Patents by Inventor Hiroshi Kawano

Hiroshi Kawano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6258621
    Abstract: In a plastic packaged semiconductor device, a chip support formed on the same lead frame as leads is disposed so as to extend over the surface of a semiconductor element, the chip support is bonded and fixed to the surface of a polyimide wafer coat on the semiconductor element by means of an insulating tape, the leads are brought into contact with the polyimide wafer coat on the semiconductor element without being fixed, the leads and the electrodes of the semiconductor element are connected by means of gold wires, and these are packaged by a packaging material. Generation of crack in the sealing material thereby prevented, and the thickness of the plastic packaged semiconductor device is reduced.
    Type: Grant
    Filed: February 1, 1999
    Date of Patent: July 10, 2001
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Shinji Ohuchi, Hiroshi Kawano, Etsuo Yamada, Yasushi Shiraishi
  • Patent number: 6256112
    Abstract: A color type determining device is made up of a difference detecting section, a density distribution determining section, a density distribution correcting section, a color line counter, and a color/monochrome determining section. In the difference detecting section, the color type determining device finds, from read data of an original read by a scanner section, a color density for each pixel. In the density distribution determining section, the color type determining device finds a color density distribution for each line, and, based on the color density distribution for each line, determines whether that line is a color line. In the color line counter, the color type determining device counts the total number of color lines, and in the color/monochrome determining section determines from the total number of color lines whether the original is a color original.
    Type: Grant
    Filed: June 26, 1998
    Date of Patent: July 3, 2001
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Hiroshi Kawano
  • Patent number: 6240203
    Abstract: There is provided an image discriminating apparatus for discriminating the type of an image accurately. The apparatus compares a maximum value R among absolute values of mutual differential values of three color components of each pixel composing an image, with two predefined threshold values &bgr; and &ggr;, respectively, and counts numbers C1-C3 of the monochrome pixels, medium pixels and color pixels, respectively, on the basis of the comparison result for each line within the image. The apparatus judges each line within the image as a color line when C3+C2×&ohgr;>&thgr;, as a monochrome line when Cl>&ngr;, and judges the image as a color image when a number of color lines in the whole image exceeds a threshold value.
    Type: Grant
    Filed: November 9, 1998
    Date of Patent: May 29, 2001
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Hiroshi Kawano, Haruo Yamamoto
  • Publication number: 20010001217
    Abstract: A resin sealing type semiconductor device, a manufacturing method thereof and a packaging structure thereof are capable of downsizing the semiconductor device and attaining high-density packaging. For this, the resin sealing type semiconductor device with leads exposed in an outer surface, is provided with spot leads adhered to a circuit forming surface of a semiconductor element with an insulating adhesive tape interposed therebetween, each independently regularly arrayed, and exposed to outside with the semiconductor element disposed inside.
    Type: Application
    Filed: December 12, 2000
    Publication date: May 17, 2001
    Inventors: Shinji Ohuchi, Yasushi Shiraishi, Hiroshi Kawano, Etsuo Yamada
  • Patent number: 6208021
    Abstract: A resin sealing type semiconductor device, a manufacturing method thereof and a packaging structure thereof are capable of downsizing the semiconductor device and attaining high-density packaging. For this, the resin sealing type semiconductor device with leads exposed in an outer surface, is provided with spot leads adhered to a circuit forming surface of a semiconductor element with an insulating adhesive tape interposed therebetween, each independently regularly arrayed, and exposed to outside with the semiconductor element disposed inside.
    Type: Grant
    Filed: February 26, 1997
    Date of Patent: March 27, 2001
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Shinji Ohuchi, Yasushi Shiraishi, Hiroshi Kawano, Etsuo Yamada
  • Patent number: 6141746
    Abstract: An information processor having a control unit in which a plurality of instructions to simultaneously be executed are decoded by a decoder section, an executing unit to be dispatched of a plurality of executing units is selected by an index selecting section according to a result of the decoding, and dispatch to any of the plurality of executing units is inhibited by a dispatch inhibiting section according to a result of the decoding by the decoder section as well as to a result of the selection by the index selecting section.
    Type: Grant
    Filed: March 18, 1998
    Date of Patent: October 31, 2000
    Assignee: Fujitsu Limited
    Inventors: Hiroshi Kawano, Takeo Asakawa
  • Patent number: 6002181
    Abstract: A resin molded type semiconductor device has an inner portion sandwiched between two outer surfaces. The device includes a chip support with a first, inwardly facing surface and a second, outwardly facing surface. The device also includes a semiconductor element with a first, inwardly facing surface and a second, outwardly facing surface. The respective first surfaces of the chip support and semiconductor element are fixed to each other. A mold resin is provided to seal the entire semiconductor device except for the respective second surfaces of the chip support and semiconductor element which remain exposed as part of the two outer surfaces of the device, in order to keep the semiconductor device thin.
    Type: Grant
    Filed: October 23, 1995
    Date of Patent: December 14, 1999
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Etsuo Yamada, Yasushi Shiraishi, Hiroshi Kawano, Shinji Ohuchi, Hidekazu Nasu
  • Patent number: 5969410
    Abstract: In a plastic packaged semiconductor device, a chip support formed on the same lead frame as leads is disposed so as to extend over the surface of a semiconductor element, the chip support is bonded and fixed to the surface of a polyimide wafer coat on the semiconductor element by means of an insulating tape, the leads are brought into contact with the polyimide wafer coat on the semiconductor element without being fixed, the leads and the electrodes of the semiconductor element are connected by means of gold wires, and these are packaged by a packaging material. Generation of crack in the sealing material thereby prevented, and the thickness of the plastic packaged semiconductor device is reduced.
    Type: Grant
    Filed: April 29, 1997
    Date of Patent: October 19, 1999
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Shinji Ohuchi, Hiroshi Kawano, Etsuo Yamada, Yasushi Shiraishi
  • Patent number: 5824435
    Abstract: A non-sintered type nickel electrode comprising an electrode substrate coated at its opposite surfaces with an active material for a cell; the electrode substrate comprising a metal member in the form of one of a metal plate and a metal foil, the metal member being worked into a corrugated shape, and an apparent thickness of the corrugated metal member being not less than three times larger than the thickness of the metal member before the working; and a microscopically-irregular layer being formed on each of opposite surfaces of said metal member generally over an entire area thereof, the microscopically-irregular layer being composed of one of nickel, cobalt and a mixture thereof.
    Type: Grant
    Filed: February 20, 1996
    Date of Patent: October 20, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroshi Kawano, Takayuki Hayashi, Isao Matsumoto
  • Patent number: 5678152
    Abstract: In an image forming apparatus, a fixing device for fixing a toner image on a paper has an oil applying member for applying oil to a heat roller, and an impurity fixing member for fixing the impurities, including toner and paper dust, to the cleaning member. The impurities transferred from the applying member to the cleaning member are fixed to the cleaning member. As a result, the applying member suffers from a minimum of contamination and can be cleaned when contaminated. This obviates the reverse transfer of the contamination from the applying roller to the heat roller which would lower image quality.
    Type: Grant
    Filed: July 24, 1995
    Date of Patent: October 14, 1997
    Assignee: Ricoh Company, Ltd.
    Inventors: Yuzou Kohno, Hiroshi Kawano, Masanori Matsuda, Satoshi Takanashi
  • Patent number: 5543250
    Abstract: The electrode comprises a metal substrate and a coated layer of an active material provided on one or both faces of the substrate. The metal substrate is a metal sheet having a plurality of punched holes. The punched holes have burrs along their peripheries so that the apparent thickness including the burrs is at least twice the original thickness of the metal sheet. The burrs improve the engagement between the metal substrate and the coated layer.
    Type: Grant
    Filed: October 27, 1994
    Date of Patent: August 6, 1996
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Nobuyuki Yanagihara, Hiroshi Kawano, Takayuki Hayashi, Masato Tsuji
  • Patent number: 5386982
    Abstract: A paper sheet feeding apparatus which includes a paper sheet separating device and a paper sheet tray, with the paper separating device further including a pick-up-roller, a feeding roller and a paper sheet separating roller. Significantly, a curl holding member or paper holding member is provided on the paper sheet feeding part side (or, in other words, on the body of the apparatus) so that an operator can easily load paper and the paper holding member is not broken in the case of paper sheet jam. Preferably, the paper holding member is movable, such that it does not obstruct positioning of a paper tray or clearing of paper jams. Further, since the paper holding members is mounted separate from the paper tray, loading of paper into the tray is relatively simple.
    Type: Grant
    Filed: December 3, 1993
    Date of Patent: February 7, 1995
    Assignee: Ricoh Company, Ltd.
    Inventor: Hiroshi Kawano
  • Patent number: 5346781
    Abstract: Disclosed is an alkaline storage battery, in which the negative electrode is constituted by a hydrogen absorbing alloy capable of absorbing/desorbing hydrogen electrochemically, and a hydrophobic material is provided in the space between the surface of the negative electrode and the separator while a hydrophilic material is provided in the inside of the negative electrode, thereby properly secure both wetting property and surface hydrophobic property of the negative electrode against the alkaline electrolytic solution. Accordingly, a hydrogen gas generated in charging the battery can be absorbed by a vapor phase reaction in the hydrophobic portion in the surface of the negative electrode which is exposed to the vapor phase and can be absorbed electrochemically in the portion of the negative electrode which is wetted by the electrolytic solution, so that the inner pressure of the battery can be reduced to thereby make it possible to perform quick charging.
    Type: Grant
    Filed: January 28, 1991
    Date of Patent: September 13, 1994
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kohji Yuasa, Munehisa Ikoma, Hiroshi Kawano, Osamu Takahashi, Isao Matsumoto
  • Patent number: 5317836
    Abstract: An apparatus for polishing edge chamfers of a semiconductor wafer to mirror gloss, having a rotatory cylindrical buff formed with annular groove(s) in its side and a wafer vacuum holder capable of holding and turning the wafer circumferentially, wherein the cylindrical buff is adapted to shift axially, and the annular groove has a width substantially greater than the thickness of the wafer, and a drive mechanism for axially biasing the cylindrical buff is provided.
    Type: Grant
    Filed: November 23, 1992
    Date of Patent: June 7, 1994
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Fumihiko Hasegawa, Masayuki Yamada, Hiroshi Kawano, Tatsuo Ohtani
  • Patent number: 5316620
    Abstract: A method for polishing peripheral chamfers of a semiconductor wafer comprising steps of: (a) turning a cylindrical cup-like rotatory buff having an internal polish groove formed in the inner wall surface thereof, the groove having a profile complementary to the profile of the chamfered wafer edge to be polished; (b) disposing the wafer inside the turning buff; (c) turning the wafer at a relatively low rate; and (d) pressing the wafer edge into the running internal polish groove with an appropriate pressure; furthermore there is proposed an apparatus for this novel method including the cylindrical cup-like rotatory buff as described above.
    Type: Grant
    Filed: January 22, 1993
    Date of Patent: May 31, 1994
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Fumihiko Hasegawa, Tatsuo Ohtani, Hiroshi Kawano, Masayuki Yamada
  • Patent number: 5250369
    Abstract: Disclosed is an alkaline storage battery, in which the negative electrode is constituted by a hydrogen absorbing alloy capable of absorbing/desorbing hydrogen electrochemically, and a hydrophobic material is provided in the space between the surface of the negative electrode and the separator while a hydrophilic material is provided in the inside of the negative electrode, thereby properly secure both wetting property and surface hydrophobic property of the negative electrode against the alkaline electrolytic solution. Accordingly, a hydrogen gas generated in charging the battery can be absorbed by a vapor phase reaction in the hydrophobic portion in the surface of the negative electrode which is exposed to the vapor phase and can be absorbed electrochemically in the Portion of the negative electrode which is wetted by the electrolytic solution, so that the inner pressure of the battery can be reduced to thereby make it possible to perform quick charging.
    Type: Grant
    Filed: September 28, 1992
    Date of Patent: October 5, 1993
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kohji Yuasa, Munehisa Ikoma, Hiroshi Kawano, Osamu Takahashi, Isao Matsumoto
  • Patent number: 5213722
    Abstract: A method for making a separator material which is useful as a separator for storage batteries. The method involves applying a sulfonated surface layer to polyolefin resin fibers which form a woven or non-woven fabric. According to one embodiment, polyolefin resin fibers made of a first polyolefin resin are coated with a surface layer of a second polyolefin resin which is more susceptible to sulfonation than the first polyolefin resin from which said fibers are made. At the stage when the polyolefin fibers are coated with the second polyolefin resin they may be either individual fibers or formed into a woven or non-woven fabric. Thereafter, the fibers are subjected to a sulfonation process until the surface layer is sulfonated and a decomposition product formed by the sulfonation process is then removed from the fibers to obtain a separator material.
    Type: Grant
    Filed: November 20, 1991
    Date of Patent: May 25, 1993
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazutaka Iwasaki, Munehisa Ikoma, Masakazu Ikeyama, Hiroshi Kawano, Isao Matsumoto
  • Patent number: 5209759
    Abstract: A method for producing a metallic oxide-hydrogen secondary battery is provided. The method comprises the steps of disposing generating elements consisting of positive electrodes containing metallic oxides, negative electrodes containing hydrogen-absorbing alloys, and separators in a plurality of cell chambers equipped with safety valves, each cell chamber having different capacity; pouring an electrolyte into each cell chamber; and repeating charge and discharge cycles on condition that safety valves work at pressure G in the range of 1<G.ltoreq.6 atm so that the amount of the electrolyte in each cell chamber is kept constant.
    Type: Grant
    Filed: July 31, 1991
    Date of Patent: May 11, 1993
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kohei Suzuki, Hiroshi Kawano, Nobuyuki Yanagihara, Akira Ota
  • Patent number: 5100723
    Abstract: Separator materials which are adapted for use in storage batteries and which comprise a fabric sheet of polyolefin resin fibers and a surface layer of a polyolefin resin sulfonated to such an extent that sulfone groups are formed in an amount sufficient to impart an appropriate degree of hydrophilicity. The surface layer is formed on individual resin fibers. The methods of making the separator material are also described.
    Type: Grant
    Filed: November 17, 1988
    Date of Patent: March 31, 1992
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazutaka Iwasaki, Munehisa Ikoma, Masakazu Ikeyama, Hiroshi Kawano, Isao Matsumoto
  • Patent number: 5060922
    Abstract: A copying paper processing apparatus comprises a sorter, a stapling device for stapling sheets of copying paper sorted by the sorter, and a device for automatically selecting and setting a sort mode when a staple mode is selected and set. The processing apparatus may comprise a switch for selecting the stapling operation, and a device for automatically selecting and setting a staple mode when the staple selecting switch is turned on and a sort mode is selectively set. The processing apparatus may comprise a device for transmitting a signal indicating that there is no staple needle when the number of staple needles left in the stapling device is a predetermined number greater than the total number of bins of the sorter. The processing apparatus may comprise a device for inhibiting the operation of the stapling device when one of sensors respectively disposed in a paper-receiving base of the stapling device and a sorter bin of the sorter detects that there is no paper.
    Type: Grant
    Filed: July 12, 1989
    Date of Patent: October 29, 1991
    Assignee: Ricoh Company, Ltd.
    Inventors: Mitsuo Shibusawa, Tsutomu Yamakami, Atsushi Arai, Hiroshi Kawano