Abstract: Disclosed herein is a semiconductor device including: a first semiconductor chip having an electronic circuit section and a first connecting section formed on one surface thereof; a second semiconductor chip having a second connecting section formed on one surface thereof, the second semiconductor chip being mounted on the first semiconductor chip with the first and the second connecting sections connected to each other by a bump; a dam formed to fill a gap between the first and the second semiconductor chips on a part of an outer edge of the second semiconductor chip, the part of the outer edge being on a side of a region of formation of the electronic circuit section; and an underfill resin layer filled into the gap, protrusion of the resin layer from the outer edge of the second semiconductor chip to a side of the electronic circuit section being prevented by the dam.

Abstract: A photoelectric module of the present disclosure includes an optical device including an optical function element array made of a first base material, and a plurality of light emitting/receiving elements made of a second base material, wherein the optical function element array includes an optical substrate and a plurality of optical function elements, the optical substrate having a first surface and a second surface, and the optical function elements being integrated with the optical substrate and being arranged one-dimensionally or two-dimensionally, and the light emitting/receiving elements and their respective optical function elements face each other with the optical substrate in between to be located on a same axis in a direction perpendicular to the optical substrate, and the light emitting/receiving elements are disposed on the second surface with a space in between while being separated in units of a smaller number than array number in the optical function element array.

Abstract: A sensor device and an electronic apparatus by which downsizing and a reduction in costs can be achieved is provided. A sensor device according to an embodiment of the present technology includes a sensor element and a semiconductor element. The semiconductor element includes a first surface, a second surface, and a via-hole. The first surface includes a first terminal on which the sensor element is mounted and is an inactive surface. The second surface includes a second terminal for external connection and is an active surface. The via-hole electrically connects the first surface and the second surface to each other.

Abstract: In a data providing server, whether or not specified compressed content data generated by means of a specified compression coding method corresponding to terminal identification information has been stored in a content database is detected, according to content specifying data transmitted from a portable dedicated terminal. If the specified compressed content data has been stored, the data providing server reads and transmits this to the portable dedicated terminal. And if the specified compressed content data has not been stored, the data providing server generates the specified compressed content data by means of the specified compression coding method, and transmits this to the portable dedicated terminal.

Abstract: A content providing apparatus previously receives customer identification information and content identification information as customer reservation information via a terminal device, and sends customer desired content data corresponding to the content identification information to a content obtaining apparatus, so as to provide a customer with the customer desired content data via the content obtaining apparatus more easily, thus making it possible to significantly improve the usability of a content obtaining/providing system.

Abstract: A content providing apparatus previously receives customer identification information and content identification information as customer reservation information via a terminal device, and sends customer desired content data corresponding to the content identification information to a content obtaining apparatus, to provide a customer with the customer desired content data via the content obtaining apparatus more easily, thus making it possible to significantly improve the usability of a content obtaining/providing system.

Abstract: Disclosed herein is a semiconductor device including: a first semiconductor chip having an electronic circuit section and a first connecting section formed on one surface thereof; a second semiconductor chip having a second connecting section formed on one surface thereof, the second semiconductor chip being mounted on the first semiconductor chip with the first and the second connecting sections connected to each other by a bump; a dam formed to fill a gap between the first and the second semiconductor chips on a part of an outer edge of the second semiconductor chip, the part of the outer edge being on a side of a region of formation of the electronic circuit section; and an underfill resin layer filled into the gap, protrusion of the resin layer from the outer edge of the second semiconductor chip to a side of the electronic circuit section being prevented by the dam.

Abstract: A sensor device and an electronic apparatus by which downsizing and a reduction in costs can be achieved is provided. A sensor device according to an embodiment of the present technology includes a sensor element and a semiconductor element. The semiconductor element includes a first surface, a second surface, and a via-hole. The first surface includes a first terminal on which the sensor element is mounted and is an inactive surface. The second surface includes a second terminal for external connection and is an active surface. The via-hole electrically connects the first surface and the second surface to each other.

Abstract: In a data providing server 1101, whether or not specified compressed content data D51 generated by means of a specified compression coding method corresponding to terminal identification information has been stored in a content database 1113 is detected, according to content specifying data D53 transmitted from a portable dedicated terminal 1104. If the specified compressed content data D51 has been stored, the data providing server 1101 reads and transmits this to the portable dedicated terminal 1104. And if the specified compressed content data D51 has not been stored, the data providing server 1101 generates the specified compressed content data D51 by means of the specified compression coding method, and transmits this to the portable dedicated terminal 1104. Thereby, the specified compressed content data D51 generated by means of a specified decoding method can be properly provided to the portable dedicated terminal 1104, and the user can easily view a content based on the content data.

Abstract: Disclosed herein is a semiconductor device including: a first semiconductor chip having an electronic circuit section and a first connecting section formed on one surface thereof; a second semiconductor chip having a second connecting section formed on one surface thereof, the second semiconductor chip being mounted on the first semiconductor chip with the first and the second connecting sections connected to each other by a bump; a dam formed to fill a gap between the first and the second semiconductor chips on a part of an outer edge of the second semiconductor chip, the part of the outer edge being on a side of a region of formation of the electronic circuit section; and an underfill resin layer filled into the gap, protrusion of the resin layer from the outer edge of the second semiconductor chip to a side of the electronic circuit section being prevented by the dam.

Abstract: A solid-state imaging device includes a substrate in which a plurality of pixels including photoelectric converters are formed, a wiring layer that includes wirings in a plurality of layers formed via an interlayer insulating film in a front surface side of the substrate, a base electrode pad portion that includes a portion of the wirings formed in the wiring layer, an opening that penetrates the substrate from a rear surface side of the substrate and reaches the base electrode pad portion, and an embedded electrode pad layer that is formed so as to be embedded in the opening by electroless plating.

Abstract: A remote handling apparatus includes a joystick device, a load lifting device and a counterforce controller. The joystick device includes a counterforce generator that generates operation counterforce via a stick that accepts manual operation. The counterforce controller includes a pulsed counterforce controller and/or a deviation counterforce controller. The pulsed counterforce controller calculates a time rate of change of a dynamic load value of the load object, and outputs a counterforce command signal indicating a counterforce command value for generating pulsed counterforce. The deviation counterforce controller calculates a deviation amount of a dynamic load value from a static load value, and outputs a counterforce command signal indicating a counterforce command value for generating a counterforce. Embodiments may be implemented as an auxiliary apparatus, which is attached to an existing remote handling apparatus.

Abstract: A semiconductor unit includes: a first device substrate including a first semiconductor substrate and a first wiring layer, in which the first wiring layer is provided on one surface side of the first semiconductor substrate; a second device substrate including a second semiconductor substrate and a second wiring layer, in which the second device substrate is bonded to the first device substrate, and the second wiring layer is provided on one surface side of the second semiconductor substrate; a through-electrode penetrating the first device substrate and a part or all of the second device substrate, and electrically connecting the first wiring layer and the second wiring layer to each other; and an insulating layer provided in opposition to the through-electrode, and penetrating one of the first semiconductor substrate and the second semiconductor substrate.

Abstract: A semiconductor unit includes: a first device substrate including a first semiconductor substrate and a first wiring layer, in which the first wiring layer is provided on one surface side of the first semiconductor substrate; a second device substrate including a second semiconductor substrate and a second wiring layer, in which the second device substrate is bonded to the first device substrate, and the second wiring layer is provided on one surface side of the second semiconductor substrate; a through-electrode penetrating the first device substrate and a part or all of the second device substrate, and electrically connecting the first wiring layer and the second wiring layer to each other; and an insulating layer provided in opposition to the through-electrode, and penetrating one of the first semiconductor substrate and the second semiconductor substrate.

Abstract: A semiconductor apparatus, including: a semiconductor component; a Cu stud bump that is formed on the semiconductor component; and a solder bump configured to electrically connect to the Cu stud bump.

Abstract: A semiconductor apparatus, including: a semiconductor component; a Cu stud bump that is formed on the semiconductor component; and a solder bump configured to electrically connect to the Cu stud bump.

Abstract: A semiconductor device includes: a solder bump including a barrier metal layer formed on an electrode pad portion of a substrate, and a solder layer formed at a central portion of an upper surface of the barrier metal layer so as to have a smaller outer diameter than that of the barrier metal layer.

Abstract: An information processing apparatus receives distribution of information of a server device which manages an image output device as an input destination of a print job, and automatically registers the server device as an output destination of a printing instruction. A computer device, which issues a printing instruction via a network to cause an image output device to execute a print job, makes an acquisition request of device management information to be updated, to a computer management device which manages the device management information including information regarding an output destination of the printing instruction issued by the computer device, and acquires the device management information to be updated. The computer device registers a cloud service server device as the output destination of the printing instruction based on information regarding the cloud service server device included in the device management information to be updated.

Abstract: A remote handling apparatus includes a joystick device, a load lifting device and a counterforce controller. The joystick device includes a counterforce generator that generates operation counterforce via a stick that accepts manual operation. The counterforce controller includes a pulsed counterforce controller and/or a deviation counterforce controller. The pulsed counterforce controller calculates a time rate of change of a dynamic load value of the load object, and outputs a counterforce command signal indicating a counterforce command value for generating pulsed counterforce. The deviation counterforce controller calculates a deviation amount of a dynamic load value from a static load value, and outputs a counterforce command signal indicating a counterforce command value for generating a counterforce. Embodiments may be implemented as an auxiliary apparatus, which is attached to an existing remote handling apparatus.

Abstract: An information processing apparatus includes a designation unit configured to designate number-of-copies information indicating a number of copies of print media to be stacked in a lump as a unit via a user interface of a printer driver, and a transmission unit configured to set an attribute of a print job based on the number-of-copies information designated by the designation unit and to transmit the set attribute to an image forming apparatus.