Abstract: A workpiece polishing apparatus including a polishing pad to polish a workpiece, a polishing agent supplying mechanism to supply a polishing agent, and a polishing head to hold the workpiece such that a back surface of the workpiece is held by a backing pad and an edge of the workpiece is held by an annular template. This apparatus polishes the workpiece by pressing the workpiece and the template against the polishing pad and thereby bringing the workpiece into sliding contact with the polishing pad. The template is made of a resin containing filler or woven fabric and has fine depressions created by filler or woven fabric exposed on the surface on the side that presses the polishing pad. This apparatus can stabilize the polishing rate of the outer circumferential portion of the workpiece and thereby polish the workpiece into a very flat workpiece.

Abstract: A polishing head including, below a polishing head body, a rubber film held by a disk-shaped mid plate and an annular guide ring disposed around the rubber film holding the back surface of the workpiece on a lower face portion of the rubber film. The polishing head also includes a base member that is coupled to a polishing head body through an elastic film and holds the guide ring and the mid plate such that the lower surface of the guide ring does not contact the polishing pad during polishing. The polishing head and polishing apparatus, are operable in both of the rough polishing process and final polishing process, that can stably achieve predetermined high flatness and high polishing stock removal uniformity in polishing of a workpiece and can obtain a workpiece with fewer fine particles having a diameter of 45 nm or more.

Abstract: A polishing head for holding a workpiece when a surface of the workpiece is polished and a polishing apparatus provided with the polishing head, and more particularly a polishing head for holding the workpiece on a rubber film and a polishing apparatus provided with the polishing head. The polishing head and the polishing apparatus provided with the polishing head that can adjust the polishing profile on the basis of the shape of the workpiece before polishing and can stably obtain good flatness.

Abstract: The present invention provides a method for producing a silicon wafer including a step of, after growing the oxide film on one surface of a raw material silicon wafer by chemical-vapor deposition, performing double-side polishing of the raw material silicon wafer in such a manner that a suede polishing pad or a velour polishing pad with an asker-C rubber hardness of 50° or more but less than 90° is used for the oxide-film surface.

Abstract: A phase difference film stacked body having a lengthy shape, including a first phase difference film that has a uniform phase difference within a plane, and a second phase difference film that includes a plurality of regions that are patterned within a plane, the plurality of regions having different phase differences; as well as a polarizing plate complex having the same, a display device, and polarization glasses corresponding thereto.

Abstract: A polishing head including, below a polishing head body, a rubber film held by a disk-shaped mid plate and an annular guide ring disposed around the rubber film holding the back surface of the workpiece on a lower face portion of the rubber film. The polishing head also includes a base member that is coupled to a polishing head body through an elastic film and holds the guide ring and the mid plate such that the lower surface of the guide ring does not contact the polishing pad during polishing. The polishing head and polishing apparatus, are operable in both of the rough polishing process and final polishing process, that can stably achieve predetermined high flatness and high polishing stock removal uniformity in polishing of a workpiece and can obtain a workpiece with fewer fine particles having a diameter of 45 nm or more.

Abstract: A cipher processing system for allowing file access while maintaining the integrity without a user being aware of the difference between files when the user accesses a file in a folder containing both a ciphertext file and a plaintext file. If a folder stores both a ciphertext file and a plaintext file, the ciphertext file is attached with identification information (preferably, footer information) indicating that the file is a ciphertext file, so that a plaintext file and a ciphertext file can be differentiated from each other when the files are read. A deciphered file gained by removing identification information from a ciphertext file and deciphering the file is delivered to an upper-level application. If the read file is a plaintext file, decipher processing is not executed on the plaintext file but the plaintext file is passed to the upper-level application program.

Abstract: The present invention is a polishing head in which a rubber film is formed in a boot shape in such a manner that a position where the rubber film is held by a mid plate is distantly positioned from a work holding portion; an end portion of the boot shaped rubber film is formed in O-ring shape so that the rubber film is held by the mid plate with decreasing an area of contact between the mid plate and the rubber film as much as possible. As a result, there is provided a polishing head with rubber chuck method in which an occurrence of a surface defect, such as a scratch, on a surface of the work is suppressed as much as possible and the work can be uniformly and stably polished to the outer periphery.

Abstract: A polishing head for holding a workpiece when a surface of the workpiece is polished and a polishing apparatus provided with the polishing head, and more particularly a polishing head for holding the workpiece on a rubber film and a polishing apparatus provided with the polishing head. The polishing head and the polishing apparatus provided with the polishing head that can adjust the polishing profile on the basis of the shape of the workpiece before polishing and can stably obtain good flatness.

Abstract: A method for manufacturing a polishing head having an annular rigid ring; a rubber film bonded to the rigid ring with uniform tension; a mid plate joined to the rigid ring, forming a space together with the rubber film and the rigid ring; and a mechanism for changing pressure of the space, the method including performing a tensile test on the rubber film according to JIS K6251 before bonding the rubber film to the rigid ring, and selecting the rubber film having a value of 10 MPa or less of an inclination obtained by a linear approximation of a stress-strain curve within a strain value of 5%; and bonding the selected rubber film having a value of 10 MPa or less of the inclination to the rigid ring to manufacture the polishing head.

Abstract: The present invention is a polishing head in which a rubber film is formed in a boot shape in such a manner that a position where the rubber film is held by a mid plate is distantly positioned from a work holding portion; an end portion of the boot shaped rubber film is formed in O-ring shape so that the rubber film is held by the mid plate with decreasing an area of contact between the mid plate and the rubber film as much as possible. As a result, there is provided a polishing head with rubber chuck method in which an occurrence of a surface defect, such as a scratch, on a surface of the work is suppressed as much as possible and the work can be uniformly and stably polished to the outer periphery.

Abstract: A cipher processing system is provided for allowing file access while maintaining the integrity without a user being conscious of the difference between files when the user accesses a file in a folder containing both a ciphertext file and a plaintext file. Thus, according to the present invention, if a folder stores both a ciphertext file and a plaintext file, the ciphertext file is attached with identification information (preferably, footer information) indicating that the file is a ciphertext file, so that the plaintext file and the ciphertext file can be differentiated from each other when the files are read. A deciphered file gained by removing identification information from a ciphertext file and deciphering the file is delivered to an upper-level application. If the read file is a plaintext file, decipher processing is not executed on the plaintext file but the plaintext file is passed to the upper-level application program.

Abstract: The present invention provides a polishing head 1 comprising a carrier 3, a guide ring 4, a dress ring 5, and a head body 2, wherein the head body 2 is rotatable, and holds the carrier 3, the guide ring 4, and the dress ring 5; the head body 2 has a reversed-bowl shape and has a hollow 8; the dress ring, and at least the guide ring or the carrier are held by being coupled to a lower brim of the head body via a diaphragm 6; the hollow of the head body is sealed. During polishing, the pressure of the sealed hollow is adjusted with a pressure regulating mechanism 9 communicating with the hollow, thereby elastically deforming the diaphragm. As a result, a wafer W can be polished while the wafer and the dress ring are pressed with a given pressing force against a polishing pad 11 on a turn table 12 with rotating the wafer held by the carrier and the dress ring.

Abstract: The present invention provides a polishing head 1 comprising a carrier 3, a guide ring 4, a dress ring 5, and a head body 2, wherein the head body 2 is rotatable, and holds the carrier 3, the guide ring 4, and the dress ring 5; the head body 2 has a reversed-bowl shape and has a hollow 8; the dress ring, and at least the guide ring or the carrier are held by being coupled to a lower brim of the head body via a diaphragm 6; the hollow of the head body is sealed. During polishing, the pressure of the sealed hollow is adjusted with a pressure regulating mechanism 9 communicating with the hollow, thereby elastically deforming the diaphragm. As a result, a wafer W can be polished while the wafer and the dress ring are pressed with a given pressing force against a polishing pad 11 on a turn table 12 with rotating the wafer held by the carrier and the dress ring.

Abstract: The present invention provides a fused ring compound of the following formula [I] wherein each symbol is as defined in the specification, a pharmaceutically acceptable salt thereof, and a therapeutic agent for hepatitis C, which contains this compound. The compound of the present invention shows an anti-hepatitis C virus (HCV) action based on the HCV polymerase inhibitory activity, and is useful as a therapeutic agent or prophylactic agent for hepatitis C.

Abstract: The present invention provides a fused ring compound of the following formula [I] wherein each symbol is as defined in the specification, a pharmaceutically acceptable salt thereof, and a therapeutic agent for hepatitis C, which contains this compound. The compound of the present invention shows an anti-hapatitis C virus (HCV) action based on the HCV polymerase inhibitory activity, and is useful as a therapeutic agent or prophylactic agent for hepatitis C.

Abstract: The present invention provides a fused ring compound of the following formula [I] ? wherein each symbol is as defined in the specification, a pharmaceutically acceptable salt thereof, and a therapeutic agent for hepatitis C, which contains this compound. The compound of the present invention shows an anti-hepatitis C virus (HCV) action based on the HCV polymerase inhibitory activity, and is useful as a therapeutic agent or prophylactic agent for hepatitis C.

Abstract: A control apparatus for an internal combustion engine has a supercharger connected to an intake passage of the internal combustion engine and driven by a motor, a bypass passage which is provided for the intake passage in such a manner as to bypass the supercharger, flow amount adjustment device which arbitrarily adjusts a flow amount of air flowing through the bypass passage, and controller which controls the motor and the flow amount adjustment device. The flow amount adjustment device is electrically driven. The controller stops the supercharger from performing supercharging after driving the flow amount adjustment device and starting suction of air via the bypass passage.

Abstract: A control apparatus for an internal combustion engine in accordance with the invention includes a supercharger, a bypass passage, a flow amount adjustment device, an operational state detection portion, and a driving time determination portion. The supercharger is connected to an intake passage of an internal combustion engine and is driven by a motor. The bypass passage is provided for the intake passage in such a manner as to bypass the supercharger. By being driven electrically, the flow amount adjustment device can arbitrarily adjust a flow amount of air flowing through the bypass passage. The operational state detection portion detects an operational state of the internal combustion engine. The driving time determination portion determines a time at which the flow rate adjustment device is driven based on a result of detection performed by the operational state detection portion.

Abstract: The present invention provides a process for manufacturing a semiconductor wafer capable of effectively reducing unevenness having a wavelength of 0.5 mm or more which remains on a surface of the semiconductor wafer after a first polishing step and improving flatness thereof and a semiconductor wafer manufactured by the manufacturing process. The manufacturing process comprises: plural polishing steps including a first polishing step and a final polishing step; and a corrective polishing step performed after the first polishing step using a polishing cloth harder than that used in the first polishing step.