Abstract: A semiconductor integrated circuit has K (K is a natural number of 2 or more) number of memory cells coupled to a same word line, and multiple sense amplifier circuits coupled to the memory cells. The multiple sense amplifier circuits are divided into N (N is a natural number of 2 or more) number of groups. Among the N number of groups, after a first group of sense amplifier circuits is activated and carrying out a predetermined read-out operation, a second group of the sense amplifier circuits is activated and the predetermined read-out operation is carried out, and an Nth group of the sense amplifier circuits is activated sequentially to carry out the predetermined read-out operation.

Abstract: A semiconductor integrated circuit according to an exemplary embodiment of the present invention includes a plurality of memory cells connected to one word line; a plurality of sense amplifier circuits that are connected to the memory cells and divided into an N number of groups; and N number of data inversion processing circuits that respectively receive data read out from the N number of groups of sense amplifier circuits, in which after a sense amplifier circuit of a first group terminates operation, a sense amplifier circuit of a second group different from the first group operates, and each of the data inversion processing circuits performs data inversion processing based on the data read out from each of the groups of sense amplifier circuits, and outputs the data to an output terminal of each of the data inversion processing circuits.

Abstract: A conventional layout of power supply protective element cannot sufficiently protect an internal circuit against a surge current that flows into a narrow branch line that branches off from a thick main wiring line. A semiconductor device according to an embodiment of the present invention includes a power supply protective element connected around a terminal; a main wiring line connected with a VCC pad or a GND pad; a branch line that branches off from the main wiring line and applies a power supply potential or a ground potential to a functional block of the semiconductor device; a branching portion at which the branch line branches off from the main wiring line; and an internal power supply protective element connected with the branch line.

Abstract: A semiconductor device according to an embodiment of the invention includes: a plurality of field effect transistors; and a plurality of logic circuits composed of the field effect transistors, the field effect transistors each including: first and second drain regions formed away from each other; at least one source region formed between the first and second drain regions; and a plurality of gate electrodes formed between the first drain region and the source region and between the second drain region and the source region.

Abstract: A MISFET includes a drain diffusion layer of a first conductivity type, a source diffusion layer of the first conductivity type, a gate electrode, and a substrate/well of a second conductivity type. In the MISFET, first diffusion layers of the first conductivity type are provided at two or more positions at predetermined intervals with an isolation therebetween respectively. The two or more positions are facing at least two sides of the element isolation insulation around the drain diffusion layer. A second diffusion layer of the second conductivity type is provided so as to be close to or to come in contact with the source diffusion layer.

Abstract: A manufacturing method of a semiconductor device includes forming an oxide semiconductor thin film layer of zinc oxide, wherein at least a portion of the oxide semiconductor thin film layer in an as-deposited state includes lattice planes having a preferred orientation along a direction perpendicular to the substrate and a lattice spacing d002 of at least 2.619 ?.

Abstract: A manufacturing method of a thin film transistor includes forming a pair of source/drain electrodes on a substrate, such that the source/drain electrodes define a gap therebetween; forming low resistance conductive thin films, which define a gap therebetween, on the source/drain electrodes; and forming an oxide semiconductor thin film layer on upper surface of the low resistance conductive thin films and in the gap defined between the low resistance conductive thin films so that the oxide semiconductor thin film layer functions as a channel. The low resistance conductive thin films and the oxide semiconductor thin film layer are etched so that side surfaces of the resistance conductive thin films and corresponding side surfaces of the oxide semiconductor thin film layer coincide with each other in a channel width direction of the channel. A gate electrode is mounted over the oxide semiconductor thin film layer.

Abstract: A semiconductor device includes an oxide semiconductor thin film layer of zinc oxide. The (002) lattice planes of at least a part of the oxide semiconductor thin film layer have a preferred orientation along a direction perpendicular to a substrate of the semiconductor device and a lattice spacing d002 of at least 2.619 ?.

Abstract: A thin film transistor includes a substrate, and a pair of source/drain electrodes (i.e., a source electrode and a drain electrode) formed on the substrate and defining a gap therebetween. A pair of low resistance conductive thin films are provided such that each coats at least a part of one of the source/drain electrodes. The low resistance conductive thin films define a gap therebetween. An oxide semiconductor thin film layer is continuously formed on upper surfaces of the pair of low resistance conductive thin films and extends along the gap defined between the low resistance conductive thin films so as to function as a channel. Side surfaces of the oxide semiconductor thin film layer and corresponding side surfaces of the low resistance conductive thin films coincide with each other in a channel width direction of the channel.

Abstract: A multichip package according to an embodiment of the invention comprises a first chip and a second chip. A first ground line formed in the first chip and the second ground line formed in the second chip are connected via ESD protection circuits. One of the protection circuits is formed in the first chip and the other is formed in the second chip, allowing effective ESD discharge according to CDM model.

Abstract: A semiconductor integrated circuit device which is formed on an area comprises a first storage node which is formed on a first area having a first conductive type of the area, the first storage node having a first level, a second storage node which is formed on a second area having second conductive type of the area, the second storage node having a second level opposite to the first level and a well boundary which is sandwiched between the first area and the second area, wherein the second storage node has two diagonal lines, thereby, the first area having a first part sandwiched between the diagonal lines extended from the second storage node through the well boundary, and a second part which is the other part of the first part, wherein the first storage node is placed outside a region between the extended lines of two diagonal lines extending from the second storage node to the well boundary direction, and wherein the second storage node is placed outside a region between the extended lines of two diagonal

Abstract: A static random access memory (SRAM) cell includes a first well region of a first conductivity type, a second well region of the first conductivity type, formed in a location different from a location where the first well region is formed, and a third well region of a second conductivity type, which is located between the first well region and the second well region. The memory cell further includes a first tap diffused layer of the first conductivity type for supplying a potential to the first well region, a second tap diffused layer of the first conductivity type for supplying the potential to the second well region, the first and second tap diffused layers being arranged substantially on a diagonal line in the layout of the SRAM cell, and a metal interconnection connected to the first and second tap diffused layers, the metal interconnection passing on the third well region in the SRAM cell.

Abstract: The semiconductor device includes first and second common source semiconductor layers respectively extending in a first direction, first and second logic gate circuits respectively composed of at least one three-dimensional P-type FET and a three-dimensional N-type FET. The sources of the three-dimensional P-type FETs in the first and second logic gate circuits are joined to the first common source semiconductor layer. The sources of the three-dimensional N-type FETs in the first and second logic gate circuits are joined to the second common source semiconductor layer. The semiconductor layers of the three-dimensional P-type and N-type FETs in the first logic gate circuit are joined in their drain side, and The semiconductor layers of the three-dimensional P-type and N-type FETs in the second logic gate circuit are joined in their drain side. The dissipation of the FinFET can be improved.

Abstract: A protection element comprises a ring-shape gate electrode, an N+ drain region inside the ring-shape gate electrode, an N+ source region outside, and a shield plate electrode. The ring gate and source regions are connected to ground via a through-hole, and the drain region is connected to an external pad. The shield plate electrode is connected to ground or to a power supply. Element isolation is achieved by the shield plate electrode, without forming a LOCOS or other element isolation oxide layer. By this means, blocking of thermal conduction by an oxide layer can be avoided to improve the heat dissipation and ESD resistance of the protection element.

Abstract: In a memory system, an ECC circuit is not inserted on a data path for data writing/reading. The ECC process is performed during the cycle of normal data reading/writing process, in such timing that it does not conflict with the data reading/writing process in order not to cause a substantial delay in the data writing/reading process. Specifically, the ECC process is performed during the cycle of burst transfer in which a plurality of data are successively input to or output from a shift register. Since no access is made to the memory cell array during the burst transfer cycle, the ECC process does not cause a delay in the reading/writing process.

Abstract: A first mathematical expression indicating a dependence of SER on an information storage node diffusion layer area at the same information storage node voltage Vn is derived with a use of a result of measuring a relationship between SER and the information storage node diffusion layer area of a storage circuit or an information holding circuit composed of MISFET using a plurality of information storage node voltages Vn as a parameter. Then, a second mathematical expression is derived from the measurement result by substituting a relationship indicating a dependence of SER on an information storage node voltage at the same information storage node diffusion layer area Sc into the first mathematical expression. SER can be calculated by substituting a desired information storage node diffusion layer area and a desired information storage node voltage of a storage circuit or an information holding circuit into the second mathematical expression.

Abstract: The invention provides a gas insulated switchgear, and a method for detecting arc damage in a part used in a gas insulated switchgear, which detect directly when an electric contact or a peripheral part reaches an initially set wear limit. An insulating nozzle of a circuit breaker contains a marking substance that releases a gaseous substance inside a circuit breaker gas container as a result of wear by an arc. For ensuring heat resistance and insulation properties, the insulating nozzle is ordinarily formed of a fluororesin, but in the present invention, it is formed of the ordinarily used fluororesin having uniformly mixed therein, as the marking substance, a chlorine-containing resin which has excellent heat resistance and insulation properties such as polyvinylidene chloride.

Abstract: The memory device according to an embodiment of the invention prepares a reference field (reference value range) corresponding to each logical value and if the threshold value of the cell is within that field, the cell is determined to be defective and the data of the defective cell is stored in a redundant cell. Therefore, if the threshold value drops because the cell charge leaks over time, the data which is stored can be rescued. As a background operation of a normal operating, memory device performs the memory cell check and memory cell substitution in accordance with the internal addresses generated independently than external addresses. Therefore, a defective cell can be rescued without causing delay in the normal operations of memory device.

Abstract: A semiconductor integrated circuit device includes a power supply line connected to a power supply terminal, a ground line connected to a ground terminal and a plurality of capacitors connected in parallel between the power supply line and the ground line. The plurality of capacitors include a first capacitor arranged at a first distance from one of the terminals and a second capacitor arranged at a second distance which is larger than the first distance from the one of the terminals, and the first capacitor has a larger area than the second capacitor.

Abstract: A semiconductor integrated circuit device includes a first and a second field-effect transistors having a gate electrode formed as a ring shape, a drain diffusion layer formed inside the gate electrode and a source diffusion layer formed outside the gate electrode and a substrate potential diffusion layer or a well potential diffusion layer disposed to contact each of the source diffusion layers of the first and the second field-effect transistors of the same conductivity type, the substrate potential diffusion layer or the well potential diffusion layer being formed with a semiconductor of a different conductivity type from the source diffusion layer. Different signals are input to each of the gate electrodes, the substrate potential diffusion layer or the well potential diffusion layer are formed between the source diffusion layer of the first field-effect transistor and the source diffusion layer of the second field-effect transistor.