Abstract: A semiconductor device having a field effect transistor formed on a semiconductor layer on an insulator, comprising: a drain electrode wiring formed over a drain region of the field effect transistor; a source electrode wiring formed over a source region of the field effect transistor; first contact plugs connecting the drain region and the drain electrode wiring; and second contact plugs which connect the source region and the source electrode wiring, and the number of which is greater than the first contact plugs.

Abstract: A semiconductor device includes an oxide semiconductor thin film layer of zinc oxide. The (002) lattice planes of at least a part of the oxide semiconductor thin film layer have a preferred orientation along a direction perpendicular to a substrate of the semiconductor device and a lattice spacing d002 of at least 2.619 ?.

Abstract: An integrated circuit apparatus according to one embodiment of the invention has an NMOS transistor and a source voltage controller which controls the source voltage of the NMOS transistor according to operation mode. The source voltage controller changes the source voltage according to temperature. Since this integrated circuit apparatus changes the source voltage of the MOSFET based on temperature, it is controlled to have desired leakage current regardless of temperature change.

Abstract: A semiconductor integrated circuit device according to an embodiment of the present invention includes a functional circuit region including a functional circuit, a dummy region formed in a region other than the functional circuit region, and plural dummy MOSFETs formed in a dummy region and having a dummy gate electrode on a dummy diffusion layer 12, the plural dummy MOSFETs being arranged such that date rates of the dummy diffusion layer and dummy gate electrode are kept constant in a predetermined section.

Abstract: A semiconductor integrated circuit device according to an embodiment of the invention includes: a protective element formed on a semiconductor substrate; and a plurality of wiring layers composed of insulating layers including a layer that is a low dielectric-constant film, and metal lines, in which a metal line in a second wiring layer and a metal line in a first wiring layer among the plurality of wiring layers extend from the other region above the semiconductor substrate to a region electrically connected with the protective element.

Abstract: An integrated circuit apparatus includes a SRAM cell array having a plurality of memory cells formed of CMOSFET arranged lattice-like. The SRAM cell array has a pair of power line and ground line in each of 1-bit sequences. The integrated circuit apparatus also includes a detector detecting the occurrence of latch-up for each 1-bit sequence and outputting a detection signal, and a power controller controlling a power supply voltage to the power line for each 1-bit sequence. The power controller reduces a voltage to be supplied to the power line in the 1-bit sequence where latch-up is occurring down to a predetermined value according to the detection signal.

Abstract: A thin film transistor includes a substrate, and a pair of source/drain electrodes (i.e., a source electrode and a drain electrode) formed on the substrate and defining a gap therebetween. A pair of low resistance conductive thin films are provided such that each coats at least a part of one of the source/drain electrodes. The low resistance conductive thin films define a gap therebetween. An oxide semiconductor thin film layer is continuously formed on upper surfaces of the pair of low resistance conductive thin films and extends along the gap defined between the low resistance conductive thin films so as to function as a channel. Side surfaces of the oxide semiconductor thin film layer and corresponding side surfaces of the low resistance conductive thin films coincide with each other in a channel width direction of the channel.

Abstract: A semiconductor device includes an oxide semiconductor thin film layer primarily including zinc oxide having at least one orientation other than (002) orientation. The zinc oxide may have a mixed orientation including (002) orientation and (101) orientation. Alternatively, the zinc oxide may have a mixed orientation including (100) orientation and (101) orientation.

Abstract: A semiconductor device having a field effect transistor formed on a semiconductor layer on an insulator, comprising: a drain electrode wiring formed over a drain region of the field effect transistor; a source electrode wiring formed over a source region of the field effect transistor; first contact plugs connecting the drain region and the drain electrode wiring; and second contact plugs which connect the source region and the source electrode wiring, and the number of which is greater than the first contact plugs.

Abstract: The semiconductor integrated circuit device includes a voltage control circuit that generates a control voltage for deactivating a field effect transistor by a gate voltage. The voltage control circuit controls a voltage so as to substantially minimize the leakage current which flows when the field effect transistor is inactive with respect to a device temperature.

Abstract: Soft-error resistance and latch up resistance are simultaneously improved for LSI involving miniaturization and reducing operating voltage. P wells and N wells are formed in a higher density substrate (P on P+ substrate), and buried N wells are formed on a layer underlying thereof. A PMOSFET is formed in the N well and a NMOSFET is formed in the P well. A P well electric potential junction for coupling P well electric potential of the P well to predetermined electric potential is provided, and a region directly under the P well electric potential junction is provided with a region where the aforementioned buried N well is not disposed. The soft-error resistance is improved by having the buried N well therein, and the latch up resistance is improved by coupling the P well to the substrate.

Abstract: A semiconductor memory device, adapted for storing plural bits per cell to be able to accomplish high storage density by a simplified structure, includes a plurality of first gate electrodes extending parallel to one another along one direction and a plurality of second gate electrodes extending in a direction of intersecting the first gate electrodes, in which a diffusion region is provided on each of a plurality of divisions demarcated in a matrix-like pattern by first and second electrodes on a substrate surface. One of the divisions, the four sides of which are defined by two neighboring first gate electrodes and two neighboring second gate electrodes, has four independently accessible bits, and is connected by a contact (CT) with a diffusion region in the division. There are provided a plurality of interconnections connected via contacts to the diffusion regions of other divisions in the plural matrix-like divisions lying on the line of extension of the aforementioned diagonal line.

Abstract: A semiconductor device according to an embodiment of the present invention includes: an oscillating circuit including a plurality of logic circuits connected in series; and an error detecting circuit receiving output signals of at least two of the plurality of logic circuits, and suspending an operation of the oscillating circuit to notify other blocks of the oscillating circuit that an error occurs in the oscillating circuit if a phase difference between the output signals is not within a predetermined phase difference range.

Abstract: A semiconductor device according to an embodiment of the invention includes: a plurality of field effect transistors; and a plurality of logic circuits composed of the field effect transistors, the field effect transistors each including: first and second drain regions formed away from each other; at least one source region formed between the first and second drain regions; and a plurality of gate electrodes formed between the first drain region and the source region and between the second drain region and the source region.

Abstract: A method of manufacturing a semiconductor device includes performing a first etching process on a gate electrode layer to form a gate electrode of a first transistor group including a transistor pair, and performing a second etching process different from the first etching on the gate electrode layer to form a gate electrode of a second transistor group. Forming in this way enables characteristics of the transistor pair to be the same.

Abstract: A semiconductor integrated circuit device which is formed on an area comprises a first storage node which is formed on a first area having a first conductive type of the area, the first storage node having a first level, a second storage node which is formed on a second area having second conductive type of the area, the second storage node having a second level opposite to the first level and a well boundary which is sandwiched between the first area and the second area, wherein the second storage node has two diagonal lines, thereby, the first area having a first part sandwiched between the diagonal lines extended from the second storage node through the well boundary, and a second part which is the other part of the first part, wherein the first storage node is placed outside a region between the extended lines of two diagonal lines extending from the second storage node to the well boundary direction, and wherein the second storage node is placed outside a region between the extended lines of two diagonal

Abstract: A semiconductor integrated circuit includes a word line extending along a first direction, a first and a second N-well regions, a P-well region disposed between the first and the second N-well regions, a memory cell having a first, second, third, and fourth PMOS transistors, and a first and second NMOS transistors, the first and the second PMOS transistors disposed in the first N-well region along a second direction which is different from the first direction, the first and the second NMOS transistors disposed in the P-well region, and the third and the fourth PMOS transistors disposed in the second N-well region along the second direction.

Abstract: A conventional layout of power supply protective element cannot sufficiently protect an internal circuit against a surge current that flows into a narrow branch line that branches off from a thick main wiring line. A semiconductor device according to an embodiment of the present invention includes a power supply protective element connected around a terminal; a main wiring line connected with a VCC pad or a GND pad; a branch line that branches off from the main wiring line and applies a power supply potential or a ground potential to a functional block of the semiconductor device; a branching portion at which the branch line branches off from the main wiring line; and an internal power supply protective element connected with the branch line.

Abstract: An integrated circuit apparatus includes a SRAM cell array having a plurality of memory cells formed of CMOSFET arranged lattice-like. The SRAM cell array has a pair of power line and ground line in each of 1-bit sequences. The integrated circuit apparatus also includes a detector detecting the occurrence of latch-up for each 1-bit sequence and outputting a detection signal, and a power controller controlling a power supply voltage to the power line for each 1-bit sequence. The power controller reduces a voltage to be supplied to the power line in the 1-bit sequence where latch-up is occurring down to a predetermined value according to the detection signal.

Abstract: An integrated circuit apparatus according to one embodiment of the invention has an NMOS transistor and a source voltage controller which controls the source voltage of the NMOS transistor according to operation mode. The source voltage controller changes the source voltage according to temperature. Since this integrated circuit apparatus changes the source voltage of the MOSFET based on temperature, it is controlled to have desired leakage current regardless of temperature change.