Abstract: A radio communication apparatus includes a plurality of antennas, a radio transmission unit configured to execute radio transmission processing on data to be transmitted from the plurality of antennas, and a processor connected to the radio transmission unit. The processor executes a process including acquiring beam group specification information that specifies a beam group that is capable of being formed when the data to be transmitted is transmitted, forming at least one beam included in the beam group, and correcting an envelope of a beam group using correction factors, the beam group including the at least one beam formed, the correction factors corresponding to the beam group specification information.

Abstract: An image forming apparatus to which a toner container is detachably mountable includes a mounting portion to which the toner container is detachably mountable and which includes a receiving port for receiving toner supplied from the toner container, a passage for permitting passing of the toner received through the receiving port and provided with a through hole, and a filter portion provided so as to cover the through hole and for permitting passing of air; and an accommodating portion configured to accommodate the toner received through the receiving port. At least a part of the through hole overlaps with the receiving port as viewed in a horizontal direction perpendicular to a direction of gravitation.

Abstract: A system includes an authentication server that executes authentication processing via one or more biometric authentication methods. The system detects, in response to a request for proxy work, authentication target data related to biometric information from data acquired at a location where the request for the proxy work is issued. The system executes additional authentication processing, by comparing feature data of biometric information corresponding to a proxy executor included in proxy setting and the detected authentication target data. The system manages a status of the proxy work to be executed in a case where the additional authentication processing is successful.

Abstract: [Object] Provided is a method of manufacturing a lead frame capable of forming connection terminals in a plurality of rows around a circuit chip without requiring a complex manufacturing process and many processes. [Solving Means] The method of manufacturing a lead frame includes attaching a tape member to a lead frame member including at least a lead frame rim. A lead frame part including at least one of a die pad or a connection terminal is mounted on the tape member in the lead frame rim.

Abstract: Provided is a coating film transfer tool comprising an external cassette and an internal cassette housed in the external cassette. The internal cassette includes a supply portion configured to supply transfer tape having a coating film on substrate tape. A pressing and transferring portion is configured to transfer the coating film to a film receiving surface by pressing the transfer tape against the film receiving surface, a take-up portion is configured to take up the substrate tape after the coating film is transferred, and a rotation-in-conjunction mechanism is configured to rotate the supply portion and the take-up portion in conjunction with each other. The external cassette includes a button and an elastic member. The pressing and transferring portion sticks out of the external cassette by the button being pressed, and the pressing and transferring portion retracts into the external cassette by the pressing of the button being stopped.

Abstract: A semiconductor unit includes: a first device substrate including a first semiconductor substrate and a first wiring layer, in which the first wiring layer is provided on one surface side of the first semiconductor substrate; a second device substrate including a second semiconductor substrate and a second wiring layer, in which the second device substrate is bonded to the first device substrate, and the second wiring layer is provided on one surface side of the second semiconductor substrate; a through-electrode penetrating the first device substrate and a part or all of the second device substrate, and electrically connecting the first wiring layer and the second wiring layer to each other; and an insulating layer provided in opposition to the through-electrode, and penetrating one of the first semiconductor substrate and the second semiconductor substrate.

Abstract: A photoelectric module of the present disclosure includes an optical device including an optical function element array made of a first base material, and a plurality of light emitting/receiving elements made of a second base material, wherein the optical function element array includes an optical substrate and a plurality of optical function elements, the optical substrate having a first surface and a second surface, and the optical function elements being integrated with the optical substrate and being arranged one-dimensionally or two-dimensionally, and the light emitting/receiving elements and their respective optical function elements face each other with the optical substrate in between to be located on a same axis in a direction perpendicular to the optical substrate, and the light emitting/receiving elements are disposed on the second surface with a space in between while being separated in units of a smaller number than array number in the optical function element array.

Abstract: There is provided a method for manufacturing a wiring substrate with a through electrode, the method including providing a device substrate having a through hole, an opening of the through hole being blocked by a current supply path and the wiring substrate including the device substrate as a core layer with the through electrode; and disposing a first metal in the through hole to form the through electrode by electroplating, in a depth direction of the through hole, using the current supply path.

Abstract: Provided is a coating film transfer tool comprising an external cassette and an internal cassette housed in the external cassette. The internal cassette includes a supply portion configured to supply transfer tape having a coating film on substrate tape. A pressing and transferring portion is configured to transfer the coating film to a film receiving surface by pressing the transfer tape against the film receiving surface, a take-up portion is configured to take up the substrate tape after the coating film is transferred, and a rotation-in-conjunction mechanism is configured to rotate the supply portion and the take-up portion in conjunction with each other. The external cassette includes a button and an elastic member. The pressing and transferring portion sticks out of the external cassette by the button being pressed, and the pressing and transferring portion retracts into the external cassette by the pressing of the button being stopped.

Abstract: A system includes an authentication server that executes authentication processing via one or more biometric authentication methods. The system detects, in response to a request for proxy work, authentication target data related to biometric information from data acquired at a location where the request for the proxy work is issued. The system executes additional authentication processing, by comparing feature data of biometric information corresponding to a proxy executor included in proxy setting and the detected authentication target data. The system manages a status of the proxy work to be executed in a case where the additional authentication processing is successful.

Abstract: A semiconductor unit includes: a first device substrate including a first semiconductor substrate and a first wiring layer, in which the first wiring layer is provided on one surface side of the first semiconductor substrate; a second device substrate including a second semiconductor substrate and a second wiring layer, in which the second device substrate is bonded to the first device substrate, and the second wiring layer is provided on one surface side of the second semiconductor substrate; a through-electrode penetrating the first device substrate and a part or all of the second device substrate, and electrically connecting the first wiring layer and the second wiring layer to each other; and an insulating layer provided in opposition to the through-electrode, and penetrating one of the first semiconductor substrate and the second semiconductor substrate.

Abstract: Disclosed herein is a semiconductor device including: a first semiconductor chip having an electronic circuit section and a first connecting section formed on one surface thereof; a second semiconductor chip having a second connecting section formed on one surface thereof, the second semiconductor chip being mounted on the first semiconductor chip with the first and the second connecting sections connected to each other by a bump; a dam formed to fill a gap between the first and the second semiconductor chips on a part of an outer edge of the second semiconductor chip, the part of the outer edge being on a side of a region of formation of the electronic circuit section; and an underfill resin layer filled into the gap, protrusion of the resin layer from the outer edge of the second semiconductor chip to a side of the electronic circuit section being prevented by the dam.

Abstract: There is provided a method for manufacturing a wiring substrate with a through electrode, the method including providing a device substrate having a through hole, an opening of the through hole being blocked by a current supply path and the wiring substrate including the device substrate as a core layer with the through electrode; and disposing a first metal in the through hole to form the through electrode by electroplating, in a depth direction of the through hole, using the current supply path.

Abstract: A semiconductor unit includes: a first device substrate including a first semiconductor substrate and a first wiring layer, in which the first wiring layer is provided on one surface side of the first semiconductor substrate; a second device substrate including a second semiconductor substrate and a second wiring layer, in which the second device substrate is bonded to the first device substrate, and the second wiring layer is provided on one surface side of the second semiconductor substrate; a through-electrode penetrating the first device substrate and a part or all of the second device substrate, and electrically connecting the first wiring layer and the second wiring layer to each other; and an insulating layer provided in opposition to the through-electrode, and penetrating one of the first semiconductor substrate and the second semiconductor substrate.

Abstract: Disclosed herein is a semiconductor device including: a first semiconductor chip having an electronic circuit section and a first connecting section formed on one surface thereof; a second semiconductor chip having a second connecting section formed on one surface thereof, the second semiconductor chip being mounted on the first semiconductor chip with the first and the second connecting sections connected to each other by a bump; a dam formed to fill a gap between the first and the second semiconductor chips on a part of an outer edge of the second semiconductor chip, the part of the outer edge being on a side of a region of formation of the electronic circuit section; and an underfill resin layer filled into the gap, protrusion of the resin layer from the outer edge of the second semiconductor chip to a side of the electronic circuit section being prevented by the dam.

Abstract: [Object] To provide an electronic device, a part mounting board, and an electronic apparatus that are capable of preventing warpage of a board from occurring. [Solving Means] An electronic device according to an embodiment of the present technology includes a first circuit board and a second circuit board. The first circuit board includes a first main surface, a second main surface, and a plurality of external terminals. The plurality of external terminals include a first terminal group located at an outermost periphery of the first main surface, and are arranged on the first main surface in a matrix pattern. The second circuit board includes a terminal surface facing the second main surface, and a plurality of connection terminals. The plurality of connection terminals include a second terminal group that is arranged on the terminal surface and faces at least a part of the first terminal group, and are electrically connected to the second main surface.

Abstract: In an information processing apparatus according to this invention, a plurality of pieces of batch setting information each configured by a plurality of pieces of print setting information are registered in advance. A setting of print setting information, use of which is inhibited, of the plurality of pieces of print setting information is accepted. Batch setting information including the print setting information, use of which is inhibited, is specified from the plurality of pieces of batch setting information. Then, a setting screen which allows the user to select pieces of non-specified batch setting information, and does not allow the user to select the specified batch setting information is displayed.

Abstract: Disclosed herein is a semiconductor device including: a first semiconductor chip having an electronic circuit section and a first connecting section formed on one surface thereof; a second semiconductor chip having a second connecting section formed on one surface thereof, the second semiconductor chip being mounted on the first semiconductor chip with the first and the second connecting sections connected to each other by a bump; a dam formed to fill a gap between the first and the second semiconductor chips on a part of an outer edge of the second semiconductor chip, the part of the outer edge being on a side of a region of formation of the electronic circuit section; and an underfill resin layer filled into the gap, protrusion of the resin layer from the outer edge of the second semiconductor chip to a side of the electronic circuit section being prevented by the dam.

Abstract: A photoelectric module of the present disclosure includes an optical device including an optical function element array made of a first base material, and a plurality of light emitting/receiving elements made of a second base material, wherein the optical function element array includes an optical substrate and a plurality of optical function elements, the optical substrate having a first surface and a second surface, and the optical function elements being integrated with the optical substrate and being arranged one-dimensionally or two-dimensionally, and the light emitting/receiving elements and their respective optical function elements face each other with the optical substrate in between to be located on a same axis in a direction perpendicular to the optical substrate, and the light emitting/receiving elements are disposed on the second surface with a space in between while being separated in units of a smaller number than array number in the optical function element array.

Abstract: A sensor device and an electronic apparatus by which downsizing and a reduction in costs can be achieved is provided. A sensor device according to an embodiment of the present technology includes a sensor element and a semiconductor element. The semiconductor element includes a first surface, a second surface, and a via-hole. The first surface includes a first terminal on which the sensor element is mounted and is an inactive surface. The second surface includes a second terminal for external connection and is an active surface. The via-hole electrically connects the first surface and the second surface to each other.