Abstract: A semiconductor sensor includes a circuit board; a pedestal including stacked board-composing materials arranged sequentially on the circuit board and describing a mesh shape on the circuit board, the mesh shape including at least one central opening in which the circuit board is exposed; and a sensing element fixed to and supported on the pedestal as a cantilever.

Abstract: A semiconductor sensor provided with a planar circuit board and a resin package for protecting the circuit board. Further, a sensing element is mounted on the circuit board and outer electrodes are attached to a side edge portion of the circuit board. Moreover, includes the resin package, a groove, in which the circuit board is disposed. Thus the semiconductor sensor can be easily fabricated. Consequently, the manufacturing cost of a product or sensor can be reduced.

Abstract: A microwave sensor includes a case 1 of an object apparatus in which a discharge may occur; the object apparatus 2; an antenna 3 which is attached to the object apparatus case 1 and receives a microwave signal generated by a discharge; a signal processing unit 4 which is connected to the antenna 3, amplifies and detects the microwave signal, and amplifies the detected video signal; and an output terminal 13 through which the video signal is output.

Abstract: A semiconductor sensor in a sealed cap package includes a sensing device for transducing a physical quantity into an electrical signal, a stem on which the sensing device is mounted, the stem including through holes in which electrically conducting leads are respectively mounted with electrically insulating sealing members, a cap covering the sensing device and mounted on the stem, and at least one rod extending from a back surface of the stem parallel to the leads for securing the semiconductor sensor to a mount.

Abstract: A device for applying flux to the rear of a printed circuit board loaded with electronic parts on the front thereof and being transported by spraying the flux. The device has a single nozzle which is movable in a reciprocating motion in a direction perpendicular to the moving direction of the circuit board, thereby applying flux to the entire rear surface of the circuit board in a uniform distribution. The range of reciprocation of the nozzle is controlled on the basis of data generated by a sensor which is responsive to the width of the circuit board in transport. A flux feeding device capable of adjusting the amount of flux to be sprayed from the nozzle and a device for preventing the nozzle from being stopped up are associated with the flux applying device.

Abstract: Cracks in solder connecting terminal leads of an IC to a circuit board are prevented by reducing the stress due to the difference in the coefficients of thermal expansion of a pair of IC packages mounted on opposite surfaces of a circuit board and the circuit board. In this invention, the position of an IC package mounted on the upper surface of a circuit board is spaced from the position of an IC package mounted on the lower surface of the circuit board. Alternatively, the IC packages are mounted on the upper and lower surfaces in directions which are substantially orthogonal. Alternatively, the IC packages are mounted such that the positions of lead portions of one of the upper IC packages are spaced from the positions of the lead portions of the other IC package by a distance which is at least 2.4 times the thickness of the circuit board.

Abstract: In a semiconductor pressure sensor, a dam which prevents a sheathing resin from flowing into a diaphragm portion during the molding of the sheathing resin is disposed on the outer periphery of piezoresistors and the diaphragm portion on the surface of a semiconductor pressure sensor chip. The volume of the base and that of the semiconductor pressure sensor chip are adjusted so that a tensile force exerted upon the semiconductor pressure sensor chip by the base cancels a compressive force exerted upon the semiconductor pressure sensor by the sheathing resin when the temperature of the semiconductor pressure sensor returns to an ordinary room temperature from a high temperature. As a result, strain is not caused in the semiconductor pressure sensor chip, and therefore measurements of pressure with a high degree of accuracy can be performed.

Abstract: A thermal record printer head to be used in a thermal record printer, in which a resistive exothermic layer is formed in the front surface of a semiconductor substrate to be adjacent to a thermosensitive record medium and low resistance regions in parts of the back surface to be continuous to the one in the front surface by impurity diffusion, and respective electrodes are attached to the impurity diffusion regions in the back surface thereby enabling high temperature heating, a high thermal response speed and also good productivity, and a method of making the same.