Patents by Inventor Houri Johari
Houri Johari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11841228Abstract: The subject disclosure provides exemplary 3-axis (e.g., GX, GY, and GZ) linear and angular momentum balanced vibratory rate gyroscope architectures with fully-coupled sense modes. Embodiments can employ balanced drive and/or balanced sense components to reduce induced vibrations and/or part to part coupling. Embodiments can comprise two inner frame gyroscopes for GY sense mode and an outer frame or saddle gyroscope for GX sense mode and drive system coupling, drive shuttles coupled to the two inner frame gyroscopes or outer frame gyroscope, and four GZ proof masses coupled to the inner frame gyroscopes for GZ sense mode. Components can be removed from an exemplary overall architecture to fabricate a single axis or two axis gyroscope and/or can be configured such that a number of proof-masses can be reduced in half from an exemplary overall architecture to fabricate a half-gyroscope. Other embodiments can employ a stress isolation frame to reduce package induced stress.Type: GrantFiled: September 3, 2021Date of Patent: December 12, 2023Assignee: INVENSENSE, INC.Inventors: Doruk Senkal, Robert Hennessy, Houri Johari-Galle, Joe Seeger
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Patent number: 11815354Abstract: In a first aspect, the angular rate sensor comprises a substrate and a rotating structure anchored to the substrate. The angular rate sensor also includes a drive mass anchored to the substrate and an element coupling the drive mass and the rotating structure. The angular rate sensor further includes an actuator for driving the drive mass into oscillation along a first axis in plane to the substrate and for driving the rotating structure into rotational oscillation around a second axis normal to the substrate; a first transducer to sense the motion of the rotating structure in response to a Coriolis force in a sense mode; and a second transducer to sense the motion of the sensor during a drive mode. In a second aspect the angular rate sensor comprises a substrate and two shear masses which are parallel to the substrate and anchored to the substrate via flexible elements. In further embodiments, a dynamically balanced 3-axis gyroscope architecture is provided.Type: GrantFiled: December 30, 2020Date of Patent: November 14, 2023Assignee: INVENSENSE, INC.Inventors: Doruk Senkal, Robert Hennessy, Houri Johari-Galle, Joseph Seeger
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Publication number: 20230324176Abstract: A dynamically balanced 3-axis gyroscope architecture is provided. Various embodiments described herein can facilitate providing linear and angular momentum balanced 3-axis gyroscope architectures for better offset stability, vibration rejection, and lower part-to-part coupling.Type: ApplicationFiled: June 13, 2023Publication date: October 12, 2023Inventors: Doruk Senkal, Robert Hennessy, Houri Johari-Galle, Joseph Seeger
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Patent number: 11738994Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.Type: GrantFiled: December 13, 2022Date of Patent: August 29, 2023Assignee: InvenSense, Inc.Inventors: David deKoninck, Varun Subramaniam Kumar, Matthew Julian Thompson, Vadim Tsinker, Logeeswaran Veerayah Jayaraman, Sarah Nitzan, Houri Johari-Galle, Jongwoo Shin, Le Jin
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Patent number: 11650078Abstract: A MEMS device may output a signal during operation that may include an in-phase component and a quadrature component. An external signal having a phase that corresponds to the quadrature component may be applied to the MEMS device, such that the MEMS device outputs a signal having a modified in-phase component and a modified quadrature component. A phase error for the MEMS device may be determined based on the modified in-phase component and the modified quadrature component.Type: GrantFiled: May 26, 2022Date of Patent: May 16, 2023Assignee: InvenSense, Inc.Inventors: Doruk Senkal, Houri Johari-Galle, Joseph Seeger
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Publication number: 20230107211Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.Type: ApplicationFiled: December 13, 2022Publication date: April 6, 2023Inventors: David deKoninck, Varun Subramaniam Kumar, Matthew Julian Thompson, Vadim Tsinker, Logeeswaran Veerayah Jayaraman, Sarah Nitzan, Houri Johari-Galle, Jongwoo Shin, Le Jin
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Patent number: 11548780Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.Type: GrantFiled: November 1, 2021Date of Patent: January 10, 2023Assignee: InvenSense, Inc.Inventors: David deKoninck, Varun Subramaniam Kumar, Matthew Julian Thompson, Vadim Tsinker, Logeeswaran Veerayah Jayaraman, Sarah Nitzan, Houri Johari-Galle, Jongwoo Shin, Le Jin
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Publication number: 20220326045Abstract: A MEMS device may output a signal during operation that may include an in-phase component and a quadrature component. An external signal having a phase that corresponds to the quadrature component may be applied to the MEMS device, such that the MEMS device outputs a signal having a modified in-phase component and a modified quadrature component. A phase error for the MEMS device may be determined based on the modified in-phase component and the modified quadrature component.Type: ApplicationFiled: May 26, 2022Publication date: October 13, 2022Inventors: Doruk Senkal, Houri Johari-Galle, Joseph Seeger
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Patent number: 11365983Abstract: A MEMS device may output a signal during operation that may include an in-phase component and a quadrature component. An external signal having a phase that corresponds to the quadrature component may be applied to the MEMS device, such that the MEMS device outputs a signal having a modified in-phase component and a modified quadrature component. A phase error for the MEMS device may be determined based on the modified in-phase component and the modified quadrature component.Type: GrantFiled: December 12, 2018Date of Patent: June 21, 2022Assignee: INVENSENSE, INC.Inventors: Doruk Senkal, Houri Johari-Galle, Joseph Seeger
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Publication number: 20220144624Abstract: A MEMS sensor includes a proof mass that is suspended over a substrate. A sense electrode is located on a top surface of the substrate parallel to the proof mass, and forms a capacitor with the proof mass. The sense electrodes have a plurality of slots that provide improved performance for the MEMS sensor. A measured value sensed by the MEMS sensor is determined based on the movement of the proof mass relative to the slotted sense electrode.Type: ApplicationFiled: January 25, 2022Publication date: May 12, 2022Inventors: Alexander Castro, Matthew Thompson, Leonardo Baldasarre, Sarah Nitzan, Houri Johari-Galle
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Patent number: 11268976Abstract: A MEMS sensor includes a proof mass that is suspended over a substrate. A sense electrode is located on a top surface of the substrate parallel to the proof mass, and forms a capacitor with the proof mass. The sense electrodes have a plurality of slots that provide improved performance for the MEMS sensor. A measured value sensed by the MEMS sensor is determined based on the movement of the proof mass relative to the slotted sense electrode.Type: GrantFiled: May 4, 2017Date of Patent: March 8, 2022Assignee: InvenSense, Inc.Inventors: Alexander Castro, Matthew Thompson, Leonardo Baldasarre, Sarah Nitzan, Houri Johari-Galle
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Publication number: 20220048760Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.Type: ApplicationFiled: November 1, 2021Publication date: February 17, 2022Inventors: David deKoninck, Varun Subramaniam Kumar, Matthew Julian Thompson, Vadim Tsinker, Logeeswaran Veerayah Jayaraman, Sarah Nitzan, Houri Johari-Galle, Jongwoo Shin, Le Jin
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Publication number: 20210396519Abstract: The subject disclosure provides exemplary 3-axis (e.g., GX, GY, and GZ) linear and angular momentum balanced vibratory rate gyroscope architectures with fully-coupled sense modes. Embodiments can employ balanced drive and/or balanced sense components to reduce induced vibrations and/or part to part coupling. Embodiments can comprise two inner frame gyroscopes for GY sense mode and an outer frame or saddle gyroscope for GX sense mode and drive system coupling, drive shuttles coupled to the two inner frame gyroscopes or outer frame gyroscope, and four GZ proof masses coupled to the inner frame gyroscopes for GZ sense mode. Components can be removed from an exemplary overall architecture to fabricate a single axis or two axis gyroscope and/or can be configured such that a number of proof-masses can be reduced in half from an exemplary overall architecture to fabricate a half-gyroscope. Other embodiments can employ a stress isolation frame to reduce package induced stress.Type: ApplicationFiled: September 3, 2021Publication date: December 23, 2021Inventors: Doruk Senkal, Robert Hennessy, Houri Johari-Galle, Joe Seeger
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Patent number: 11186479Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.Type: GrantFiled: August 21, 2019Date of Patent: November 30, 2021Assignee: INVENSENSE, INC.Inventors: David deKoninck, Varun Subramaniam Kumar, Matthew Julian Thompson, Vadim Tsinker, Logeeswaran Veerayah Jayaraman, Sarah Nitzan, Houri Johari-Galle, Jongwoo Shin, Le Jin
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Patent number: 11156631Abstract: Facilitating self-calibration of a sensor device via modification of a sensitivity of the sensor device is presented herein. A sensor system can comprise a sensor component comprising a sensor that generates an output signal based on an external excitation of the sensor; a sensitivity modification component that modifies a sensitivity of the sensor by a defined amount; and a calibration component that measures a first output value of the output signal before a modification of the sensitivity by the defined amount, measures a second output value of the output signal after the modification of the sensitivity by the defined amount, and determines, based on a difference between the first output value and the second output value, an offset portion of the output signal. Further, the calibration component can modify, based on the offset portion, the output signal.Type: GrantFiled: November 30, 2018Date of Patent: October 26, 2021Assignee: INVENSENSE, INC.Inventors: Matthew Julian Thompson, David deKoninck, Sarah Nitzan, Houri Johari-Galle
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Patent number: 11118907Abstract: The subject disclosure provides exemplary 3-axis (e.g., GX, GY, and GZ) linear and angular momentum balanced vibratory rate gyroscope architectures with fully-coupled sense modes. Embodiments can employ balanced drive and/or balanced sense components to reduce induced vibrations and/or part to part coupling. Embodiments can comprise two inner frame gyroscopes for GY sense mode and an outer frame or saddle gyroscope for GX sense mode and drive system coupling, drive shuttles coupled to the two inner frame gyroscopes or outer frame gyroscope, and four GZ proof masses coupled to the inner frame gyroscopes for GZ sense mode. Components can be removed from an exemplary overall architecture to fabricate a single axis or two axis gyroscope and/or can be configured such that a number of proof-masses can be reduced in half from an exemplary overall architecture to fabricate a half-gyroscope. Other embodiments can employ a stress isolation frame to reduce package induced stress.Type: GrantFiled: September 21, 2018Date of Patent: September 14, 2021Assignee: INVENSENSE, INC.Inventors: Doruk Senkal, Robert Hennessy, Houri Johari-Galle, Joe Seeger
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Patent number: 11073531Abstract: A microelectromechanical (MEMS) accelerometer has a proof mass and a fixed electrode. The fixed electrode is located relative to the proof mass such that a capacitance formed by the fixed electrode and the proof mass changes in response to a linear acceleration along a sense axis of the accelerometer. The MEMS accelerometer is exposed to heat sources that produce a z-axis thermal gradient in MEMS accelerometer and an in-plane thermal gradient in the X-Y plane of the MEMS accelerometer. The z-axis thermal gradient is sensed with a plurality of thermistors located relative to anchoring regions of a CMOS layer of the MEMS accelerometer. The configuration of the thermistors within the CMOS layer measures the z-axis thermal gradient while rejecting other lateral thermal gradients. Compensation is performed at the accelerometer based on the z-axis thermal gradient.Type: GrantFiled: August 21, 2019Date of Patent: July 27, 2021Assignee: INVENSENSE, INC.Inventors: David deKoninck, Varun Subramaniam Kumar, Matthew Julian Thompson, Vadim Tsinker, Logeeswaran Veerayah Jayaraman, Sarah Nitzan, Houri Johari-Galle, Jongwoo Shin, Le Jin
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Patent number: 11040871Abstract: A device comprising a micro-electro-mechanical system (MEMS) substrate with protrusions of different heights that has been integrated with a complementary metal-oxide-semiconductor (CMOS) substrate is presented herein. The MEMS substrate comprises defined protrusions of respective distinct heights from a surface of the MEMS substrate, and the MEMS substrate is bonded to the CMOS substrate. In an aspect, the defined protrusions can be formed from the MEMS substrate. In another aspect, the defined protrusions can be deposited on, or attached to, the MEMS substrate. In yet another aspect, the MEMS substrate comprises monocrystalline silicon and/or polysilicon. In yet even another aspect, the defined protrusions comprise respective electrodes of sensors of the device.Type: GrantFiled: November 30, 2018Date of Patent: June 22, 2021Assignee: INVENSENSE, INC.Inventors: Jongwoo Shin, Houri Johari-Galle, Bongsang Kim, Joseph Seeger, Dongyang Kang
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Publication number: 20210116244Abstract: In a first aspect, the angular rate sensor comprises a substrate and a rotating structure anchored to the substrate. The angular rate sensor also includes a drive mass anchored to the substrate and an element coupling the drive mass and the rotating structure. The angular rate sensor further includes an actuator for driving the drive mass into oscillation along a first axis in plane to the substrate and for driving the rotating structure into rotational oscillation around a second axis normal to the substrate; a first transducer to sense the motion of the rotating structure in response to a Coriolis force in a sense mode; and a second transducer to sense the motion of the sensor during a drive mode. In a second aspect the angular rate sensor comprises a substrate and two shear masses which are parallel to the substrate and anchored to the substrate via flexible elements. In further embodiments, a dynamically balanced 3-axis gyroscope architecture is provided.Type: ApplicationFiled: December 30, 2020Publication date: April 22, 2021Inventors: Doruk Senkal, Robert Hennessy, Houri Johari-Galle, Joseph Seeger
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Publication number: 20210053819Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.Type: ApplicationFiled: August 21, 2019Publication date: February 25, 2021Inventors: David deKoninck, Varun Subramaniam Kumar, Matthew Julian Thompson, Vadim Tsinker, Logeeswaran Veerayah Jayaraman, Sarah Nitzan, Houri Johari-Galle, Jongwoo Shin, Le Jin