communication apparatuses each include a second hardware processor. The second hardware processor receives the processing frequency of the processing from the server system. The second hardware processor executes the predetermined processing on the basis of the received processing frequency.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: April 16, 2024
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yasuyuki Tanaka, Suh Wuk Kim, Hiroki Kudo, Sakie Nagakubo
  • Patent number: 11960224
    Abstract: A fixing device includes an endless belt, a rotatable pressing member, a pad member inside of the belt, and a sliding member held by the pad member and sliding on an inner circumferential surface of the belt in a nip. The rotatable pressing member nips and feeds a recording material in the nip in cooperation with the belt and fixes a toner image on the recording material by applying heat and pressure. The sliding member includes a base material layer on which a plurality of projections projecting toward the rotatable pressing member are formed on a side sliding with the belt and a sliding layer provided on an outer surface of the plurality of projections. A leading end of the plurality of projections is a plane and an average roughness (Ra) of the plane satisfies 0.13 ?m?Ra?1.67 ?m.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: April 16, 2024
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Akiyoshi Shinagawa, Yasuharu Toratani, Hiroshi Miyamoto, Daigo Matsuura, Hiroki Kawai, Ayano Ogata, Masanobu Tanaka, Asuna Fukamachi, Misa Kawashima
  • Publication number: 20240111090
    Abstract: A device comprises a substrate and an IC die, which may be a photonic IC. The substrate comprises a first surface, a second surface opposite the first surface, an optical waveguide integral with the substrate, and a hole extending from the first surface to the second surface. The hole comprises a first sidewall. The optical waveguide is between the first surface and the second surface, parallel to the first surface, and comprises a first end which extends to the first sidewall. The IC die is within the hole and comprises a second sidewall and an optical port at the second sidewall. The second sidewall is proximate to the first sidewall and the first end of the optical waveguide is proximate to and aligned with the optical port. The substrate may include a recess to receive another device comprising a socket.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Applicant: Intel Corporation
    Inventors: Robert A. May, Tarek Ibrahim, Shriya Seshadri, Kristof Darmawikarta, Hiroki Tanaka, Changhua Liu, Bai Nie, Lilia May, Srinivas Pietambaram, Zhichao Zhang, Duye Ye, Yosuke Kanaoka, Robin McRee
  • Publication number: 20240112972
    Abstract: Disclosed herein are microelectronics package architectures utilizing photo-integrated glass interposers and photonic integrated glass layers and methods of manufacturing the same. The microelectronics packages may include an organic substrate, a photonic integrated glass layer, and a glass interpose. The organic substrate may define through substrate vias. The photonic integrated glass layer may be attached to the organic substrate. The photonic integrated glass layer may include photo detectors. The glass interposer may be attached to the organic substrate. The glass interposer may define through glass vias in optical communication with the photo detectors.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Inventors: Hiroki Tanaka, Robert Alan May, Kristof Darmawikarta, Bai Nie, Brandon C. Marin, Jeremy D. Ecton, Srinivas Venkata Ramanuja Pietambaram, Changhua Liu