Patents by Inventor Hiroshi Iwakiri
Hiroshi Iwakiri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6077896Abstract: It is an object of the present invention to provide a curable composition capable of providing good rubber-like mechanical properties with low stress and high elongation, without sacrificing tack, recovery, curability, weathering resistance, storage stability and other characteristics.This invention relates to a curable composition which comprises (a) an oxyalkylene polymer containing at least one reactive silyl group per molecule thereof and (b) a compound having an intramolecular .alpha., .beta.-diol or .alpha., .gamma.-diol structure.Type: GrantFiled: September 10, 1998Date of Patent: June 20, 2000Assignee: Kaneka CorporationInventors: Ayako Yano, Masayuki Fujita, Hiroshi Iwakiri
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Patent number: 5880245Abstract: The present invention provides a process for the preparation of a reactive silicon group-containing polymer. A novel process for the preparation of the polymer includes allowing an alkylene oxide to undergo ring opening polymerization with an organopolysiloxane compound having an active hydrogen-containing functional group with which the alkylene oxide is reactive as an initiator in the presence of a catalyst to synthesize a polymer of organopolysiloxane and polyoxyalkylene, and then introducing a reactive silicon group into the polymer.Type: GrantFiled: November 13, 1997Date of Patent: March 9, 1999Assignee: Kanegafuchi Kagaku Kogyo Kabushiki KaishaInventors: Masayuki Fujita, Hiroshi Iwakiri, Fumio Kawakubo
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Patent number: 5719249Abstract: The present invention provides a reactive silicon group-containing polymer containing at least one reactive silicon group per molecule, the main chain of the polymer being essentially a copolymer of organopolysiloxane and polyoxyalkylene, which causes no macro phase separation during storage and gives a hardened material having an excellent weathering resistance, little residual tack and excellent coating adhesivity. The present invention provides a process for the preparation of the foregoing reactive silicon group-containing polymer. A novel process for the preparation of the polymer as defined above is provided, which comprises allowing an alkylene oxide to undergo ring opening polymerization with an organopolysiloxane compound having an active hydrogen-containing functional group with which said alkylene oxide is reactive as an initiator in the presence of a catalyst to synthesize a polymer of organopolysiloxane and polyoxyalkylene, and then introducing a reactive silicon group into said polymer.Type: GrantFiled: June 27, 1996Date of Patent: February 17, 1998Assignee: Kanegafuchi Kagaku Kogyo Kabushiki KaishaInventors: Masayuki Fujita, Hiroshi Iwakiri, Fumio Kawakubo
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Patent number: 5703146Abstract: A curable composition includes (A) 100 parts by weight of an oxypropylene polymer having groups containing silicon atoms bonded to a hydroxy group and/or a hydrolyzable group and capable of crosslinking by forming a siloxane bond, a maximum Mw/Mn of 1.6, and an average molecular weight of at least 6,000, (B) from 100 to 200 parts by weight of calcium carbonate containing at least 30% by weight calcium carbonate of an average particle size of not larger than 0.5 .mu.m and surface-treated with a fatty acid, (C) from 30 to 100 parts by weight of a plasticizer containing at least 5% by weight phthalic acid ester plasticizer, (D) from 0.5 to 10 parts by weight of a compound represented by the formula R.sup.1 Si(OCH.sub.3).sub.3 and/or Si(OCH.sub.2 CH.sub.3).sub.4 (wherein R.sup.1 represents a monovalent organic group containing no amino groups), (E) from 0.5 to 10 parts by weight of a compound represented by following formula (1), and (F) from 0.Type: GrantFiled: May 21, 1996Date of Patent: December 30, 1997Assignee: Kanegafuchi Kagaku Kogyo Kabushiki KaishaInventors: Hiroshi Iwakiri, Masayuki Fujita, Takashi Hasegawa
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Patent number: 5684094Abstract: A curable resin composition comprising (a) an oxyalkylene polymer comprising at least one reactive silicon group per molecule and having a number average molecular weight of not less than 3000 and an Mw/Mn ratio of not higher than 1.6, (b) a curing catalyst for the oxyalkylene polymer containing at least one reactive silicon group per molecule, (c) an epoxy resin, and (d) a ketimine; and a curable resin composition further comprises (e) a reactive silicon group-containing silane compound in addition to (a) to (d).Type: GrantFiled: March 6, 1995Date of Patent: November 4, 1997Assignee: Kanegafuchi Kagaku Kogyo Kabushiki KaishaInventors: Mikiko Suzuki, Jo Kawamura, Hiroshi Iwakiri, Fumio Kawakubo
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Patent number: 5650467Abstract: A curable resin composition is disclosed which is composed of (a) an oxyalkylene polymer containing at least one reactive silicon group per molecule and having a number average molecular weight of not less than 3000 and an Mw/Mn ratio of not higher than 1.6, (b) a copolymer having a molecular chain which comprises (A) an alkyl acrylate monomer unit and/or an alkyl methacrylate monomer unit each having 1 to 8 carbon atoms in the alkyl moiety thereof and (B) an alkyl acrylate monomer unit and/or an alkyl methacrylate monomer unit each having 10 or more carbon atoms wherein the total number of monomer units (A) and monomer units (B) constitutes more than 50% of the monomer units in the copolymer (b), and (c) a curing catalyst.Type: GrantFiled: January 11, 1996Date of Patent: July 22, 1997Assignee: Kanegafuchi Kagaku Kogyo Kabushiki KaishaInventors: Mikiko Suzuki, Jo Kawamura, Hiroshi Iwakiri, Fumio Kawakubo
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Patent number: 5342914Abstract: A curable composition comprising an oxyalkylene polymer having a silicon-containing hydrolyzable group and a low-molecular silicon compound having a hydrolyzable group bonded to a silicon atom which is more reactive to H.sub.2 O than the oxyalkylene polymer, with the mole number of the total hydrolyzable groups in said low-molecular silicon compound being not more than that of the hydrolyzable groups in said oxyalkylene polymer. A sealing compound having well-balanced storage stability and rapid curability is provided.Type: GrantFiled: April 7, 1993Date of Patent: August 30, 1994Assignee: Kanegafuchi Kagaku Kogyo Kabushiki KaishaInventors: Hiroshi Iwakiri, Masayuki Fujita, Takashi Hasegawa
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Patent number: 5286780Abstract: A curable composition is disclosed, including (A) an oxypropylene polymer having a narrow molecular weight distribution which does not have any branched chain, is linear and has at least one reactive silicon atom-containing group; and (B) an oxypropylene polymer having a narrow molecular weight distribution which has at least one branched chain and at least one reactive silicon atom-containing group. Cured articles obtained from the curable composition have a tear strength which is unexpectedly higher than the tear strength of the cured article of the component (A) alone or the component (B) alone.Type: GrantFiled: September 8, 1992Date of Patent: February 15, 1994Assignee: Kanegafuchi Kagaku Kogyo Kabushiki KaishaInventors: Hiroshi Iwakiri, Masayuki Fujita, Takashi Hasegawa
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Patent number: 5223597Abstract: A curable composition comprising (A) a reactive silicon group-containing oxypropylene polymer having a ratio of Mw.sup.1 /Mn.sup.1 of higher than 1.6 and (B) a reactive silicon group-containing oxypropylene polymer having a ratio of Mw.sup.2 /Mn.sup.2 of not higher than 1.6 and a number-average molecular weight (Mn.sup.2) of not less than the number-average molecular weight (Mn.sup.1) of the oxypropylene polymer (A). A problem caused by the high viscosity of the oxypropylene polymer having a ratio of Mw.sup.1 /Mn.sup.1 of higher than 1.6 can be solved and the viscosity the polymer (A) before curing can be lowered without greatly lowering excellent rubber elasticity of cured articles by mixing the polymer (A) with the oxypropylene polymer (B) having a ratio of Mw.sup.2 /Mn.sup.2 of not higher than 1.6.Type: GrantFiled: September 8, 1992Date of Patent: June 29, 1993Assignee: Kanegafuchi Kagaku Kogyo Kabushiki KaishaInventors: Hiroshi Iwakiri, Masayuki Fujita, Takashi Hasegawa
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Patent number: 5177173Abstract: An aromatic polyestersulfone having improved heat resistance, film-forming property, hydrolysis resistance and mechanical strength which comprises 1 to 100% by mole of recurring units of the general formula: ##STR1## and 99 to 0% by mole of recurring units of the general formula: ##STR2## wherein R and R' are the same or different and each is an alkyl or alkoxyl group having 1 to 4 carbon atoms, Ar is a bivalent aromatic group, and x and y are 0 or an integer of 1 to 4 provided that the sum of x and y is from 1 to 8.Type: GrantFiled: February 27, 1984Date of Patent: January 5, 1993Assignee: Kanegauchi Kagaku Kogyo Kabushiki KaishaInventors: Hiroshi Iwakiri, Masahiro Asada, Kazuya Yonezawa
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Patent number: 4975511Abstract: A novel glycidyl sulfonamide compound having a (poly)siloxane main chain of its molecule is used alone or in admixture with an epoxy resin to give a cured material being excellent in flexibility, elongation and impact strength without deteriorating thermal resistance, chemical resistance and water absorption thereof. An epoxy resin composition or a resin composition for an epoxy paint containing a glycidyl sulfonamide compound, the epoxy resin and a curling agent for epoxy resin provides a cured material or a coating film having the above-mentioned excellent properties. A process for preparing a glycidyl sulfonamide compound characterized in that subjecting an amine modified silicone having a (poly)siloxane main chain of its molecule to condensation reaction with a sulfonyl chloride to give a sulfonamide compound, which is subjected to an addition reaction with an epihalohydrin to give the glycidyl sulfonamide compound.Type: GrantFiled: November 7, 1989Date of Patent: December 4, 1990Assignee: Kanegafuchi Kagaku Kogyo Kabushiki KaishaInventors: Yoshikuni Deguchi, Hiroshi Iwakiri, Kazunari Iwamoto, Kazuya Yonezawa
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Patent number: 4847395Abstract: Novel glycidyl compounds represented by general formula (I): ##STR1## (wherein all the symbols are as defined in the appended claims), and a process for preparation of the glycidyl compounds are disclosed. The glycidyl compounds are prepared by reacting ethersulfonamide represented by general formula (III): ##STR2## (wherein all the symbols are as defined in the appended claims) and epihalohydrin, and then reacting the resultant adduct with an aqueous caustic alkali solution.Type: GrantFiled: October 8, 1987Date of Patent: July 11, 1989Assignee: Kanegafuchi Kagaku Kogyo Kabushiki KaishaInventors: Yoshikuni Deguchi, Hiroshi Iwakiri, Kazunari Iwamoto, Kazuya Yonezawa
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Patent number: 4552947Abstract: An aromatic polyester having improved heat resistance, hydrolysis resistance and alkali resistance which comprises recurring units of the general formula: ##STR1## and recurring units of the general formula: ##STR2## wherein R.sup.1 and R.sup.2 are an alkyl or alkoxyl group having 1 to 4 carbon atoms, R.sup.3, R.sup.4, R.sup.5 and R.sup.6 are the same or different and each is an alkyl or alkoxyl group having 1 to 4 carbon atoms, Cl or Br, x and y are an integer of 1 to 4, z, x', y' and z' are 0 or an integer of 1 to 4, and X is an alkylidene or cycloalkylidene group having 1 to 8 carbon atoms, --O--, --S--, --SO.sub.2 -- or --CO--.Type: GrantFiled: April 14, 1983Date of Patent: November 12, 1985Assignee: Kanegafuchi Kagaku Kogyo Kabushiki KaishaInventors: Hiroshi Iwakiri, Masahiro Asada, Kazuya Yonezawa
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Patent number: 4474936Abstract: A polyesteramide having structural units of the general formula: ##STR1## wherein Ar is a bivalent aromatic group comprising at least 10% by mole of a group having the following formula: ##STR2## in which R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are the same or different and each is methyl group or ethyl group, and structural units of the general formula: ##STR3## wherein R is a bivalent organic group. At least 10% by mole of a bifunctional phenol compound to be used is a tetraalkylbisphenol-F, and whereby the obtained polyesteramide has improved hydrolysis resistance and electric characteristic with an excellent heat resistance.Type: GrantFiled: July 15, 1983Date of Patent: October 2, 1984Assignee: Kanegafuchi Kagaku Kogyo Kabushiki KaishaInventors: Kazuya Yonezawa, Masahiro Asada, Hiroshi Iwakiri, Miyuki Azuma