Abstract: Provided is a method for treating scales (101) that have formed on the outer surface of a heat-conducting tube (111) and in a hole (112a) of a tube support plate (112) etc. of a steam generator of a nuclear power plant. The scales (101) are embrittled and also converted to a porous state by bringing the scales (101) into contact with a treatment solution, which contains 0.5 to 3.5 wt % of an organic acid and is at a pH of 2 to 3.5, for 2 to 30 days at 20° C. to 40° C.

Abstract: A semiconductor apparatus includes a substrate having at least one terminal, a thin semiconductor film including at least one semiconductor device, the thin semiconductor film being disposed and bonded on the substrate; and an individual interconnecting line formed as a thin conductive film extending from the semiconductor device in the thin semiconductor film to the terminal in the substrate, electrically connecting the semiconductor device to the terminal. Compared with conventional semiconductor apparatus, the invented apparatus is smaller and has a reduced material cost.

Abstract: A semiconductor device includes a substrate, and a semiconductor thin film bonded to the substrate, wherein the semiconductor thin film includes a plurality of discrete operating regions and an element isolating region which isolates the plurality of discrete operating regions, and the element isolating region is etched to a shallower depth than a thickness of the semiconductor thin film, and is a thinner region than the plurality of discrete operating regions.

Abstract: In a method of manufacturing a semiconductor thin film piece device, a plurality of semiconductor thin film pieces (14) are selected from among the semiconductor thin film pieces (14) formed on a first substrate (35), and bonded to a first set of predetermined area on a second substrate (12). Subsequently, a plurality of semiconductor thin film pieces are selected from the remaining semiconductor thin film pieces (14), and bonded to a second set of predetermined area.

Abstract: The present invention supplied a display apparatus using plastic substrate instead of glass substrate, which can solve such problems that the plastic substrate has a low heat conductivity and its heat release performance becomes bad so that it is difficult to obtain stable performance and reliability. In the display apparatus being formed by bonding semiconductor thin film element on a plastic substrate, a thin film metal layer is formed on surface of the semiconductor thin film element for promoting heat release.

Abstract: A control system has a startup start device that generates and outputs a startup start signal that starts a startup of a vehicle based on an operation of starting up the vehicle, a power supply device that supplies power to each unit of the vehicle, a central control unit that generates and outputs to a motor device for driving the vehicle, a startup command signal that starts up the motor device based on the startup start signal, a startup control unit that performs a startup control of the motor device based on the startup command signal, a drive control unit that performs a drive control of a peripheral device configuring the vehicle, a storage unit that stores first data containing initial information of the peripheral device or setting information set in advance, and a data storage control unit that performs the startup control of the motor device by the startup control unit after storing second data indicating, when the operation of starting up the vehicle is performed, a state of the peripheral device

Abstract: A semiconductor light emitting apparatus is supplied capable of providing a high performance that can optimize simultaneously both an electrical characteristic and a light emitting characteristic.

Abstract: The present invention supplied a display apparatus using plastic substrate instead of glass substrate, which can solve such problems that the plastic substrate has a low heat conductivity and its heat release performance becomes bad so that it is difficult to obtain stable performance and reliability. In the display apparatus, inner surface electrode integrated with vertical wiring between plastic substrate and thin film LED 102 is accumulated, the inner surface electrode acts as a heat release layer for releasing heat produced inside the thin film LED 102.

Abstract: Provided is a technique of effectively extracting the beams of light excited in an LED light emitter other than the light beams emitted from a light-emitting region in the direction of a light-extraction surface. A pit with a tapered sidewall is formed in a substrate. A thin-film semiconductor element is attached to the pit. Light beams emitted from a side surface of the thin-film semiconductor element are reflected by the sidewall of the thin-film semiconductor element. Achieved thereby is effective extraction of light beams other than the light beams emitted from the light-emitting region in the direction of the light-extraction surface.

Abstract: A seat control device has a first input unit for performing an operation of moving a first seat to a front side or a back side, a first drive control unit for moving the first seat to the front side or the back side based on an output of the first input unit, a second input unit for performing an operation of moving a second seat, positioned behind the first seat, to the front side or the back side, and a second drive control unit for moving the second seat to the front side or the back side based on an output of the second input unit. A control unit is arranged for prohibiting movement of the first seat and the movement of the second seat from being simultaneously carried out when the operation to move the first seat to the back side is performed at the first input unit and the operation to move the second seat to the front side is performed at the second input unit.

Abstract: A seat structure is configured to allow three passengers to be seated, respectively, in a left seat (1L), a right seat (1R), and a region striding across a boundary between the right and left seats (1R, 1L). The left seat (1L) can be slid leftward to create a walk-through space (S) between the right and left seats (1R, 1L). A headrest (1c) for a middle seat passenger seated between the right and left seats (1R, 1L) is split into right and left split headrests each supported on a top of a seat back of a corresponding seat. The middle seat passenger's left split headrest (1c-L) is moved with the left seat (1L) when sliding the left seat (1L) to allow the right and left seats (1R, 1L) to become spaced apart from each other so as to unblock the walk-through space (S).

Abstract: A patch antenna including: a dielectric substrate having a vertical through-hole and a recess that is open downward, the recess having an inner periphery greater than a diameter of the through-hole, the recess being connected to the through-hole; a radiation electrode provided on an upper surface of the dielectric substrate; a ground electrode provided on a lower surface of the dielectric substrate; and a feed pin inserted into the through-hole such that a lower end portion of the feed pin is arranged inside the recess, the feed pin electrically connected to the radiation electrode through an upper end portion of the feed pin, wherein first solder is applied to the lower end portion of the feed pin, and a lower end of the feed pin and a lower end of the first solder are flush with or above a lower surface of the ground electrode.

Abstract: The present invention provides a method of producing an alcohol-dipped material or a food or drink using the same which includes the following steps: (a) freezing one or more fruits and/or vegetables employed as a raw material; (b) micro grinding the frozen matter; and (c) dipping the micro ground matter in an alcohol having a concentration at which one or more components of the raw material can be extracted (preferably a 15% to 100% alcohol). The alcohol-dipped material thus obtained can be suitably usable as a starting alcohol drink for producing a low-alcohol drink. According to the method of the invention, the alcohol-dipped material or the food or the drink thus obtained can contain a sufficient amount of an efficacious and effective component contained in the vegetable(s) and/or fruit(s), for example, vitamin P.

Abstract: A semiconductor device and an optical print head, an image forming apparatus that has the semiconductor device are supplied capable of reduce occurrence probability of defect. The semiconductor device is formed by using semiconductor thin film bonded on the substrate, and includes a covering layer that covers at least one part region of the semiconductor thin film and covers at least one part of electroconductive member connecting with the semiconductor thin film.

Abstract: A seat structure capable of dealing with both a normal posture and a resting posture and providing sufficient relaxation in the resting posture while ensuring excellent comfortableness of an occupant. According to the present invention, a back frame 20 itself is fixed to a frame support 10 but a cushion frame 30 shifts from a first position A to a second position B according to an occupant's movement and an inclination angle of a pelvis support 31 increases accordingly. The occupant's pelvis portion and a portion lower than the pelvis portion is moved forward but a part of his or her back above his or her breast is not varied. With this structure, the same effect of the resting posture, that is, the posture in which the back frame is reclined in a conventional seat structure, can be obtained. Since the back is not tilted backward, a leg room (footrest) space in a rear seat is not limited.

Abstract: A semiconductor device includes a substrate; a first conductive type semiconductor layer disposed on a main surface of the substrate; a second conductive type semiconductor layer disposed on the first conductive type semiconductor layer; a plurality of light emitting elements; and a second conductive side wiring pattern for commonly connecting the second conductive type semiconductor layer in the light emitting elements arranged adjacently. The second conductive type semiconductor layer includes a first conductive type semiconductor connection surface and a second conductive type semiconductor connection surface between the first conductive type semiconductor layer.

Abstract: A semiconductor device includes a light-emitting layer of a first conductivity type, a second conductivity type or non-doped type, a first contact layer of the second conductivity type disposed on the light-emitting layer and supplied with a voltage via a predetermined contact, a second contact layer of the second conductivity type disposed below the light-emitting layer and supplied with a voltage via a predetermined contact, a first etching stopper layer of the first or second conductivity type disposed below the light-emitting layer and above the second contact layer, and a third contact layer of the first conductivity type disposed below the second contact layer and supplied with a voltage via a predetermined contact.

Abstract: A composite semiconductor device includes a plurality of semiconductor thin films and a substrate on which the semiconductor thin films are attached. Each semiconductor thin film includes a plurality of semiconductor elements. Each semiconductor element includes a first contact region and a second contact region. The first contact region is connected to a first electrode, and the second contact region is connected to a second electrode. The semiconductor thin film is attached to a substrate such that the plurality of semiconductor elements are aligned in a row, and such that the first contact region and the second contact region are in the row of light emitting elements.

Abstract: A composite semiconductor device includes a semiconductor thin film, a substrate, connection pads, and a light blocking layer. The semiconductor thin film includes light emitting elements. The driver circuits are formed on the substrate and the semiconductor thin film is fixed on the substrate, the driver circuit driving the light emitting element. The connection pads are formed on the substrate, electrical connection being made through which the connection pads. The light blocking layer is formed in an area between the light emitting element and the connection pad, the light blocking layer. The light blocking layer prevents light emitted from the light emitting element from reaching wires connected to the connection pad.

Abstract: A semiconductor apparatus includes a substrate having at least one terminal, a thin semiconductor film including at least one semiconductor device, the thin semiconductor film being disposed and bonded on the substrate; and an individual interconnecting line formed as a thin conductive film extending from the semiconductor device in the thin semiconductor film to the terminal in the substrate, electrically connecting the semiconductor device to the terminal. Compared with conventional semiconductor apparatus, the invented apparatus is smaller and has a reduced material cost.