Abstract: A reference voltage circuit includes a first amplifier, a first load device and a first PN junction device, second and third load devices and a second PN junction device, an offset voltage reduction circuit, a coupling node potential takeout circuit, and an area adjustment circuit. The offset voltage reduction circuit is configured to reduce an offset voltage between the first and second input terminals at the first amplifier, and the coupling node potential takeout circuit is configured to take out potentials of the first and second coupling nodes. The area adjustment circuit is configured to adjust an area of the second PN junction device in accordance with the potentials of the first and second coupling nodes which are taken out by the coupling node potential takeout circuit.

Abstract: A variable delay circuit comprising a first delay element configured to delay an input signal, a second delay element coupled to the first delay element in parallel and also configured to delay the input signal, a control current supply section configured to supply control currents for adjusting a delay amount of the first delay element and a delay amount of the second delay element, and an output signal selecting section configured to select any one of an output signal from the first delay element and an output signal from the second delay element according to a selecting signal for selecting delay time of the input signal.

Abstract: A lateral junction field effect transistor includes a first gate electrode layer arranged in a third semiconductor layer between source/drain region layers, having a lower surface extending on the second semiconductor layer, and doped with p-type impurities more heavily than the second semiconductor layer, and a second gate electrode layer arranged in a fifth semiconductor layer between the source/drain region layers, having a lower surface extending on a fourth semiconductor layer, having substantially the same concentration of p-type impurities as the first gate electrode layer, and having the same potential as the first gate electrode layer. Thereby, the lateral junction field effect transistor has a structure, which can reduce an on-resistance while maintaining good breakdown voltage properties.

Abstract: A lateral junction field effect transistor includes a first gate electrode layer arranged in a third semiconductor layer between source/drain region layers, having a lower surface extending on the second semiconductor layer, and doped with p-type impurities more heavily than the second semiconductor layer, and a second gate electrode layer arranged in a fifth semiconductor layer between the source/drain region layers, having a lower surface extending on a fourth semiconductor layer, having substantially the same concentration of p-type impurities as the first gate electrode layer, and having the same potential as the first gate electrode layer. Thereby, the lateral junction field effect transistor has a structure, which can reduce an on-resistance while maintaining good breakdown voltage properties.

Abstract: A lateral junction field effect transistor includes a first gate electrode layer arranged in a third semiconductor layer between source/drain region layers, having a lower surface extending on the second semiconductor layer, and doped with p-type impurities more heavily than the second semiconductor layer, and a second gate electrode layer arranged in a fifth semiconductor layer between the source/drain region layers, having a lower surface extending on a fourth semiconductor layer, having substantially the same concentration of p-type impurities as the first gate electrode layer, and having the same potential as the first gate electrode layer. Thereby, the lateral junction field effect transistor has a structure, which can reduce an on-resistance while maintaining good breakdown voltage properties.

Abstract: SiC is a very stable substance, and it is difficult to control the condition of a SiC surface to be suitable for crystal growth in conventional Group III nitride crystal growing apparatuses. This problem is solved as follows. The surface of a SiC substrate 1 is rendered into a step-terrace structure by performing a heating process in an atmosphere of HCl gas. The surface of the SiC substrate 1 is then treated sequentially with aqua regia, hydrochloric acid, and hydrofluoric acid. A small amount of silicon oxide film formed on the surface of the SiC substrate 1 is etched so as to form a clean SiC surface 3 on the substrate surface. The SiC substrate 1 is then installed in a high-vacuum apparatus and the pressure inside is maintained at ultrahigh vacuum (such as 10?6 to 10?8 Pa). In the ultrahigh vacuum state, a process of irradiating the surface with a Ga atomic beam 5 at time t1 at temperature of 800° C. or lower and performing a heating treatment at 800° C. or higher is repeated at least once.

Abstract: A field effect transistor comprises a SiC substrate 1, a source 3a and a drain 3b formed on the surface of the SiC substrate 1, an insulating structure comprising an AlN layer 5 formed in contact with the SiC surface and having a thickness of one molecule-layer or greater, and a SiO2 layer formed thereon, and a gate electrode 15 formed on the insulation structure. Leakage current can be controlled while the state of interface with SiC is maintained in a good condition.

Abstract: 4H—InGaAlN alloy based optoelectronic and electronic devices on non-polar face are formed on 4H—AlN or 4H—AlGaN on (11-20) a-face 4H—SiC substrates. Typically, non polar 4H—AlN is grown on 4H—SiC (11-20) by molecular beam epitaxy (MBE). Subsequently, III-V nitride device layers are grown by metal organic chemical vapor deposition (MOCVD) with 4H-polytype for all of the layers. The non-polar device does not contain any built-in electric field due to the spontaneous and piezoelectric polarization. The optoelectronic devices on the non-polar face exhibits higher emission efficiency with shorter emission wavelength because the electrons and holes are not spatially separated in the quantum well. Vertical device configuration for lasers and light emitting diodes (LEDs) using conductive 4H—AlGaN interlayer on conductive 4H—SiC substrates makes the chip size and series resistance smaller. The elimination of such electric field also improves the performance of high speed and high power transistors.

Abstract: A variable delay circuit comprising a first delay element configured to delay an input signal, a second delay element coupled to the first delay element in parallel and also configured to delay the input signal, a control current supply section configured to supply control currents for adjusting a delay amount of the first delay element and a delay amount of the second delay element, and an output signal selecting section configured to select any one of an output signal from the first delay element and an output signal from the second delay element according to a selecting signal for selecting delay time of the input signal.

Abstract: A lateral JFET has a basic structure including an n-type semiconductor layer (3) formed of an n-type impurity region and a p-type semiconductor layer formed of a p-type impurity region on the n-type semiconductor layer (3). Moreover, in the p-type semiconductor layer, there are provided a p+-type gate region layer (7) extending into the n-type semiconductor layer (3) and containing p-type impurities of an impurity concentration higher than that of the n-type semiconductor layer (3) and an n+-type drain region layer (9) spaced from the p+-type gate region layer (7) by a predetermined distance and containing n-type impurities of an impurity concentration higher than that of the n-type semiconductor layer (3). With this structure, the lateral JFET can be provided that has an ON resistance further decreased while maintaining a high breakdown voltage performance.

Abstract: A lateral junction field effect transistor includes a first gate electrode layer arranged in a third semiconductor layer between source/drain region layers, having a lower surface extending on the second semiconductor layer, and doped with p-type impurities more heavily than the second semiconductor layer, and a second gate electrode layer arranged in a fifth semiconductor layer between the source/drain region layers, having a lower surface extending on a fourth semiconductor layer, having substantially the same concentration of p-type impurities as the first gate electrode layer, and having the same potential as the first gate electrode layer. Thereby, the lateral junction field effect transistor has a structure, which can reduce an on-resistance while maintaining good breakdown voltage properties.

Abstract: A lateral junction field effect transistor includes a first gate electrode layer arranged in a third semiconductor layer between source/drain region layers, having a lower surface extending on the second semiconductor layer, and doped with p-type impurities more heavily than the second semiconductor layer, and a second gate electrode layer arranged in a fifth semiconductor layer between the source/drain region layers, having a lower surface extending on a fourth semiconductor layer, having substantially the same concentration of p-type impurities as the first gate electrode layer, and having the same potential as the first gate electrode layer. Thereby, the lateral junction field effect transistor has a structure, which can reduce an on-resistance while maintaining good breakdown voltage properties.

Abstract: On an SiC single crystal substrate, an electric field relaxation layer and a p? type buffer layer are formed. The electric field relaxation layer is formed between the p? type buffer layer and the SiC single crystal substrate to contact SiC single crystal substrate. On the p? type buffer layer, an n type semiconductor layer is formed. On the n type semiconductor layer, a p type semiconductor layer is formed. In the p type semiconductor layer, an n+ type source region layer and an n+ type drain region layer are formed separated by a prescribed distance from each other. At a part of the region of p type semiconductor layer between the n+ type source region layer and the n+ type drain region layer, a p+ type gate region layer is formed.

Abstract: Disclosed are a diboride single crystal substrate which has a cleavage plane as same as that of a nitride compound semiconductor and is electrically conductive; a semiconductor laser diode and a semiconductor device using such a substrate and methods of their manufacture wherein the substrate is a single crystal substrate 1 of diboride XB2 (where X is either Zr or Ti) which is facially oriented in a (0001) plane 2 and has a thickness of 0.1 mm or less. The substrate 1 is permitted cleaving and splitting along a (10-10) plane 4 with ease. Using this substrate to form a semiconductor laser diode of a nitride compound, a vertical structure device can be realized. Resonant planes of a semiconductor laser diode with a minimum of loss can be fabricated by splitting the device in a direction parallel to the (10-10) plane. A method of manufacture that eliminates a margin of cutting is also realized.

Abstract: A control signal that runs a control oscillator of a signal generation circuit that generates a write clock is taken as a reference signal. That reference signal is supplied to a signal generation circuit that generates a read clock. In the signal generation circuit that generates the read clock, there is no need to generate a reference signal within its own circuits, which makes it possible to supply it to a control oscillator by adding the error timing from reading out the signal against the supplied reference signal. In this way, no means for locking the read clock into the initial frequency is needed and neither is the time for locking the read clock to the initial frequency (lock up time). This makes it possible to reduce the size of the circuit and to reduce the signal read-out time.

Abstract: A susceptor used in semiconductor epitaxial growth that can simultaneously obtain a plurality of epitaxial films high in uniformity. The susceptor includes a barrel type susceptor having a plurality of surfaces on an outer side of each of which a plurality of substrates can be freely disposed, and a member that has the barrel type susceptor disposed inside thereof and surfaces each of which is oppositely disposed tilting in the same direction as each of the surfaces of the barrel type susceptor. Alternatively, a susceptor includes a barrel type susceptor having a plurality of surfaces on an inner side of each of which a plurality of substrates can be freely disposed, and a member that has the barrel type susceptor disposed at the peripheral portion thereof and surfaces each of which is oppositely disposed tilting in the same direction as each of the surfaces of the barrel type susceptor.

Abstract: A method for manufacturing a silicon carbide semiconductor device includes the steps of: forming a trench mask on an upper surface of a semiconductor substrate; forming the trench such that the trench having an aspect ratio equal to or larger than 2 and having a trench slanting angle equal to or larger than 80 degrees is formed; and removing a damage portion in such a manner that the damage portion disposed on an inner surface of the trench formed in the semiconductor substrate in the step of forming the trench is etched and removed in hydrogen atmosphere under decompression pressure at a temperature equal to or higher than 1600° C.

Abstract: To present a clock generator capable of spreading the spectrum of oscillation frequency by simple control in a small additional circuit, and its control method. A phase locked loop circuit is provided from a frequency phase comparator 11, an output clock signal PO is outputted from a voltage control oscillator (VCO) 14 by way of a charge pump circuit (CP) 12 and a loop filter (LF) 13, and is returned to the frequency phase comparator 11 by way of a frequency divider (DIV) 15. Detecting the phase difference of reference clock signal R and divided clock signal D, and locking the oscillation frequency of the output clock signal PO to specified frequency, a modulation signal M is outputted from a modulation pulse generator 1 regardless of phase locked control of phase locked loop circuit, and is superposed on phase comparison signal P, and thereby the oscillation frequency of output clock signal PO is modulated. An output clock signal PO having a predetermined spectrum spread characteristic can be obtained.

Abstract: A lateral junction field effect transistor includes a first gate electrode layer arranged in a third semiconductor layer between source/drain region layers, having a lower surface extending on the second semiconductor layer, and doped with p-type impurities more heavily than the second semiconductor layer, and a second gate electrode layer arranged in a fifth semiconductor layer between the source/drain region layers, having a lower surface extending on a fourth semiconductor layer, having substantially the same concentration of p-type impurities as the first gate electrode layer, and having the same potential as the first gate electrode layer. Thereby, the lateral junction field effect transistor has a structure, which can reduce an on-resistance while maintaining good breakdown voltage properties.

Abstract: A field effect transistor comprises a SiC substrate 1, a source 3a and a drain 3b formed on the surface of the SiC substrate 1, an insulating structure comprising an AlN layer 5 formed in contact with the SiC surface and having a thickness of one molecule-layer or greater, and a SiO2 layer formed thereon, and a gate electrode 15 formed on the insulation structure. Leakage current can be controlled while the state of interface with SiC is maintained in a good condition.