Abstract: A vapor deposition mask includes: a metal mask in which a metal mask opening is provided; and a resin mask in which a resin mask opening corresponding to a pattern to be produced by vapor deposition is provided at a position overlapping with the metal mask opening, the metal mask and the resin mask being stacked, wherein an arithmetic average height (Sa) of a surface of the resin mask exposed from the metal mask opening is not more than 0.8 ?m.

Abstract: To provide a vapor deposition mask in which a metal layer is provided on a resin mask, in which the resin mask has an opening required to form a vapor deposition pattern, the resin mask contains a resin material, the metal layer contains a metal material, and provided that a glass transition temperature (Tg) of the resin material plus 100° C. is an upper limit temperature, in a linear expansion graph whose vertical axis indicates linear expansion rate and whose horizontal axis indicates temperature, an integrated value of a linear expansion curve for the resin mask over a range from a temperature of 25° C. to the upper limit temperature divided by an integrated value of a linear expansion curve for the metal layer over the range from the temperature of 25° C. to the upper limit temperature falls within a range from 0.55 to 1.45 inclusive.

Abstract: A vapor deposition mask includes a metal mask and a resin mask having an opening. An inner wall surface for composing the opening has an inflection point in a thicknesswise cross section of the resin mask. When an intersection of a first surface, not facing the metal mask, of the resin mask and the inner wall surface is set to be a first intersection, an intersection of a second surface, facing the metal mask, of the resin mask and the inner wall surface is set to be a second intersection, and there is set a first inflection point first positioned from the first intersection toward the second intersection, an angle formed by a line connecting the first intersection and the first inflection point and the first surface is larger than an angle formed by a line connecting the first inflection point and the second intersection and the second surface.

Abstract: A vapor deposition mask includes: a metal mask in which a metal mask opening is provided; and a resin mask in which a resin mask opening corresponding to a pattern to be produced by vapor deposition is provided at a position overlapping with the metal mask opening, the metal mask and the resin mask being stacked, wherein an arithmetic average height (Sa) of a surface of the resin mask exposed from the metal mask opening is not more than 0.8 ?m.

Abstract: There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a slit 15 is provided and a resin mask 20 in which openings 25 corresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slit 15 are stacked, and the metal mask 10 has a general region 10a in which the slit 15 is provided and a thick region 10b larger in thickness than the general region.

Abstract: A vapor deposition mask capable of correctly performing confirmation of whether a shape pattern of openings formed in a resin mask is normal or similar confirmation while satisfying both high definition and lightweight, a vapor deposition mask preparation body for obtaining the vapor deposition mask, a frame-equipped vapor deposition mask including the vapor deposition mask, and a method for producing an organic semiconductor element using the frame-equipped vapor deposition mask. The aforementioned problem is solved by using, in a vapor deposition mask including a metal mask in which a through hole is formed and a resin mask in which an opening corresponding to a pattern to be produced by vapor deposition is formed at a position overlapping with the through hole, the metal mask and the resin mask being stacked, wherein the resin mask has about 40% or less of light ray transmittance at a wavelength of about 550 nm.

Abstract: There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a slit 15 is provided and a resin mask 20 in which openings 25 corresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slit 15 are stacked, and the metal mask 10 has a general region 10a in which the slit 15 is provided and a thick region 10b larger in thickness than the general region.

Abstract: There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a slit 15 is provided and a resin mask 20 in which openings 25 corresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slit 15 are stacked, and the metal mask 10 has a general region 10a in which the slit 15 is provided and a thick region 10b larger in thickness than the general region.

Abstract: A vapor deposition mask capable of correctly performing confirmation of whether a shape pattern of openings formed in a resin mask is normal or similar confirmation while satisfying both high definition and lightweight, a vapor deposition mask preparation body for obtaining the vapor deposition mask, a frame-equipped vapor deposition mask including the vapor deposition mask, and a method for producing an organic semiconductor element using the frame-equipped vapor deposition mask. The aforementioned problem is solved by using, in a vapor deposition mask including a metal mask in which a slit is formed and a resin mask in which an opening corresponding to a pattern to be produced by vapor deposition is formed at a position overlapping with the slit, the metal mask and the resin mask being stacked, the resin mask which has about 40% or less of light ray transmittance at a wavelength of about 550 nm.

Abstract: A communication control device includes an association table updater and a correction packet transmitter. The association table updater updates, when receiving from a first wireless device a packet containing an identification number of a first communication terminal connected to the first wireless device, an association table storing an address of the first wireless device and the identification number of the first communication terminal.

Abstract: In a method for producing a vapor deposition mask including a resin mask 20 including resin mask openings 25 corresponding to a pattern to be produced by vapor deposition, and a metal mask 10 including a metal mask opening 15, the metal mask being stacked on one surface of the resin mask, when the plurality of resin mask openings 25 are formed, as to any one resin mask opening 25a of the plurality of resin mask openings 25, the resin mask opening 25 is formed such that in a thicknesswise cross section of the resin mask, an acute angle (?1) formed by one inner wall surface forming the one resin mask opening and the other surface of the resin mask is different from an acute angle (?2) formed by the other inner wall surface forming the one resin mask opening and the other surface of the resin mask.

Abstract: A vapor deposition mask includes a metal mask and a resin mask having an opening. An inner wall surface for composing the opening has an inflection point in a thicknesswise cross section of the resin mask. When an intersection of a first surface, not facing the metal mask, of the resin mask and the inner wall surface is set to be a first intersection, an intersection of a second surface, facing the metal mask, of the resin mask and the inner wall surface is set to be a second intersection, and there is set a first inflection point first positioned from the first intersection toward the second intersection, an angle formed by a line connecting the first intersection and the first inflection point and the first surface is larger than an angle formed by a line connecting the first inflection point and the second intersection and the second surface.

Abstract: A vapor deposition mask includes a metal mask and a resin mask having an opening. An inner wall surface for composing the opening has an inflection point in a thicknesswise cross section of the resin mask. When an intersection of a first surface, not facing the metal mask, of the resin mask and the inner wall surface is set to be a first intersection, an intersection of a second surface, facing the metal mask, of the resin mask and the inner wall surface is set to be a second intersection, and there is set a first inflection point first positioned from the first intersection toward the second intersection, an angle formed by a line connecting the first intersection and the first inflection point and the first surface is larger than an angle formed by a line connecting the first inflection point and the second intersection and the second surface.

Abstract: There is provided a vapor deposition mask including: a resin mask including a plurality of resin mask openings corresponding to a pattern to be produced by vapor deposition; and a metal mask including a metal mask opening, the resin mask and the metal mask being stacked such that the resin mask openings overlap with the metal mask opening, wherein the metal mask includes one or a plurality of rigidity adjustment parts that partially reduce rigidity of the metal mask at a position not overlapping with the resin mask openings of the resin mask.

Abstract: An antenna device includes: a plurality of cores arranged in series; a coil; and a capacitor connected to the coil, in which a first core, which is selected from the plurality of cores, and a second core, which is selected from the plurality of cores and is arranged on any one end portion side of the first core, are arranged apart from each other, and in which at least one end surface, which is selected from an end surface of the first core on a side on which the second core is arranged and an end surface of the second core on a side on which the first core is arranged, is located on an inner peripheral side of the coil.

Abstract: There is provided a vapor deposition mask including: a resin mask including a plurality of resin mask openings corresponding to a pattern to be produced by vapor deposition; and a metal mask including a metal mask opening, the resin mask and the metal mask being stacked such that the resin mask openings overlap with the metal mask opening, wherein a shape of the metal mask opening as the metal mask is seen in plan view includes a polygon as a basic shape and an elongation part, added to the polygon, the elongation part elongating a length of a whole periphery of the polygon.

Abstract: Provided are compositions comprising: (i) a dispersed phase of rubber that is at least partially cured; (ii) a continuous thermoplastic phase including at least one thermoplastic polymer; (iii) a first polysiloxane having a number average molecular weight greater than 100 kg/mole; and (iv) a second polysiloxane having a number average molecular weight less than 100 kg/mole, and methods for making such compositions. Also provided are laminates including such compositions, weatherseals made therefrom, and methods for making them.

Abstract: There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a vapor deposition mask preparation body capable of simply producing the vapor deposition mask and a method for producing a vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition. A metal mask 10 in which a slit 15 is provided and a resin mask 20 in which openings 25 corresponding to a pattern to be produced by vapor deposition are provided at a position of overlapping with the slit 15 are stacked, and the metal mask 10 has a general region 10a in which the slit 15 is provided and a thick region 10b larger in thickness than the general region.

Abstract: An antenna device including: a core formed by a magnetic material; a terminal attachment unit which is arranged on one end side of the core and concurrently, which is provided with an opening portion of penetration-state; a coil which is arranged on the outer-peripheral side of the core and concurrently, which is formed by winding a conductive wire; and at least a pair of terminal members which are attached to the terminal attachment unit and concurrently, which are provided with a chip-support-piece portion positioned at the opening portion and concurrently electrically connected to an electronic component while being equipped with aforesaid electronic component having a chip-shape, wherein for the chip-support-piece portion, there is provided a positioner which carries out the positioning of the electronic component.

Abstract: A communication control device includes an association table updater and a correction packet transmitter. The association table updater updates, when receiving from a first wireless device a packet containing an identification number of a first communication terminal connected to the first wireless device, an association table storing an address of the first wireless device and the identification number of the first communication terminal.