Abstract: A semiconductor device, comprising a semiconductor chip; a pad electrode; an electrode portion; a wiring portion. An insulating portion is formed from electrically insulating material, covering the surface of the semiconductor chip and sealing the sensor element, wiring portion and electrode portion, in a state which exposes at least the electrode portion on the surface of the semiconductor chip. The electrode portion is placed in a position which does not overlap with the sensor element in the thickness direction of the semiconductor chip.

Abstract: A semiconductor device, comprising a semiconductor chip; a pad electrode; an electrode portion; a wiring portion. An insulating portion is formed from electrically insulating material, covering the surface of the semiconductor chip and sealing the sensor element, wiring portion and electrode portion, in a state which exposes at least the electrode portion on the surface of the semiconductor chip. The electrode portion is placed in a position which does not overlap with the sensor element in the thickness direction of the semiconductor chip.

Abstract: A plurality of IC regions are formed on a semiconductor wafer, which is cut into individual chips incorporating ICs, wherein wiring layers and insulating layers are sequentially formed on a silicon substrate. In order to reduce height differences between ICs and scribing lines, a planar insulating layer is formed to cover the overall surface with respect to ICs, seal rings, and scribing lines. In order to avoid occurrence of breaks and failures in ICs, openings are formed to partially etch insulating layers in a step-like manner so that walls thereof are each slanted by prescribed angles ranging from 20° to 80°. For example, a first opening is formed with respect to a thin-film element section, and a second opening is formed with respect to an external-terminal connection pad.

Abstract: Disclosed is a method of molding a resin coated bearing. When a molten resin is injected toward a substantially central portion of a disk space of forming dies from a sprue formed on an upper die, the molten resin is filled into a cavity through a film gate after the molten resin is led to the disk space from a pin gate, so that any weld is absent on a resin member, which covers an outer race, thus enabling uniformizing a coating member in resin strength and suppressing generation of crack on the coating member even at the time of high loading. Also, since the film gate formed on a whole peripheral edge of the disk space is formed from a lower die and an upper die, there is an advantage that after working suffices to take out a resin coated bearing from the both dies and to cut a runner in the disk space.

Abstract: A semiconductor device, comprising a semiconductor chip; a pad electrode; an electrode portion; a wiring portion. An insulating portion is formed from electrically insulating material, covering the surface of the semiconductor chip and sealing the sensor element, wiring portion and electrode portion, in a state which exposes at least the electrode portion on the surface of the semiconductor chip. The electrode portion is placed in a position which does not overlap with the sensor element in the thickness direction of the semiconductor chip.

Abstract: A small-size magnetic sensor comprises three axial sensors each configured using plural giant magnetoresistive elements, wherein an X-axis sensor and a Y-axis sensor are arranged on the planar surface of an embedded layer of a substrate, and giant magnetoresistive elements forming a Z-axis sensor are formed on slopes of projections, which are formed by etching the embedded layer. It is possible to form an elongated projection on a substrate by way of the high-density plasma CVD method or by way of plasma etching and microwave etching, so that giant magnetoresistive elements are formed on the slopes of the elongated projection.

Abstract: In order to provide a guide roller which can be readily mounted on a support member and readily adjusted in position without reducing strength of a support shaft, according to the invention, when inserting a screw part of the shaft through a long hole of the support member and fixing the shaft by a nut on a back side, the screw part is inserted while contacting notched planes with contact parts, and an insertion position of the screw part is made adjustable in the long hole. It is possible, without necessity to form an engaging part for calking in the columnar shaped support shaft, to prevent reduction in strength of the guide roller, to position the guide roller with respect to a rail only by screwing the guide roller to the support member after previously fixing the support member to the slide door, and to make the operation efficient.

Abstract: A bearing type of guide roller capable of being reliably prevented from falling off a rail is provided. A guide roller is constituted from a support shaft fixed to a support member by caulking, a ring-shaped outer ring made of bearing steel disposed to surround an outer periphery of the support shaft via a plurality of bearings, a covering member made of synthetic resin covering an outer peripheral surface of the outer ring. The ring-shaped outer ring has a flange part integrally formed on an upper end of the outer peripheral surface thereof, and an upper end of the support shaft projects from an upper end surface of the ring-shaped outer ring. Therefore, even if the covering member is broken, the flange part interferes with the rail, so that falling off of the guide roller from the rail can be more reliably prevented.

Abstract: A semiconductor device, comprising a semiconductor chip; a pad electrode; an electrode portion; a wiring portion. An insulating portion is formed from electrically insulating material, covering the surface of the semiconductor chip and sealing the sensor element, wiring portion and electrode portion, in a state which exposes at least the electrode portion on the surface of the semiconductor chip. The electrode portion is placed in a position which does not overlap with the sensor element in the thickness direction of the semiconductor chip.

Abstract: A plurality of IC regions are formed on a semiconductor wafer, which is cut into individual chips incorporating ICs, wherein wiring layers and insulating layers are sequentially formed on a silicon substrate. In order to reduce height differences between ICs and scribing lines, a planar insulating layer is formed to cover the overall surface with respect to ICs, seal rings, and scribing lines. In order to avoid occurrence of breaks and failures in ICs, openings are formed to partially etch insulating layers in a step-like manner so that walls thereof are each slanted by prescribed angles ranging from 20° to 80°. For example, a first opening is formed with respect to a thin-film element section, and a second opening is formed with respect to an external-terminal connection pad.

Abstract: A sacrificial film is formed on a substrate and a mask layer is formed on the sacrificial film. An opening having a predetermined pattern is formed through the mask layer. The sacrificial film exposed in the opening is removed to form a cave broader than the opening on the substrate. A noble metal thin film is deposited on the whole substrate surface. The sacrificial film 12 is dissolved and removed to form a noble metal thin film pattern.

Abstract: A sacrificial film is formed on a substrate and a mask layer is formed on the sacrificial film. An opening having a predetermined pattern is formed through the mask layer. The sacrificial film exposed in the opening is removed to form a cave broader than the opening on the substrate. A noble metal thin film is deposited on the whole substrate surface. The sacrificial film 12 is dissolved and removed to form a noble metal thin film pattern.

Abstract: The present invention relates to a resin composition for foam, which is used as a packing cushioning material, and an object thereof is to provide said composition which has biodegradability and is made from a principal raw material, lactic acid capable of contributing to the protection of global environment. The object can be attained by a resin composition having biodegradability and expandability, comprising a high-molecular weight polylactic acid having a melt viscosity of 0.01 to 50 in terms of a melt index value (MI), characterized in that said resin composition is prepared by compounding 0.1 to 5% by weight of at least one compound, which is selected from a polyisocyanate having an isocyanate group of not less than 2.0 equivalents/mol, an epoxy compound having an epoxy group of more than 2.0 equivalents/mol and an acid anhydride having an anhydrous carboxyl group of more than 2.

Abstract: A method of manufacturing a semiconductor device includes the steps of: a) forming a wiring layer on a semiconductor substrate, the wiring layer being an Al or Al alloy layer, or a laminated wiring layer including an Al or Al alloy layer and a Ti or Ti alloy layer formed thereon; b) coating a resist layer on the wringing layer and patterning the resist layer to form a wiring resist pattern; c) patterning the wiring layer to form a wiring pattern 3 by using the wiring resist pattern as a mask; d) forming an interlayer insulating film 5 on the semiconductor substrate to cover the wiring pattern; e) coating a resist layer on the interlayer insulating film and patterning the resist layer to form a connection hole resist pattern 6; f) dry-etching the interlayer insulating film with an etching gas containing fluorine to form a connection hole reaching the wiring pattern 3, by using the connection hole resist pattern as a mask; g) after the step f), rinsing the semiconductor substrate in a liquid 10 made of a materi

Abstract: Disclosed is a film constituted of a polyester, said film having a degree of roll set curl of not higher than 135 m.sup.-1 after being subjected to heat treatment, and having a degree of recovery curl of not higher than 45 m.sup.-1 after being subjected to hot water bath treatment.

Abstract: An apparatus and method in which a data base used in a hypertext is created by dividing given data into nodes and spreading links between the nodes according to a predetermined rule, errors in the process of dividing the data into nodes can be found and corrected before creating links, and links are created with respect to the corrected nodes.

Abstract: A support for photographic use comprised of at least two polyester layers is disclosed, which comprises a first layer containing a first polyester and a second layer containing a second polyester adjacent to the first layer, the first polyester comprising a first monomer unit from a polyalkylene glycol and a second monomer unit from an aromatic dicarboxylic acid having a metal sulfonate group, wherein the difference between the second monomer unit content of the first polyester and that of the second polyester, .DELTA.SIP is not more than 5.5 mol %, the second monomer unit content being expressed based on the total content of monomer units from dicarboxylic acids contained in the polymer.

Abstract: A transparent storage stable acidic beverage or other alimentary product containing casein phosphopeptide is obtained by reacting casein with trypsin, precipitating insoluble components at acid pH, adding a divalent cation such as calcium to the reaction medium, recovering the reaction product, and adding the casein phosphopeptide to a mixture to produce a beverage or product having beneficial solubilizing effects on calcium.

Abstract: Disclosed is a support for a photographic material which comprises a multilayer film in which a layer of a copolymerized polyester is laminated on at least one surface of a polyester layer, wherein the copolymerized polyester contains an aromatic dicarboxylic acid having a metal sulfonate group as a copolymer component in an amount of 2 to 7 mole % based on all ester bond units and further a polyalkylene glycol as a copolymer component in an amount of 3 to 10% by weight based on the total weight of a polyester which is a reaction product.

Abstract: Disclosed is a film constituted of a polyester, said film having a degree of roll set curl of not higher than 135 m.sup.-1 after being subjected to heat treatment, and having a degree of recovery curl of not higher than 45 m.sup.-1 after being subjected to hot water bath treatment.