Patents by Inventor Hiroshi Iwakiri

Hiroshi Iwakiri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070123662
    Abstract: The present invention has its object to provide a pressure sensitive adhesive composition which can be applied using no organic solvent and which manifests excellent pressure sensitive adhesion characteristics. This object can be achieved by a pressure sensitive adhesive composition which comprises, as essential constituents, the following: (A) a hydrolyzable silyl group-containing organic polymer containing at least 1.3 hydrolyzable silyl groups per molecule and having a number average molecular weight of 15,000 to 100,000; (B) a hydrolyzable silyl group-containing organic polymer containing 0.3 to 1.3 hydrolyzable silyl groups per molecule and having a number average molecular weight of 500 to 15,000; and (C) a tackifier resin.
    Type: Application
    Filed: January 26, 2005
    Publication date: May 31, 2007
    Inventors: Kazuhiko Ueda, Hiroshi Iwakiri
  • Patent number: 7144953
    Abstract: The present invention provides a composition, which is easy to produce because of high ease of handling the starting materials. The composition exhibits excellent transparency, and a product prepared using the composition exhibits excellent mechanical properties and adhesive properties. The curable resin composition contains (A) an oxyalkylene polymer having silicon-containing functional groups crosslinkable through formation of siloxane bonds; (B) a copolymer having silicon-containing functional groups crosslinkable through formation of siloxane bonds, the molecular chain of the copolymer consisting substantially of (b-1) an alkyl (meth)acrylate monomeric unit having C1–C2 alkyl and (b-2) an alkyl (meth)acrylate monomeric unit having C7–C9 alkyl; and (C) a curing agent.
    Type: Grant
    Filed: October 23, 2002
    Date of Patent: December 5, 2006
    Assignee: Kaneka Corporation
    Inventors: Kazuhiko Ueda, Jun Kotani, Shintaro Komitsu, Hiroshi Iwakiri
  • Publication number: 20050272835
    Abstract: Provided is a curable composition comprising a reactive silicon group-containing polyoxyalkylene polymer (A), such as a reactive silicon group-containing polyoxypropylene; a reactive silicon group-containing vinyl polymer (B), such as a reactive silicon group-containing (meth)acrylate polymer; and a polyoxyalkylene plasticizer (C) having a low molecular weight, such as polyoxypropylene, the curable composition providing a rubber-like cured object by crosslinking reaction in the presence of moisture. Also provided is a method for sealing ceramic siding boards comprising applying the curable composition as a sealant and curing the curable composition.
    Type: Application
    Filed: July 9, 2003
    Publication date: December 8, 2005
    Inventors: Hiroshi Iwakiri, Shintaro Komitsu
  • Publication number: 20050267251
    Abstract: A sealant including a reactive silicon group-containing acryl or saturated hydrocarbon based polymer, which causes no staining of a transparent material to be sealed and suppresses deterioration of the sealant when the sealant is applied to the material, such as glass subjected to an anti-staining treatment based on a photocatalytic layer.
    Type: Application
    Filed: October 14, 2003
    Publication date: December 1, 2005
    Applicant: Kaneka Corporation
    Inventors: Hiroshi Iwakiri, Shintaro Komitsu
  • Publication number: 20050004327
    Abstract: The present invention provides a composition, which is easy to produce because of high ease of handling the starting materials. The composition exhibits excellent transparency, and a product prepared using the composition exhibits excellent mechanical properties and adhesive properties. The curable resin composition contains (A) an oxyalkylene polymer having silicon-containing functional groups crosslinkable through formation of siloxane bonds; (B) a copolymer having silicon-containing functional groups crosslinkable through formation of siloxane bonds, the molecular chain of the copolymer consisting substantially of (b-1) an alkyl (meth)acrylate monomeric unit having C1-C2 alkyl and (b-2) an alkyl (meth)acrylate monomeric unit having C7-C9 alkyl; and (C) a curing agent.
    Type: Application
    Filed: October 23, 2002
    Publication date: January 6, 2005
    Inventors: Kazuhiko Ueda, Jun Kotani, Shintaro Komitsu, Hiroshi Iwakiri
  • Patent number: 6777485
    Abstract: The present invention provides a novel sealant and a novel curable resin composition providing for sufficiently high mechanical strength, adhesive strength, rubber elasticity and good workability and a direct glazing method utilizing the composition, which comprises (I) a reactive silicon group-containing polyether oligomer such that the reactive silicon group exists exclusively at the molecular chain terminus and the introduction rate of the reactive silicon group into the molecular chain terminus is not less than 85% as determined by 1H-NMR analysis and (II) a reinforcing filler.
    Type: Grant
    Filed: November 7, 2001
    Date of Patent: August 17, 2004
    Assignee: Kaneka Corporation
    Inventors: Hiroshi Ito, Hidetoshi Odaka, Hiroshi Iwakiri, Fumio Kawakubo, Hideharu Jyono
  • Patent number: 6737482
    Abstract: The present invention is to provide a curable resin composition comprising (I) a reactive silicon group-containing polyoxyalkylene polymer wherein a introduction rate of a reactive silicon group into molecular chain terminus is not less than 85% as analyzed by 1H-NMR spectrometry and (II) an epoxy resin. The curable resin obtained from this composition reflects improvements in tensile strength and tensile shear bond strength and in adhesion to various substrates.
    Type: Grant
    Filed: November 20, 2001
    Date of Patent: May 18, 2004
    Assignee: Kaneka Corporation
    Inventors: Katsuhiro Ando, Toru Inaya, Masato Kusakabe, Hiroshi Iwakiri
  • Patent number: 6642309
    Abstract: The object of the present invention is to provide a novel acrylic-modified silyl-terminated polyether resin composition which is advantageous not only in terms of the availability of raw materials and the ease of synthetic reaction, but also in fast-curing, good storage stability, good weatherability, high adhesiveness, thus promising high potentials of industrial utilization. Further, the object of the present invention is also to develop an environment-friendly curable composition which is a major social consideration. The composition is a curable composition comprising an oxyalkylene polymer (A) containing silyl functional group capable of crosslinking by forming a siloxane bond and a copolymer (B) having a molecular chain comprising alkyl acrylate and/or alkyl methacrylate monomer units and containing silyl functional group capable of crosslinking by forming a siloxane bond, said copolymer (B) having both dialkoxysilyl and trialkoxysilyl groups as said silyl functional group.
    Type: Grant
    Filed: August 14, 2002
    Date of Patent: November 4, 2003
    Assignee: Kaneka Corporation
    Inventors: Shintaro Komitsu, Toshihiko Okamoto, Hiroshi Iwakiri
  • Publication number: 20030105261
    Abstract: The object of the present invention is to provide a novel acrylic-modified silyl-terminated polyether resin composition which is advantageous not only in terms of the availability of raw materials and the ease of synthetic reaction, but also in fast-curing, good storage stability, good weatherability, high adhesiveness, thus promising high potentials of industrial utilization. Further, the object of the present invention is also to develop an environment-friendly curable composition which is a major social consideration.
    Type: Application
    Filed: August 14, 2002
    Publication date: June 5, 2003
    Applicant: KANEKA CORPORATION
    Inventors: Shintaro Komitsu, Toshihiko Okamoto, Hiroshi Iwakiri
  • Patent number: 6541593
    Abstract: A process for producing a reactive silicon group-containing polyether oligomer, which comprises reacting (a) a polyether oligomer the backbone chain of which comprises a polyether and which contains in a side chain or at a terminus of its molecule at least one unsaturated group of the following general formula (1): H2C═C(R1)—R2—O—  (1) (wherein R1 represents a hydrocarbon group of not more than 10 carbon atoms; R2 represents a divalent organic group of 1 to 20 carbon atoms which contains in a side chain or at a terminus of its molecule at least one atomic species selected from the group consisting of hydrogen, oxygen and nitrogen as its constituent atom or atoms) or the general formula (2): HC(R1)═CH—R2—O—  (2) (wherein R1 represents a hydrocarbon group of not more than 10 carbon atoms; R2 represents a divalent organic group of 1 to 20 carbon atoms which contains at least one atomic species selected from the group consisting of hydrogen, ox
    Type: Grant
    Filed: June 14, 2000
    Date of Patent: April 1, 2003
    Assignee: Kaneka Corporation
    Inventors: Hideharu Jyono, Hidetoshi Odaka, Hiroshi Ando, Hiroshi Iwakiri, Hiroshi Ito, Fumio Kawakubo
  • Patent number: 6503995
    Abstract: A method of producing a polyoxyalkylene polymer having at least one crosslinkable silyl group and at least one hydroxyl group in each molecule which comprises treating a polyoxyalkylene polymer having at least one unsaturated group and at least one alcoholic hydroxyl group in each molecule and an impurity double metal cyanide complex as mixed therein with a metal-coordinating compound and adding a compound having a hydrogen-silicon bond and a crosslinkable silyl group in each molecule and a hydrosilylation catalyst to thereby carry out the hydrosilylation reaction.
    Type: Grant
    Filed: April 11, 2001
    Date of Patent: January 7, 2003
    Assignee: Kaneka Corporation
    Inventors: Ryotaro Tsuji, Yousuke Asai, Masayuki Fujita, Hajime Harada, Susumu Kyotani, Takeshi Kawamura, Kenji Kuroda, Hiroshi Iwakiri
  • Patent number: 6486289
    Abstract: The present invention has its object to provide a curable composition insuring a reduced stress without sacrificing restoring force and other physical properties and having a sufficient degree of adhesiveness. The present invention is related to a curable composition comprising comprising an oxyalkylene polymer having at least one reactive silicon group per molecule (A-1), an acid (B), an amine (C), and a tin-series curing catalyst (D). This composition optionally contains a vinyl polymer having at least one reactive silicon group.
    Type: Grant
    Filed: June 14, 2000
    Date of Patent: November 26, 2002
    Assignee: Kaneka Corporation
    Inventors: Izumi Yamaguchi, Masayuki Fujita, Hiroshi Iwakiri
  • Patent number: 6444775
    Abstract: The present invention has its object to provide a curable composition showing a controlled initial curing rate and, hence, offering good workability by introducing a methyl group into the neighborhood of the reactive silicon group within an oligomer to indirectly lower the reactivity of the reactive silicon group within the oligomer.
    Type: Grant
    Filed: March 27, 2000
    Date of Patent: September 3, 2002
    Assignee: Kaneka Corporation
    Inventors: Hideharu Jyono, Hidetoshi Odaka, Hiroshi Ito, Hiroshi Iwakiri
  • Patent number: 6437071
    Abstract: The present invention has its object to provide a curable composition giving cured products improved in residual tack (reduced in stickiness), with the physical properties insuring those tensile characteristics and rubber elasticity required of sealing compositions for general architectural use being retained. The present invention provides a curable composition which comprises (I) 100 parts by weight of a reactive silicon group-containing polyether oligomer with the percentage of the number of reactive silicon groups to the number of molecular chain terminals as determined by 1H-NMR analysis being not less than 85% and (II) 1 to 500 parts by weight of a plasticizer.
    Type: Grant
    Filed: March 20, 2000
    Date of Patent: August 20, 2002
    Assignee: Kaneka Corporation
    Inventors: Hidetoshi Odaka, Yuka Kanamori, Hiroshi Ito, Hideharu Jyono, Hiroshi Iwakiri, Fumio Kawakubo
  • Patent number: 6437072
    Abstract: The present invention has its object to provide a curable composition having good storage stability even when it contains a hydrolyzable silicon compound and/or an amino group-containing alkoxysilane or amino-substituted alkoxysilane derivative compound.
    Type: Grant
    Filed: March 29, 2000
    Date of Patent: August 20, 2002
    Assignee: Kaneka Corporation
    Inventors: Hideharu Jyono, Hidetoshi Odaka, Hiroshi Ito, Hiroshi Iwakiri
  • Publication number: 20020103321
    Abstract: The present invention has its object to provide a curable composition having good storage stability even when it contains a hydrolyzable silicon compound and/or an amino group-containing alkoxysilane or amino-substituted alkoxysilane derivative compound.
    Type: Application
    Filed: March 29, 2000
    Publication date: August 1, 2002
    Inventors: Hideharu Jyono, Hidetoshi Odaka, Hiroshi Ito, Hiroshi Iwakiri
  • Publication number: 20020084030
    Abstract: This invention has its object to provide a curable resin compositions useful as contact adhesives with a prolonged tack retention period, without affecting the final bond strength.
    Type: Application
    Filed: December 10, 2001
    Publication date: July 4, 2002
    Applicant: KANEKA CORPORATION
    Inventors: Jun Kotani, Masato Kusakabe, Hiroshi Iwakiri
  • Patent number: 6350345
    Abstract: This invention has its object to provide a curable resin compositions useful as contact adhesives with a prolonged tack retention period, without affecting the final bond strength. This invention is related to a A curable resin composition which comprises (I) a reactive silicon group-containing polyether oligomer, (II) a copolymer comprising a molecular chain substantially composed of one or more acrylate ester monomer units and/or methacrylate ester monomer units and (III) an accelerator.
    Type: Grant
    Filed: June 1, 2000
    Date of Patent: February 26, 2002
    Assignee: Kaneka Corporation
    Inventors: Jun Kotani, Masato Kusakabe, Hiroshi Iwakiri
  • Publication number: 20020013427
    Abstract: A method of producing a polyoxyalkylene polymer having at least one crosslinkable silyl group and at least one hydroxyl group in each molecule
    Type: Application
    Filed: April 11, 2001
    Publication date: January 31, 2002
    Inventors: Ryotaro Tsuji, Yousuke Asai, Masayuki Fujita, Hajime Harada, Susumu Kyotani, Takeshi Kawamura, Kenji Kuroda, Hiroshi Iwakiri
  • Patent number: 6248915
    Abstract: The invention provides a method of producing a reactive silicon group-containing polyether oligomer which comprises reacting (a) a polyether oligomer having main chain of a polyether and, in each molecule, at least one unsaturated group represented by the general formula (1): H2C═C(R1)—R2—O—  (1) (in the formula, R1 is a hydrocarbon group containing not more than 10 carbon atoms and R2 is a divalent organic group containing 1 to 20 carbon atoms and one or more species selected from the group consisting of hydrogen, oxygen and nitrogen atoms as a constituent atom) or the general formula (2): HC(R1)═CH—R2—O—  (2) on a side chain or at a terminus with (b) a reactive silicon group-containing compound in the presence of (c) a group VIII transition metal catalyst to introduce the reactive silicon group into said polyether oligomer (a), wherein the reaction is carried out in the presence of (d) a sulfur compound.
    Type: Grant
    Filed: December 28, 1999
    Date of Patent: June 19, 2001
    Assignee: Kaneka Corporation
    Inventors: Hiroshi Ito, Hidetoshi Odaka, Hideharu Jyono, Hiroshi Iwakiri, Fumio Kawakubo