Patents by Inventor Hiroshi Bando

Hiroshi Bando has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11307717
    Abstract: More flexible contactless communication is made possible. There is provided an information processing apparatus including a detection unit that detects a position of a device to be detected relative to a detection surface, a first communication unit that performs contactless communication with the device on the basis of the position, and a second communication unit that performs predetermined communication with an information processing terminal on the basis of acquisition of identification information of the device based on the contactless communication.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: April 19, 2022
    Assignee: SONY CORPORATION
    Inventors: Daisuke Kaiho, Aki Nakano, Hiroshi Bando, Junichi Morimura
  • Patent number: 10720258
    Abstract: A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: July 21, 2020
    Assignee: HITACHI METALS, LTD.
    Inventors: Seigi Aoyama, Toru Sumi, Takashi Hayasaka, Ryohei Okada, Detian Huang, Tamotsu Sakurai, Satoshi Yajima, Minoru Takatsuto, Hiroshi Bando
  • Publication number: 20200168355
    Abstract: A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.
    Type: Application
    Filed: January 29, 2020
    Publication date: May 28, 2020
    Inventors: Seigi AOYAMA, Toru SUMI, Takashi HAYASAKA, Ryohei OKADA, Detian HUANG, Tamotsu SAKURAI, Satoshi YAJIMA, Minoru TAKATSUTO, Hiroshi BANDO
  • Publication number: 20200009454
    Abstract: More flexible contactless communication is made possible. There is provided an information processing apparatus including a detection unit that detects a position of a device to be detected relative to a detection surface, a first communication unit that performs contactless communication with the device on the basis of the position, and a second communication unit that performs predetermined communication with an information processing terminal on the basis of acquisition of identification information of the device based on the contactless communication.
    Type: Application
    Filed: February 7, 2018
    Publication date: January 9, 2020
    Inventors: DAISUKE KAIHO, AKI NAKANO, HIROSHI BANDO, JUNICHI MORIMURA
  • Publication number: 20180197652
    Abstract: A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.
    Type: Application
    Filed: October 3, 2017
    Publication date: July 12, 2018
    Inventors: Seigi AOYAMA, Toru SUMI, Takashi HAYASAKA, Ryohei OKADA, Detian HUANG, Tamotsu SAKURAI, Satoshi YAJIMA, Minoru TAKATSUTO, Hiroshi BANDO
  • Patent number: 9893751
    Abstract: An antenna circuit which includes, a resonant circuit which is configured by at least first and second capacitors, and antenna coils; a transmitter-receiver circuit which has a transmission terminal and a reception terminal; and an adjustment circuit which adjusts an impedance between the resonant circuit and the transmitter-receiver circuit, in which a combination of capacitances of the first and second capacitors is set in a predetermined range of a composite capacitance of the first and second capacitors, and a signal from a terminal which is provided between the first and second capacitors is input to the reception terminal.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: February 13, 2018
    Assignee: Sony Corporation
    Inventor: Hiroshi Bando
  • Patent number: 9842953
    Abstract: A rectangular conductor for a solar battery and a lead wire for a solar battery, in which warping or damaging of a silicon crystal wafer is hard to occur at the time of bonding a connection lead wire even when a silicon crystal wafer is configured to have a thin sheet structure, can be provided. A conductor 1 having a volume resistivity equal to or less than 50 ??·mm, and a 0.2% yield strength value equal to or less than 90 MPa in a tensile test is formed into a rectangular conductor 10 for a solar battery having a rectangular cross section, and a surface of the rectangular conductor 10 for a solar battery is coated with a solder plating film 13, to provide a lead wire 20 for a solar battery.
    Type: Grant
    Filed: April 2, 2013
    Date of Patent: December 12, 2017
    Assignee: HITACHI METALS, LTD.
    Inventors: Yuju Endo, Takashi Nemoto, Hiromitsu Kuroda, Atsushi Ootake, Syuji Kawasaki, Hiroshi Bando
  • Patent number: 9530918
    Abstract: A rectangular conductor for a solar battery and a lead wire for a solar battery, in which warping or damaging of a silicon crystal wafer is hard to occur at the time of bonding a connection lead wire even when a silicon crystal wafer is configured to have a thin sheet structure, can be provided. A conductor 1 having a volume resistivity equal to or less than 50 ??·mm, and a 0.2% yield strength value equal to or less than 90 MPa in a tensile test is formed into a rectangular conductor 10 for a solar battery having a rectangular cross section, and a surface of the rectangular conductor 10 for a solar battery is coated with a solder plating film 13, to provide a lead wire 20 for a solar battery.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: December 27, 2016
    Assignee: HITACHI METALS, LTD.
    Inventors: Yuju Endo, Takashi Nemoto, Hiromitsu Kuroda, Atsushi Ootake, Syuji Kawasaki, Hiroshi Bando
  • Patent number: 9508883
    Abstract: A rectangular conductor for a solar battery and a lead wire for a solar battery, in which warping or damaging of a silicon crystal wafer is hard to occur at the time of bonding a connection lead wire even when a silicon crystal wafer is configured to have a thin sheet structure, can be provided. A conductor 1 having a volume resistivity equal to or less than 50 ??·mm, and a 0.2% yield strength value equal to or less than 90 MPa in a tensile test is formed into a rectangular conductor 10 for a solar battery having a rectangular cross section, and a surface of the rectangular conductor 10 for a solar battery is coated with a solder plating film 13, to provide a lead wire 20 for a solar battery.
    Type: Grant
    Filed: April 7, 2014
    Date of Patent: November 29, 2016
    Assignee: HITACHI METALS, LTD.
    Inventors: Yuju Endo, Takashi Nemoto, Hiromitsu Kuroda, Atsushi Ootake, Syuji Kawasaki, Hiroshi Bando
  • Publication number: 20160133760
    Abstract: A solar cell lead wire includes a molten solder plated layer on a strip-shaped conductive material. The thickness of the oxide film on a surface to the molten solder plate layer is suppressed to be not more than 7 nm.
    Type: Application
    Filed: January 15, 2016
    Publication date: May 12, 2016
    Inventors: Hajime NISHI, Yuju ENDO, Ken TAKAHASHI, Hiromitsu KURODA, Hiroyuki AKUTSU, Katsunori SAWAHATA, Hiroshi BANDO, Iku HIGASHIDANI, Hiroshi OKIKAWA
  • Publication number: 20160079458
    Abstract: A rectangular conductor for a solar battery and a lead wire for a solar battery, in which warping or damaging of a silicon crystal wafer is hard to occur at the time of bonding a connection lead wire even when a silicon crystal wafer is configured to have a thin sheet structure, can be provided. A conductor 1 having a volume resistivity equal to or less than 50 ??·mm, and a 0.2% yield strength value equal to or less than 90 MPa in a tensile test is formed into a rectangular conductor 10 for a solar battery having a rectangular cross section, and a surface of the rectangular conductor 10 for a solar battery is coated with a solder plating film 13, to provide a lead wire 20 for a solar battery.
    Type: Application
    Filed: November 20, 2015
    Publication date: March 17, 2016
    Applicant: HITACHI METALS, LTD.
    Inventors: Yuju ENDO, Takashi Nemoto, Hiromitsu Kuroda, Atsushi Ootake, Syuji Kawasaki, Hiroshi Bando
  • Patent number: 9279176
    Abstract: A solar cell lead wire includes a molten solder plated layer on a strip-shaped conductive material formed rectangular in a cross section thereof so as to be bonded by soldering to an electrode of a solar cell, using a flux. A thickness of an oxide film on a surface of the molten solder plated layer, which is a sum of a thickness of an SnO layer and a thickness of an SnO2 layer on the surface of the molten solder plated layer, is not more than 7 nm.
    Type: Grant
    Filed: November 20, 2009
    Date of Patent: March 8, 2016
    Assignee: Hitachi Metals, Ltd.
    Inventors: Hajime Nishi, Yuju Endo, Ken Takahashi, Hiromitsu Kuroda, Hiroyuki Akutsu, Katsunori Sawahata, Hiroshi Bando, Iku Higashidani, Hiroshi Okikawa
  • Publication number: 20140216545
    Abstract: A rectangular conductor for a solar battery and a lead wire for a solar battery, in which warping or damaging of a silicon crystal wafer is hard to occur at the time of bonding a connection lead wire even when a silicon crystal wafer is configured to have a thin sheet structure, can be provided. A conductor 1 having a volume resistivity equal to or less than 50 ??·mm, and a 0.2% yield strength value equal to or less than 90 MPa in a tensile test is formed into a rectangular conductor 10 for a solar battery having a rectangular cross section, and a surface of the rectangular conductor 10 for a solar battery is coated with a solder plating film 13, to provide a lead wire 20 for a solar battery.
    Type: Application
    Filed: April 7, 2014
    Publication date: August 7, 2014
    Applicant: HITACHI METALS, LTD.
    Inventors: Yuju ENDO, Takashi NEMOTO, Hiromitsu KURODA, Atsushi OOTAKE, Syuji KAWASAKI, Hiroshi BANDO
  • Patent number: 8748734
    Abstract: A rectangular conductor for a solar battery and a lead wire for a solar battery, in which warping or damaging of a silicon crystal wafer is hard to occur at the time of bonding a connection lead wire even when a silicon crystal wafer is configured to have a thin sheet structure, can be provided. A conductor 1 having a volume resistivity equal to or less than 50 ??·mm, and a 0.2% yield strength value equal to or less than 90 MPa in a tensile test is formed into a rectangular conductor 10 for a solar battery having a rectangular cross section, and a surface of the rectangular conductor 10 for a solar battery is coated with a solder plating film 13, to provide a lead wire 20 for a solar battery.
    Type: Grant
    Filed: August 11, 2005
    Date of Patent: June 10, 2014
    Assignee: Hitachi Metals, Ltd.
    Inventors: Yuju Endo, Takashi Nemoto, Hiromitsu Kuroda, Atsushi Ootake, Syuji Kawasaki, Hiroshi Bando
  • Publication number: 20130095771
    Abstract: An antenna circuit which includes, a resonant circuit which is configured by at least first and second capacitors, and antenna coils; a transmitter-receiver circuit which has a transmission terminal and a reception terminal; and an adjustment circuit which adjusts an impedance between the resonant circuit and the transmitter-receiver circuit, in which a combination of capacitances of the first and second capacitors is set in a predetermined range of a composite capacitance of the first and second capacitors, and a signal from a terminal which is provided between the first and second capacitors is input to the reception terminal.
    Type: Application
    Filed: September 14, 2012
    Publication date: April 18, 2013
    Applicant: Sony Corporation
    Inventor: Hiroshi BANDO
  • Patent number: 8354038
    Abstract: A piezoelectric solid solution composition containing, as a main component, a composition represented by the following general formula: {Mx(NayLizK1-y-z)1-x}1-m{(Ti1-u-vZruHfv)x(Nb1-wTaw)1-x}O3 is disclosed. In the formula, M represents a combination of at least one member selected from the group consisting of (Bi0.5K0.5), (Bi0.5Na0.5) and (Bi0.5Li0.5) and at least one member selected from the group consisting of Ba, Sr, Ca and Mg; and in the formula, x, y, z, u, v, w and m are in the following ranges: 0.06<x?0.3, 0?y?1, 0?z?0.3, 0?(y+z)?1, 0<u?1, 0?v?0.75, 0?w?0.2, 0<(u+v)?1 and ?0.06?m?0.06. This solid solution composition preferably forms the same rhombohedral-tetragonal morphotropic phase boundary as in PZT, is environmentally friendly, and displays an excellent piezoelectric constant d33.
    Type: Grant
    Filed: May 16, 2008
    Date of Patent: January 15, 2013
    Assignee: National Institute of Advanced Industrial Science and Technology
    Inventors: Ruiping Wang, Hiroshi Bando
  • Patent number: 8250744
    Abstract: A solar cell lead wire includes a conductive material, and a solder plated layer on a periphery of the conductive material. The solder plated layer is formed flat by rolling. A method of manufacturing a solar cell lead wire includes feeding an elongate conductive material from a feed reel, the elongate conductive material including a rectangular conductor or a round conductor, soaking the conductive material in a molten solder in a molten solder plating bath, cooling the conductive material to have a plated wire with a solder plated layer formed on the conductive material, and winding the plated wire on a winding reel. The plated wire is formed flat by rolling after the solder plated layer of the plated wire is solidified by the cooling.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: August 28, 2012
    Assignees: Hitachi Cable, Ltd., Hitachi Cable Fine-Tech, Ltd.
    Inventors: Seigi Aoyama, Hiroshi Bando, Iku Higashidani, Yoshiharu Masaki, Hiroshi Okikawa
  • Patent number: 8143525
    Abstract: A solar cell lead wire includes a strip-shaped conductive material formed by rolling a wire, and upper and lower melt solder-plated layers formed to be flat on upper and lower surfaces, respectively, of the strip-shaped conductive material by supplying melt solder thereto.
    Type: Grant
    Filed: December 16, 2008
    Date of Patent: March 27, 2012
    Assignees: Hitachi Cable, Ltd., Hitachi Cable Fine-Tech, Ltd.
    Inventors: Hajime Nishi, Yuju Endo, Hiroyuki Akutsu, Hiroshi Bando, Iku Higashidani, Katsunori Sawahata, Yukio Ito, Hiroshi Okikawa
  • Publication number: 20110220196
    Abstract: Disclosed is a lead wire for a solar cell having excellent bondability with a solar cell. The solar cell lead wire (10) has a band plate-shaped electroconductive material (12) that is formed with straight-angled cross-sectional shape and is covered by a molten solder plating layer (13), with the thickness of the oxide film on the surface of the molten solder plating layer (13) being 7 nm or less.
    Type: Application
    Filed: November 20, 2009
    Publication date: September 15, 2011
    Inventors: Hajime Nishi, Yuju Endo, Ken Takahashi, Hiromitsu Kuroda, Hiroyuki Akutsu, Katsunori Sawahata, Hiroshi Bando, Iku Higashidani, Hiroshi Okikawa
  • Publication number: 20100187466
    Abstract: A piezoelectric solid solution composition containing, as a main component, a composition represented by the following general formula: {Mx(NayLizK1-y-z)1-x}1-m{(Ti1-u-vZruHfv)x(Nb1-wTaw)1-x}O3 is disclosed. In the formula, M represents a combination of at least one member selected from the group consisting of (Bi0.5K0.5), (Bi0.5Na0.5) and (Bi0.5Li0.5) and at least one member selected from the group consisting of Ba, Sr, Ca and Mg; and in the formula, x, y, z, u, v, w and m are in the following ranges: 0.06<x?0.3, 0?y?1, 0?z?0.3, 0?(y+z)?1, 0?u?1, 0?v?0.75, 0?w?0.2, 0<(u+v)?1 and ?0.06?m?0.06. This solid solution composition is a novel solid solution composition composed mainly of (Na,K)NbO3, which preferably forms the same rhombohedral-tetragonal morphotropic phase boundary as in PZT and is environmentally friendly.
    Type: Application
    Filed: May 16, 2008
    Publication date: July 29, 2010
    Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE
    Inventors: Ruiping Wang, Hiroshi Bando