Patents by Inventor Hiroshi Komiya
Hiroshi Komiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11862486Abstract: A substrate processing apparatus includes a substrate holding unit 31 configured to hold a substrate W; an outer nozzle 45 configured to discharge a processing liquid toward a surface of the substrate from a position at an outside of an outer edge of the substrate held by the substrate holding unit such that at least a central portion of the surface of the substrate is covered with a liquid film of the discharged processing liquid; and an actuator 46 (90) configured to change a height position or a discharge angle of the outer nozzle.Type: GrantFiled: August 5, 2020Date of Patent: January 2, 2024Assignee: TOKYO ELECTRON LIMITEDInventors: Kazuki Kosai, Yoshihiro Kai, Gentaro Goshi, Hiroshi Komiya, Seiya Fujimoto, Takahisa Otsuka
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Patent number: 11712710Abstract: A substrate processing apparatus includes: a processing chamber in which a substrate is processed with a processing liquid; a nozzle having a discharge port from which the processing liquid is discharged, the discharge port being formed in a distal end portion of the nozzle; a nozzle bath including an accommodation chamber formed therein, wherein the distal end portion of the nozzle is accommodated in the accommodation chamber at a standby time at which the processing liquid is not supplied to the substrate; a circulation line configured to return the processing liquid, which is discharged from the nozzle to the nozzle bath, to the nozzle; and a first restraint part configured to restrain a gas from flowing between an outside of the nozzle bath and the processing liquid present inside the nozzle bath when the processing liquid discharged from the nozzle to the nozzle bath is circulated to the nozzle.Type: GrantFiled: August 1, 2019Date of Patent: August 1, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Fumihiro Kamimura, Takahisa Otsuka, Hiroshi Komiya, Nobuhiro Ogata
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Publication number: 20230091875Abstract: A filter cleaning system includes a storage unit that stores liquid that is passed through a filter; a liquid supply path that sends the liquid stored in the storage unit to the filter; a circulation path that returns the liquid sent from the filter to the storage unit; a first supply unit that supplies a first liquid to the storage unit; and a second supply unit that supplies a second liquid having a surface tension lower than that of the first liquid and an affinity for the first liquid, to the storage unit.Type: ApplicationFiled: January 27, 2021Publication date: March 23, 2023Inventors: Yuki OTSUKA, Atsushi ANAMOTO, Hiroshi KOMIYA
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Patent number: 11353894Abstract: A liquid processing apparatus includes: a substrate processing unit; a supply line that supplies the fluid to the substrate processing unit; a flow meter that measures a flow rate of the fluid flowing through the supply line; a flow rate adjustment mechanism that adjusts the flow rate of the fluid flowing through the supply line; and a controller that control the flow rate adjustment mechanism based on a measurement result of the flow meter. The controller receives the measurement result at a first cycle. When the measurement result of the flow meter indicates that the flow rate of the fluid flowing through the supply line is included in a preset range, the controller causes the flow rate adjustment mechanism to adjust the flow rate of the fluid flowing through the supply line at a cycle having a time interval longer than a time interval of the first cycle.Type: GrantFiled: July 26, 2017Date of Patent: June 7, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Keigo Satake, Hiroshi Komiya, Kouji Ogura
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Patent number: 11094568Abstract: A processing apparatus includes a chamber configured to accommodate a substrate to be processed, a nozzle provided in the chamber and configured to supply a processing solution to the substrate, a flow rate measuring part configured to measure a flow rate of the processing solution supplied to the nozzle, a flow path opening/closing part configured to open and close a supply flow path of the processing solution to the nozzle, and a controller configured to output a close signal causing the flow path opening/closing part to perform a closing operation that closes the supply flow path. The controller is configured to detect an operation abnormality of the flow path opening/closing part based on an accumulated amount of the flow rate measured by the flow rate measuring part after outputting the close signal.Type: GrantFiled: April 24, 2018Date of Patent: August 17, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Kenji Nakamizo, Satoshi Morita, Akinori Tanaka, Hiroshi Komiya, Mikio Nakashima, Kousuke Fukuda, Youichi Masaki, Ryoji Ando, Ikuo Sunaka
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Publication number: 20200365424Abstract: A substrate processing apparatus includes a substrate holding unit 31 configured to hold a substrate W; an outer nozzle 45 configured to discharge a processing liquid toward a surface of the substrate from a position at an outside of an outer edge of the substrate held by the substrate holding unit such that at least a central portion of the surface of the substrate is covered with a liquid film of the discharged processing liquid; and an actuator 46 (90) configured to change a height position or a discharge angle of the outer nozzle.Type: ApplicationFiled: August 5, 2020Publication date: November 19, 2020Inventors: Kazuki Kosai, Yoshihiro Kai, Gentaro Goshi, Hiroshi Komiya, Seiya Fujimoto, Takahisa Otsuka
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Patent number: 10770316Abstract: A substrate processing apparatus includes a substrate holding unit 31 configured to hold a substrate W; an outer nozzle 45 configured to discharge a processing liquid toward a surface of the substrate from a position at an outside of an outer edge of the substrate held by the substrate holding unit such that at least a central portion of the surface of the substrate is covered with a liquid film of the discharged processing liquid; and an actuator 46 (90) configured to change a height position or a discharge angle of the outer nozzle.Type: GrantFiled: November 17, 2016Date of Patent: September 8, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Kazuki Kosai, Yoshihiro Kai, Gentaro Goshi, Hiroshi Komiya, Seiya Fujimoto, Takahisa Otsuka
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Patent number: 10591935Abstract: A substrate liquid processing apparatus includes a tank; a circulation line; a processing unit connected to the circulation line through a branch line and configured to perform a liquid processing on a substrate using a processing liquid flowing through the circulation line; a processing liquid producing mechanism configured to produce the processing liquid by mixing at least two kinds of raw material liquids supplied from respective raw material liquid sources at a controlled mixing ratio; a concentration measuring device configured to measure a concentration of the processing liquid flowing through the circulation line and a concentration of the processing liquid flowing through the processing liquid supply line; and a control device configured to control the processing liquid producing mechanism based on the measured concentrations of the processing liquid.Type: GrantFiled: November 13, 2018Date of Patent: March 17, 2020Assignee: Tokyo Electron LimitedInventors: Yasuhiro Takaki, Hiroshi Komiya, Chikara Nobukuni, Keigo Satake, Atsushi Anamoto
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Publication number: 20200070196Abstract: There is provided a substrate processing apparatus including: a nozzle configured to eject a processing liquid onto a substrate; a standby section having an opening, wherein the nozzle is inserted into the opening to stand by in the standby section; a supply path through which the processing liquid is supplied to the nozzle; a discharge path through which the processing liquid is discharged from the standby section; a circulation path formed by connecting the nozzle, the standby section, the supply path, and the discharge path; and an atmospheric-blocking mechanism provided in the circulation path to block an inside of the circulation path and a surrounding of the substrate from each other.Type: ApplicationFiled: August 28, 2019Publication date: March 5, 2020Inventors: Fumihiro KAMIMURA, Hiroshi KOMIYA, Nobuhiro OGATA, Takahisa OTSUKA
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Patent number: 10573539Abstract: A substrate liquid processing apparatus includes a transfer section, a processing section, a reservoir and a liquid sending mechanism. The transfer section includes a transfer device configured to transfer a substrate. The processing section is provided adjacent to the transfer section in a horizontal direction, and includes a liquid processing unit configured to process the substrate by using a processing liquid. The reservoir is configured to store the processing liquid therein. The liquid sending mechanism is configured to send out the processing liquid stored in the reservoir into the liquid processing unit. The reservoir is disposed directly under the transfer section. Further, the liquid sending mechanism is disposed directly under the processing section. Space saving of the substrate liquid processing apparatus can be achieved.Type: GrantFiled: December 15, 2015Date of Patent: February 25, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Hiroshi Komiya, Yasuhiro Takaki, Shinichi Umeno, Koji Tanaka, Takami Satoh, Atsushi Anamoto
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Publication number: 20200038897Abstract: A substrate processing apparatus includes: a processing chamber in which a substrate is processed with a processing liquid; a nozzle having a discharge port from which the processing liquid is discharged, the discharge port being formed in a distal end portion of the nozzle; a nozzle bath including an accommodation chamber formed therein, wherein the distal end portion of the nozzle is accommodated in the accommodation chamber at a standby time at which the processing liquid is not supplied to the substrate; a circulation line configured to return the processing liquid, which is discharged from the nozzle to the nozzle bath, to the nozzle; and a first restraint part configured to restrain a gas from flowing between an outside of the nozzle bath and the processing liquid present inside the nozzle bath when the processing liquid discharged from the nozzle to the nozzle bath is circulated to the nozzle.Type: ApplicationFiled: August 1, 2019Publication date: February 6, 2020Inventors: Fumihiro KAMIMURA, Takahisa OTSUKA, Hiroshi KOMIYA, Nobuhiro OGATA
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Publication number: 20190079544Abstract: A substrate liquid processing apparatus includes a tank; a circulation line; a processing unit connected to the circulation line through a branch line and configured to perform a liquid processing on a substrate using a processing liquid flowing through the circulation line; a processing liquid producing mechanism configured to produce the processing liquid by mixing at least two kinds of raw material liquids supplied from respective raw material liquid sources at a controlled mixing ratio; a concentration measuring device configured to measure a concentration of the processing liquid flowing through the circulation line and a concentration of the processing liquid flowing through the processing liquid supply line; and a control device configured to control the processing liquid producing mechanism based on the measured concentrations of the processing liquid.Type: ApplicationFiled: November 13, 2018Publication date: March 14, 2019Inventors: Yasuhiro Takaki, Hiroshi Komiya, Chikara Nobukuni, Keigo Satake, Atsushi Anamoto
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Patent number: 10162371Abstract: A substrate liquid processing apparatus includes a tank; a circulation line; a processing unit connected to the circulation line through a branch line and configured to perform a liquid processing on a substrate using a processing liquid flowing through the circulation line; a processing liquid producing mechanism configured to produce the processing liquid by mixing at least two kinds of raw material liquids supplied from respective raw material liquid sources at a controlled mixing ratio; a concentration measuring device configured to measure a concentration of the processing liquid flowing through the circulation line and a concentration of the processing liquid flowing through the processing liquid supply line; and a control device configured to control the processing liquid producing mechanism based on the measured concentrations of the processing liquid.Type: GrantFiled: November 10, 2014Date of Patent: December 25, 2018Assignee: Tokyo Electron LimitedInventors: Yasuhiro Takaki, Hiroshi Komiya, Chikara Nobukuni, Keigo Satake, Atsushi Anamoto
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Publication number: 20180358240Abstract: A substrate liquid processing apparatus includes a transfer section, a processing section, a reservoir and a liquid sending mechanism. The transfer section includes a transfer device configured to transfer a substrate. The processing section is provided adjacent to the transfer section in a horizontal direction, and includes a liquid processing unit configured to process the substrate by using a processing liquid. The reservoir is configured to store the processing liquid therein. The liquid sending mechanism is configured to send out the processing liquid stored in the reservoir into the liquid processing unit. The reservoir is disposed directly under the transfer section. Further, the liquid sending mechanism is disposed directly under the processing section. Space saving of the substrate liquid processing apparatus can be achieved.Type: ApplicationFiled: December 15, 2015Publication date: December 13, 2018Inventors: Hiroshi Komiya, Yasuhiro Takaki, Shinichi Umeno, Koji Tanaka, Takami Satoh, Atsushi Anamoto
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Patent number: 10153182Abstract: A substrate processing apparatus that performs processing by immersing a substrate into a processing liquid obtained by mixing phosphoric acid with a diluent includes a concentration sensing means for sensing the concentration of the processing liquid by measuring the absorbance characteristics of the processing liquid. The concentration sensing means includes a light-transmitting section that introduces the processing liquid into the inside to let the processing liquid pass therethrough, a light-emitting section that radiates light having a predetermined wavelength to the light-transmitting section, a light-receiving section that receives the light therefrom via the light-transmitting section, a first lens that condenses the light emitted from the light-emitting section to the light-transmitting section, a second lens that condenses the light that has passed through the light-transmitting section to the light-receiving section, and a cooling mechanism that cools at least one of these.Type: GrantFiled: August 29, 2012Date of Patent: December 11, 2018Assignees: Kurashiki Boseki Kabushiki Kaisha, Tokyo Electron LimitedInventors: Noboru Higashi, Satoru Hiraki, Hiromi Kiyose, Hideaki Sato, Hiroshi Komiya
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Publication number: 20180337067Abstract: A substrate processing apparatus includes a substrate holding unit 31 configured to hold a substrate W; an outer nozzle 45 configured to discharge a processing liquid toward a surface of the substrate from a position at an outside of an outer edge of the substrate held by the substrate holding unit such that at least a central portion of the surface of the substrate is covered with a liquid film of the discharged processing liquid; and an actuator 46 (90) configured to change a height position or a discharge angle of the outer nozzle.Type: ApplicationFiled: November 17, 2016Publication date: November 22, 2018Inventors: Kazuki Kosai, Yoshihiro Kai, Gentaro Goshi, Hiroshi Komiya, Seiya Fujimoto, Takahisa Otsuka
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Publication number: 20180308730Abstract: A processing apparatus includes a chamber configured to accommodate a substrate to be processed, a nozzle provided in the chamber and configured to supply a processing solution to the substrate, a flow rate measuring part configured to measure a flow rate of the processing solution supplied to the nozzle, a flow path opening/closing part configured to open and close a supply flow path of the processing solution to the nozzle, and a controller configured to output a close signal causing the flow path opening/closing part to perform a closing operation that closes the supply flow path. The controller is configured to detect an operation abnormality of the flow path opening/closing part based on an accumulated amount of the flow rate measured by the flow rate measuring part after outputting the close signal.Type: ApplicationFiled: April 24, 2018Publication date: October 25, 2018Inventors: Kenji NAKAMIZO, Satoshi MORITA, Akinori TANAKA, Hiroshi KOMIYA, Mikio NAKASHIMA, Kousuke FUKUDA, Youichi MASAKI, Ryoji ANDO, Ikuo SUNAKA
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Publication number: 20180032092Abstract: A liquid processing apparatus includes: a substrate processing unit; a supply line that supplies the fluid to the substrate processing unit; a flow meter that measures a flow rate of the fluid flowing through the supply line; a flow rate adjustment mechanism that adjusts the flow rate of the fluid flowing through the supply line; and a controller that control the flow rate adjustment mechanism based on a measurement result of the flow meter. The controller receives the measurement result at a first cycle. When the measurement result of the flow meter indicates that the flow rate of the fluid flowing through the supply line is included in a preset range, the controller causes the flow rate adjustment mechanism to adjust the flow rate of the fluid flowing through the supply line at a cycle having a time interval longer than a time interval of the first cycle.Type: ApplicationFiled: July 26, 2017Publication date: February 1, 2018Inventors: Keigo Satake, Hiroshi Komiya, Kouji Ogura
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Patent number: 9452397Abstract: A liquid processing apparatus 200 includes a pure water supply source 20; a pure water flow rate control opening/closing valve 27; a sulfuric acid supply unit 30; a sulfuric acid supply opening/closing valve 34; mixing tanks 11 and 12 configured to mix pure water and sulfuric acid to produce a mixed chemical liquid and connected to a circulation line 100 having a circulation pump 101; a liquid processing unit 210 configured to perform a liquid process on a substrate W with the mixed chemical liquid. A controller 300 controls a pure water supply opening/closing valve 26, the sulfuric acid supply opening/closing valve 34, and the circulation pump 101, such that operation of the circulation pump 101 is started after starting supply of the pure water to the mixing tanks 11 and 12, and then, supply of sulfuric acid to the mixing tanks 11 and 12 is started.Type: GrantFiled: February 21, 2013Date of Patent: September 27, 2016Assignee: TOKYO ELECTRON LIMITEDInventors: Hiroshi Komiya, Kazuyoshi Eshima
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Publication number: 20150131403Abstract: A substrate liquid processing apparatus includes a tank; a circulation line; a processing unit connected to the circulation line through a branch line and configured to perform a liquid processing on a substrate using a processing liquid flowing through the circulation line; a processing liquid producing mechanism configured to produce the processing liquid by mixing at least two kinds of raw material liquids supplied from respective raw material liquid sources at a controlled mixing ratio; a concentration measuring device configured to measure a concentration of the processing liquid flowing through the circulation line and a concentration of the processing liquid flowing through the processing liquid supply line; and a control device configured to control the processing liquid producing mechanism based on the measured concentrations of the processing liquid.Type: ApplicationFiled: November 10, 2014Publication date: May 14, 2015Inventors: Yasuhiro Takaki, Hiroshi Komiya, Chikara Nobukuni, Keigo Satake, Atsushi Anamoto