Patents by Inventor Hitoshi Yokono

Hitoshi Yokono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4347304
    Abstract: Metallic images of uniform quality can be formed on substrates having through-holes by a process using a positive type resist characterized by using as a coating solution for the substrate a solution of a photosensitive material of (a) at least one organic compound having at least one linkage of --M--M--M ).sub.n (M=Si, Ge or Sn; n=0, 1 or more) in the molecule or (b) a mixture of at least one organic compound (a) mentioned above and at least one photosensitizer, dissolved in a solvent such as a halogenated hydrocarbon, an aromatic hydrocarbon, a heterocyclic compound, or a mixture thereof, followed by irradiation with an actinic light through a photomask and electroless plating.
    Type: Grant
    Filed: June 24, 1981
    Date of Patent: August 31, 1982
    Assignee: Hitachi, Ltd.
    Inventors: Hideki Sakurai, Mitsuo Nakatani, Hitoshi Oka, Hitoshi Yokono, Tokio Isogai
  • Patent number: 4342842
    Abstract: Rigid polyurethane foams having excellent heat resistance and impact resistance can be produced with good workability due to good flow properties by using a composition comprising a polyol, a polyisocyanate, a blowing agent and a reaction accelerator as essential component, characterized by using as the polyol, a mixture of (a) an alkylene oxide adduct of 4,4'-diaminodiphenylmethane having OH value of 280-600 mg KOH/g, (b) an aliphatic polyether having a hdyroxyl value of 450-800 mg KOH/g and 3 or 4 hydroxyl groups in the molecule, and (c) a polyether having a hydroxyl value of 30 to 100 mg KOH/g and 2 or 3 hydroxyl groups in the molecule, in limited amounts.
    Type: Grant
    Filed: July 6, 1981
    Date of Patent: August 3, 1982
    Assignee: Hitachi, Ltd.
    Inventors: Yasuo Hira, Susumu Tsuzuku, Masao Gotoh, Hitoshi Yokono, Hiroshi Kaneko, Yoshihisa Hosoe
  • Patent number: 4324629
    Abstract: During recyclic use of a chemical copper plating solution, counter anions to copper ions, anions formed by oxidation of a reducing agent, and carbon dioxide by absorption of carbon dioxide from air, which all have an inhibiting effect upon the plating, and also sodium ions having no inhibiting effect are accumulated in the plating solution.These accumulated ions can be removed by electrodialysis. Particularly, regeneration can be satisfactorily regenerated by adjusting the pH of used chemical plating solution to 2-11 before the electrodialysis, and using a selectively monovalent anion permeable membrane as an anion exchange membrane at the electrodialysis.
    Type: Grant
    Filed: June 17, 1980
    Date of Patent: April 13, 1982
    Assignee: Hitachi, Ltd.
    Inventors: Hitoshi Oka, Hiroshi Kikuchi, Hitoshi Yokono, Haruo Suzuki, Toyofusa Yoshimura, Akira Matsuo, Osamu Miyazawa, Isamu Tanaka, Tokio Isogai
  • Patent number: 4321319
    Abstract: There is described photosensitive polymer composition and a polyimide film-coated material made by applying the composition to a support, irradiating with ultraviolet and thereafter heating. The photosensitive polymer composition is prepared by adding a sensitizer to a photosensitive polyamide acid intermediate solution which is obtained by reacting in an inert solvent a first compound comprising 100 to 5% by weight of a photosensitive group-containing diamine and 0 to 95% by weight of a diamine having no photosensitive group, with a second compound comprising at least one compound selected from a tetracarboxylic acid dianhydride and a tricarboxylic acid anhydride monohalide.
    Type: Grant
    Filed: May 22, 1980
    Date of Patent: March 23, 1982
    Assignee: Hitachi, Ltd.
    Inventors: Fusaji Shoji, Issei Takemoto, Hitoshi Yokono, Tokio Isogai
  • Patent number: 4310563
    Abstract: The pH of a chemical copper plating solution is exactly measured for a prolonged time by utilizing a copper oxide prepared by etching metallic copper in an 0.1-1 N inorganic acid then oxidizing the etched metallic copper in an aqueous 0.1-1 N alkali metal hydroxide solution as a main electrode for pH measurement or reducing agent concentration measurement in terms of pH.A combination of the pH measurement with well known procedures for measuring concentrations of cupric ions and a complexing agent exactly measures the pH and the concentrations of a reducing agent, cupric ions and a complexing agent for a continuation of longer time than the conventional procedures.
    Type: Grant
    Filed: October 15, 1980
    Date of Patent: January 12, 1982
    Assignee: Hitachi, Ltd.
    Inventors: Hitoshi Oka, Kenji Nakamura, Hitoshi Yokono, Tokio Isogai, Akira Matsuo, Osamu Miyazawa, Isamu Tanaka
  • Patent number: 4303443
    Abstract: When an amine compound having at least two polyolefin glycol chains in one molecule is used as a stabilizer, and an alkylene diamine compound, at least one hydrogen atom in the respective amino groups thereof being substituted by CH.sub.2 COOX (wherein X is H or Na) and another hydrogen atom in the respective amino group thereof being substituted by CH.sub.
    Type: Grant
    Filed: June 13, 1980
    Date of Patent: December 1, 1981
    Assignee: Hitachi, Ltd.
    Inventors: Osamu Miyazawa, Hitoshi Oka, Isamu Tanaka, Akira Matsuo, Hitoshi Yokono, Nobuo Nakagawa, Tokio Isogai
  • Patent number: 4303554
    Abstract: Transparent electroconductive film having no cracks and whitening is obtained by coating on a substrate a composition comprising an inorganic indium salt, a polybasic carboxylic acid or polybasic carboxylic acid anhydride and a solvent, and calcining the coated composition at a temperature of 300.degree. to 700.degree. C. under an atmosphere containing oxygen. When a tin compound is added to the composition, sheet resistance of the transparent electroconductive film can be adjusted favorably.
    Type: Grant
    Filed: June 19, 1980
    Date of Patent: December 1, 1981
    Assignees: Hitachi, Ltd., Hitachi Chemical Company, Ltd.
    Inventors: Ryoichi Sudo, Masaaki Okunaka, Hitoshi Yokono, Tokio Isogai, Mitsuo Yamazaki
  • Patent number: 4273420
    Abstract: A liquid crystal display device using an alignment film of ladder-type organosilicone polymer or cross-linking product of cross-linkable ladder-type organosilicone polymer makes a homogeneous liquid crystal orientation, irrespectively of the kind of the liquid crystal used, never lowers its orientation ability even when fusion-sealing or sealing of the liquid crystal device is made with glass or thermosetting resin, and makes a clear display owing to the alignment film being colorless. The alignment film is insoluble in the liquid crystal used.
    Type: Grant
    Filed: July 9, 1979
    Date of Patent: June 16, 1981
    Assignee: Hitachi, Ltd.
    Inventors: Takeshi Watanabe, Ryoichi Sudo, Fusaji Shoji, Issei Takemoto, Hitoshi Yokono
  • Patent number: 4211686
    Abstract: An unsaturated polyester resin composition for use in pressure molding, which comprises an unsaturated polyester resin and fillers consisting essentially of (a) calcium carbonate powder which passes a 325 mesh sieve, (b) an inorganic mineral particulate which passes a 12 mesh sieve and is retained on a 200 mesh sieve and (c) glass fibers having a length larger than 0.2 mm, wherein the ratio by weight of (a) to (b) is within a range of from 0.3 to 10, the ratio of (a)+(b) to the unsaturated polyester resin is within a range of from 1.5 to 7, and the ratio of (c) to the total weight of the resin, calcium carbonate, silica sand and glass fiber is within a range of from 0.01 to 0.25.
    Type: Grant
    Filed: February 10, 1977
    Date of Patent: July 8, 1980
    Assignee: Hitachi, Ltd.
    Inventors: Akio Nishikawa, Junichi Katagiri, Noriyuki Kinjo, Hitoshi Yokono, Tamotsu Ikeda, Tsuguo Kobayashi
  • Patent number: 4138372
    Abstract: A polymerizable, curable resin composition suitable for molding materials, prepreg, powdery paint materials or the like, which comprises a polyepoxide, a uretdione and a tetraphenyl borate-amine complex. This composition has long pot life and good curability by virtue of latent catalytic characteristics of the complex.
    Type: Grant
    Filed: January 19, 1976
    Date of Patent: February 6, 1979
    Assignee: Hitachi, Ltd.
    Inventors: Akio Nishikawa, Hitoshi Yokono, Ryuichi Simizu, Junji Mukai
  • Patent number: 4128527
    Abstract: In a dynamoelectric machine having a stator assembly of coil windings and a core, a heat-dissipating, electro-insulative housing encapsulates the coil windings and the core. The housing is made of a cured molded article or material formed of a resin-filler composition which comprises a liquid unsaturated polyester resin, a finely divided calcium carbonate powder, an inorganic mineral particulate having a particle size larger than that of the calcium carbonate powder, and a chopped glass fiber, wherein the ratio by weight of the calcium carbonate to the mineral particulate is 0.3 to 4, the ratio of the weight of glass fiber to the total weight of the composition is 0.05 to 0.25, the ratio of the weight of the polyester resin to the total weight of the composition is 0.1 to 0.4 and the weight ratio of the calcium carbonate powder, the mineral particulate and the glass fiber to the total weight of the composition is 0.6 to 0.9.
    Type: Grant
    Filed: April 13, 1977
    Date of Patent: December 5, 1978
    Assignee: Hitachi, Ltd.
    Inventors: Noriyuki Kinjo, Akio Nishikawa, Junichi Katagiri, Hitoshi Yokono, Tamotsu Ikeda, Tsuguo Kobayashi
  • Patent number: 4100118
    Abstract: A novel thermosetting resin composition consisting essentially of (a) one equivalent of a polyfunctional epoxy compound containing 10 to 80% by weight of a polyglycidyl ester of a fatty acid, (b) 1.5 to 5 equivalents of a polyfunctional isocyanate compound and (c) 0.01 to 10% by weight of a curing catalyst based on the total weight of the polyfunctional epoxy compound and the polyfunctional isocyanate compound. A cured product having excellent thermal resistance and excellent thermal shock resistance which is suitable for the molding of a large apparatus can be obtained by heating said thermosetting resin composition.
    Type: Grant
    Filed: October 8, 1975
    Date of Patent: July 11, 1978
    Assignee: Hitachi, Ltd.
    Inventors: Shun-ichi Numata, Hitoshi Yokono, Junji Mukai
  • Patent number: 4070416
    Abstract: A novel thermosetting resin can be obtained by mixing 1 equivalent or more of a polyfunctional isocyanate per 1 equivalent of a polyfunctional epoxide and then carrying out a polymerization reaction of the mixture in the presence of the catalyst which forms isocyanurate rings and oxazolidone rings so as to enable the mixture to form 2 or more isocyanurate rings directly connected with oxazolidone rings through an isocyanate residues.The resulting thermosetting resin has excellent electrical, chemical and impact resistances and excellent self-extinguishing properties. Said resin is used as an electric insulating material.
    Type: Grant
    Filed: August 18, 1975
    Date of Patent: January 24, 1978
    Assignee: Hitachi, Ltd.
    Inventors: Toshikazu Narahara, Katuo Sugawara, Yoshiharu Karasawa, Hitoshi Yokono, Junji Mukai, Tadashi Muroi
  • Patent number: 4056579
    Abstract: A novel thermosetting resin composition consisting essentially of (a) an isocyanate group-terminated condensate obtained by reacting a polycarboxylic acid compound having at least one acid anhydride ring with a stoichiometrical excess of a polyfunctional isocyanate compound or said condensate containing the unreacted isocyanate compound, (b) a polyfunctional epoxy compound and (c) a catalyst which forms mainly isocyanurate rings and oxazolidone rings. A cured product having excellent thermal resistance and excellent high temperature strength can be obtained by heating said composition.
    Type: Grant
    Filed: September 15, 1975
    Date of Patent: November 1, 1977
    Assignee: Hitachi, Ltd.
    Inventors: Akio Nishikawa, Hitoshi Yokono, Shun-ichi Numata, Junji Mukai
  • Patent number: 3984376
    Abstract: Thermosetting resin compositions are obtained by mixing a resinous addition product produced by reacting an isocyanate compound having a molecular weight of 100 to 2000 and containing at least two isocyanate groups in its molecule with an epoxyphenol compound represented by the formula, ##EQU1## wherein R is a bi- or more valent group containing phenyl, R.sub.1 is hydrogen, methyl or ethyl, m and n each are an integer of 1-8, and optionally an ordinary thermosetting epoxy resin, and 0.01 to 10 % by weight of a basic heterocycle forming catalyst based on the weight of said resinous addition product, said isocyanate compound and said epoxyphenol compound being blended so that said OH group may be present in an amount of 1/3 to 1 equivalent per equivalent of said isocyanate group and said epoxy group may be present in an amount of one-fifth to two-thirds equivalent per equivalent of said isocyanate group.
    Type: Grant
    Filed: June 25, 1974
    Date of Patent: October 5, 1976
    Assignee: Hitachi, Ltd.
    Inventors: Hitoshi Yokono, Shunichi Numata, Kazuo Goto, Masahiko Sakai, Toshikazu Narahara, Junji Mukai
  • Patent number: 3963796
    Abstract: An epoxy resin composition having a remarkably improved storage stability and an excellent hardening characteristic when heated, which comprises an epoxy resin and an aromatic amino carboxylic acid or a derivative thereof as a hardener for the epoxy resin. This composition can be molded by injection molding, heretofore being deemed inapplicable to epoxy resin compositions, whereby the molded articled of epoxy resin can be produced with a high molding efficiency.
    Type: Grant
    Filed: January 6, 1971
    Date of Patent: June 15, 1976
    Assignees: Hitachi, Ltd., Hitachi Chemical Company, Ltd.
    Inventors: Hitoshi Yokono, Akio Nishikawa, Ritsuro Tada, Yasuo Miyadera
  • Patent number: 3960982
    Abstract: A thermosetting resin composition is derived from a modified novolak-type resin obtained by the reaction of a phenolic compound with an aralkyl halide or ether. The thermosetting resin is composed of 20 to 80 parts by weight of a thermosetting resin prepared by reacting a modified novolak-type resin represented by, for example, the general formula, ##SPC1##Wherein R is an aromatic nucleus, with formaldehyde in the presence of a basic catalyst, and, in admixture therewith, 80 to 20 parts by weight of a thermosetting resin prepared by reacting the above-mentioned modified novolak-type resin with hexamethylenetetramine. The thermosetting resin is quickly curable and gives a cured article excellent in heat resistance.
    Type: Grant
    Filed: June 18, 1974
    Date of Patent: June 1, 1976
    Assignees: Hitachi, Ltd., Hitachi Chemical Company, Ltd.
    Inventors: Shunichi Numata, Hitoshi Yokono, Junji Mukai, Tadashi Muroi, Mineo Nakano, Mikio Manabe