Patents by Inventor Hiroshi Seki

Hiroshi Seki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5494742
    Abstract: A magnetic recording medium comprising a non-magnetic substrate, a ferromagnetic metal film formed on said non-magnetic substrate, a carbon film which is formed on said ferromagnetic metal film and in which a concentration of at least one element selected from the group consisting of silicon, phosphorus, sulfur, tin and indium is or concentrations of boron and at least one element selected from the group consisting of tin and indium are decreased in a depth direction from the surface of said carbon film, and a lubricant layer formed on said carbon film, which medium has improved running durability and corrosion resistance.
    Type: Grant
    Filed: April 12, 1994
    Date of Patent: February 27, 1996
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroshi Seki, Kenji Kuwahara, Hideyuki Ueda, Kiyosi Takahasi, Masaru Odagiri, Mikio Murai
  • Patent number: 5309021
    Abstract: A semiconductor device according to the present invention has reduced inductance on a power supply line, a grounding line, and signal lines. In this invention, to reduce the length of the power supply connection and that of the grounding connection, a power supply metal post and a grounding metal post are respectively provided on a power supply lead of a semiconductor chip and grounding lead of the semiconductor chip perpendicular to the leads. The metal posts protrude from the resin encapsulating the chip and are connected to lands or a conductive circuit pattern on a printed circuit board. Furthermore, a planar conductor commonly connecting the power supply or grounding potentials is provided.
    Type: Grant
    Filed: October 15, 1992
    Date of Patent: May 3, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Haruo Shimamoto, Jun Shibata, Toru Tachikawa, Tetsuya Ueda, Hiroshi Seki
  • Patent number: 5303120
    Abstract: A method of manufacturing inversion ICs includes the steps of connecting a first electrode pad group of a semiconductor chip to a second lead group via wires, connecting a second electrode pad group of the semiconductor chip to a first lead group via wires, sealing the semiconductor chip, the first and second lead groups, and the wires in a resin so that the outer lead portions of the leads are exposed, and bending the outer lead portions of the leads toward the bottom surface of the semiconductor chip.
    Type: Grant
    Filed: October 2, 1992
    Date of Patent: April 12, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kazunari Michii, Hiroshi Seki
  • Patent number: 5157478
    Abstract: A packaged semiconductor device includes an insulating film having an opening, a semiconductor chip disposed in the opening of the insulating film and having a plurality of electrodes, a plurality of leads, each having one end connected to a corresponding electrode, the plurality of leads being supported on the insulating film, a heat radiator disposed opposite and spaced from the semiconductor chip, and a resin package body encapsulating the semiconductor chip and part of the heat radiator, leaving a surface of the heat radiator externally exposed and the second ends of the plurality of leads extending outwardly from the package.
    Type: Grant
    Filed: December 18, 1991
    Date of Patent: October 20, 1992
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Tetsuya Ueda, Haruo Shimamoto, Yasuhiro Teraoka, Hideya Yagoura, Hiroshi Seki
  • Patent number: 5128840
    Abstract: A bicycle luminaire has first permanent magnets on spokes of a bicycle wheel, and a detection unit fixed to a stationary portion of the bicycle. The detection unit has a second permanent magnet, a Wiegand wire and a sensing coil. In place of the first magnets, Wiegand wires can be disposed on the spokes, and the detection unit can be formed with two magnets and sensing coil.
    Type: Grant
    Filed: July 6, 1990
    Date of Patent: July 7, 1992
    Inventors: Hiroshi Seki, Kazunari Maeda
  • Patent number: 5121201
    Abstract: A method and an apparatus for detecting the number of persons in which the differential pictures are converted into binary signals being affected neither by the color of the hair of the persons to be detected nor by the change in the intensity of illumination even when the contrast is small over the background floor. The shape of the picture is corrected, and the area of the picture becomes nearly uniform irrespective of the positions of the persons in the visual field of the TV camera. Moreover, a correlation value relative to the pattern of a predetermined size and a center of gravity of the picture are found while compressing the number of pixels, making it possible to detect the number of persons within a very short period of time maintaining high precision.
    Type: Grant
    Filed: August 14, 1990
    Date of Patent: June 9, 1992
    Assignee: Daido Denki Kogyo Kabushiki Kaisha
    Inventor: Hiroshi Seki
  • Patent number: 5099167
    Abstract: In a vibration wave driven motor disclosed herein, the arcuate portions of the vibration member thereof are formed into a shape in which flexural rigidity differs between the inner side and the outer side thereof, or a shape in which the torsional rigidity of the straight portions of the vibration member is made higher than the torsional rigidity of the arcuate portions, whereby a torsion component produced in the straight portions is made small by the straight portions.
    Type: Grant
    Filed: March 6, 1990
    Date of Patent: March 24, 1992
    Assignee: Canon Kabushiki Kaisha
    Inventors: Atsushi Kimura, Hiroshi Seki
  • Patent number: 5064706
    Abstract: A carrier tape includes a film having an opening for receiving a semiconductor chip to be resin-molded by a pair of mold halves and outer lead holes formed around the periphery of the opening, a plurality of leads for mounting the semiconductor chip on the film, and a resin running portion cooperating, when the mold halves are closed with the film held between the mold halves, with a gate formed on a parting surface of one of the mold halves to define a resin running path which extends from a portion of the film outside the outer lead holes to the opening for guiding a molten resin into the mold halves while preventing the resin from entering the outer lead holes.
    Type: Grant
    Filed: December 8, 1988
    Date of Patent: November 12, 1991
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Tetsuya Ueda, Haruo Shimamoto, Hideya Yagoura, Hiroshi Seki, Yasuhiro Teraoka
  • Patent number: 4839713
    Abstract: A package structure comprising a metallic cap having a bottom wall to which the bottom surface of the semiconductor chip is electrically and mechanically connected, a side wall extending from said bottom wall and surrounding the semiconductor chip, and a flange extending outwardly from said side wall substantially parallel to said bottom wall, said flange supporting the lead conductors thereon through an electrically insulating material. The electrical connection means is disposed between the metallic cap flange and the lead conductor for establishing an electrical connection therebetween. The electrical connection means may comprise an electrically conductive projection formed on the flange of the metal cap, extending through a notch in the insulating material and electrically connected to the lead conductor.
    Type: Grant
    Filed: February 17, 1988
    Date of Patent: June 13, 1989
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yasuhiro Teraoka, Tetsuya Ueda, Hideya Yagoura, Haruo Shimamoto, Shigeyuki Nango, Toshinobu Banjo, Hiroshi Seki
  • Patent number: 4704370
    Abstract: A sealing glass composition comprising from 75 to 50% by volume of low-melting glass powder containing PbO as the main component, from 20 to 45% by volume of ceramics powder having a thermal expansion coefficient of at most 30.times.10.sup.-7 .degree. C..sup.-1 in a range of from room temperature to 300.degree. C. and from 5 to 30% by volume of TiO.sub.2 -SnO.sub.2 solid solution powder.
    Type: Grant
    Filed: November 3, 1983
    Date of Patent: November 3, 1987
    Assignee: Iwaki Glass Company Ltd.
    Inventors: Hiroshi Seki, Toshiki Nishiyuki
  • Patent number: 4640628
    Abstract: A composite fire sensor comprising a first sensor element sensitive to a change in incident infrared rays, a second sensor element having a variable electric conductivity according to gas absorption/desorption, at least one comparator for combining the outputs of the first and second sensor elements, and a delay circuit for delaying the output of at least one of the comparators. Predetermined reference voltages are supplied to the comparators.
    Type: Grant
    Filed: July 11, 1985
    Date of Patent: February 3, 1987
    Inventors: Hiroshi Seki, Ryuichiro Kataishi
  • Patent number: 4639605
    Abstract: A fire sensor device of the type capable of detecting flame and smoke. The fire sensor device has a detector unit having a condenser lens for determining variations in the brightness of a space on the basis of variations in the illumination thereof which occur due to the movement of flames of a fire or the presence of smoke therein. The fire sensor device has two frequency-detection circuits which have different set points and to which the detector unit is connected. The frequency and amplitude of a signal output from the detector unit and the number of pulses generated by the detector unit are computed, and the presence of a fire is detected on the basis of the duration of the signal.
    Type: Grant
    Filed: April 17, 1984
    Date of Patent: January 27, 1987
    Assignee: Hiroshi Seki
    Inventors: Hiroshi Seki, Ryuichiro Kataishi
  • Patent number: 3947943
    Abstract: A machine comprises a wire station for supplying various wires, a harness board on which a cable harness is to be formed, and a harness laying head movable relative to the harness board for receiving selected one of the wires from the wire station laying the selected wire on the harness board. The wire station comprises a plurality of wire clampers for releasably clamping the respective wires with their free ends protruding approximately a predetermined length towards the harness laying head.
    Type: Grant
    Filed: July 1, 1974
    Date of Patent: April 6, 1976
    Assignee: Nippon Electric Company Limited
    Inventors: Takamasa Kokubo, Mikio Sakai, Tomohide Inada, Takashi Nakanishi, Hiroshi Seki, Hazime Yaegashi, Kouji Izumi, Morio Matsumura, Takao Nomura, Hisakazu Kato