Abstract: A method is provided. The method includes the following steps: introducing a first physical vapor deposition (PVD) target and a second PVD target in a PVD system, the first PVD target containing a boron-containing cobalt iron alloy (FeCoB) with an initial boron concentration, and the second PVD target containing boron; determining parameters of the PVD system based on a target boron concentration larger than the initial boron concentration; and depositing a FeCoB film on a substrate according to the parameters of the PVD system.

Abstract: A deposition apparatus includes a process chamber, a wafer support in the process chamber, a backplane structure having a first surface in the process chamber facing the wafer support, a target having a second surface facing the first surface and a third surface facing the wafer support, and an adhesion structure in physical contact with the backplane structure and the target. The adhesion structure has an adhesion material layer, and a spacer embedded in the adhesion material layer.

Abstract: A physical vapor deposition (PVD) target for performing a PVD process is provided. The PVD target includes a backing plate and a target plate coupled to the backing plate. The target plate includes a sputtering source material and a dopant, with the proviso that the dopant is not impurities in the sputtering source material. The sputtering source material includes a diffusion barrier material.

Abstract: An optical system includes an optical module with a main axis is provided. The optical module includes a fixed portion, a movable portion, and a driving mechanism. The movable portion is connected to an optical element and is movable relative to the fixed portion. The driving mechanism drives the movable portion to move relative to the fixed portion. When viewed along a direction that is parallel with the main axis, the fixed portion is a polygonal structure with a first side, a second side, a third side, and a fourth side. The first side is parallel with the third side, the second side is parallel with the fourth side, and the first side is not parallel with the second side.

Abstract: An optical system includes an optical module with a main axis is provided. The optical module includes a fixed portion, a movable portion, a driving mechanism, and a supporting assembly. The movable portion is connected to an optical element and is movable relative to the fixed portion. The driving mechanism drives the movable portion to move relative to the fixed portion. The supporting assembly is connected to the movable portion and the fixed portion. When viewed along a direction that is parallel with the main axis, the fixing portion is a polygonal structure with a first side, a second side, a third side, and a fourth side. The first side is parallel with the third side, the second side is parallel with the fourth side, and the first side is not parallel with the second side.

Abstract: A multi-chamber semiconductor processing system is provided. The multi-chamber semiconductor processing system includes: a plurality of chambers, each of the plurality of chambers corresponding to a semiconductor process; a transfer chamber; a transfer robot in the transfer chamber and having a holding member capable of holding a wafer, the transfer robot configured to transfer the wafer among the plurality of chambers; a first temperature sensor mounted on the holding member and configured to detect a transfer robot temperature; and a temperature adjustment unit mounted on the transfer robot and configured to adjust the transfer robot temperature.

Abstract: An optical element driving mechanism for corresponding to an optical module, the optical element driving mechanism including a fixed portion, a movable portion, and a first driving assembly. The fixed portion has an aperture. The movable portion is for connecting to an optical element and is movable relative to the fixed portion. The first driving assembly is for driving the movable portion to move relative to the fixed portion. The fixed portion has an elongated structure, and the fixed portion further comprises a first end. The fixed portion further comprising a second end, wherein the first end and the second end are arranged along a first direction. A shortest distance between the optical sensing element and the first end is shorter than a shortest distance between the optical sensing element and the second end.

Abstract: A method includes loading a wafer into a sputtering chamber, followed by depositing a film over the wafer by performing a sputtering process in the sputtering chamber. In the sputtering process, a target is bombarded by ions that are applied with a magnetic field using a magnetron. The magnetron includes a magnetic element over the target, an arm assembly connected to the magnetic element, a hinge mechanism connecting the arm assembly and a rotational shaft. The arm assembly includes a first prong and a second prong at opposite sides of the hinge mechanism. The magnetron further includes a controller that controls motion of the first arm assembly, enabling the first prong to revolve in an orbital motion path about the first hinge mechanism while the second prong remains stationary.

Abstract: A driving mechanism is provided, including a fixed part, a movable assembly, an optical assembly, and a driving assembly. The movable assembly movably connects the fixed part with the optical assembly. The driving assembly is configured to drive the movable assembly and the optical assembly to move relative to the fixed part.

Abstract: An optical element driving mechanism is provided and includes a first movable part, a fixed assembly and a first driving assembly. The first movable part is configured to connect a first optical element. The fixed assembly has a first opening for a light beam to pass through, and the first movable part is movable relative to the fixed assembly. The first driving assembly is configured to drive the first movable part to move relative to the fixed assembly. When the first movable part is located in a first position relative to the fixed assembly, the first optical element overlaps the first opening.

Abstract: A physical vapor deposition (PVD) target for performing a PVD process is provided. The PVD target includes a backing plate and a target plate coupled to the backing plate. The target plate includes a sputtering source material and a dopant, with the proviso that the dopant is not impurities in the sputtering source material. The sputtering source material includes a diffusion barrier material.

Abstract: A driving mechanism for an optical element is provided, including a fixed portion, a movable portion, a first driving assembly, and a positioning assembly. The movable portion is movably disposed on the fixed portion, and includes an optical element. The first driving assembly is at least partially disposed on the fixed portion, and drives the optical element to move in a first direction. The positioning assembly is disposed on the fixed portion or the movable portion, wherein the positioning assembly limits the movable part to a first terminal position or a second terminal position relative to the fixed portion.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a fixed part, a movable part, a driving assembly, and a positioning assembly. The movable part is movably disposed on the fixed part. The movable part is connected to an optical element. At least a portion of the driving assembly is disposed on the fixed part. The positioning assembly is disposed on the fixed part or the movable part to limit the movable part at an extreme position relative to the fixed part.

Abstract: The present disclosure provides an optical system, including a first optical mechanism. The first optical mechanism includes a first movable part, a fixed assembly, a first driving assembly and a guiding assembly. The first movable part includes an optical element. The first movable part is movable relative to the fixed assembly. The first driving assembly is configured to drive the first movable part to move relative to the fixed assembly. The guiding assembly is configured to guide the first movable part to move relative to the fixed assembly. A friction force is generated between the first movable part and the guiding assembly, and the first movable part is temporarily positioned on the fixed assembly through the friction force.

Abstract: A an apparatus includes a processing chamber configured to house a workpiece, a target holder in the processing chamber, a first magnetic element positioned over a backside of the target holder, a first arm assembly connected to the first magnetic element, a rotational shaft, and a first hinge mechanism connecting the rotational shaft and the first arm assembly.

Abstract: An optical system is provided. The optical system includes a movable portion used for connecting to an optical element having an optical axis, a fixed portion, and a second driving assembly used for driving the movable portion to move relative to the fixed portion. The movable portion includes a bottom having a window corresponding to the optical axis, a first blade corresponding to the window, and is movable relative to the bottom, a connecting element movable relative to the bottom and is used for bringing the first blade to move, and a first driving assembly used for driving the connecting element to move relative to the bottom. The movable portion is movable relative to the fixed portion. The fixed portion has a polygonal structure when viewed along the optical axis.

Abstract: A power conversion system with ripple injection includes an AC-DC conversion unit, a voltage regulation unit, at least one DC-DC conversion unit, at least one load, and a first control unit. The voltage regulation unit provides a DC link and receives one portion of an input power as an energy storage power. Each DC-DC conversion unit receives the other portion of the input power as an output power. The at least one load correspondingly receives the output power for being supplied power. The first control unit is coupled to the DC link, the at least one DC-DC conversion unit, and the at least one load. The first control unit controls the at least one DC-DC conversion unit to adjust a magnitude of a ripple of the output power to perform a ripple injection operation according to a magnitude of a ripple of the input power.

Abstract: An optical system is provided, including a first optical module, a second optical module, and a light-quantity adjustment module. The first optical module, the second optical module, and the light-quantity adjustment module are arranged in a direction of an optical axis. The first optical module and the second optical module are movable in the direction of the optical axis.

Abstract: An optical system is provided, including a housing, an optical element, a first movable part, a driving assembly, and a temperature adjusting module. The optical element is disposed on the housing. The first movable part is movably connected to the housing. The driving assembly is configured to drive the first movable part to move relative to the housing. The temperature adjusting module is disposed in the housing for adjusting the temperature of the optical system.

Abstract: A control method of an optical element driving mechanism includes: providing a first coil group to a fixed assembly, wherein the first coil group includes a plurality of first coils; providing a magnetic element to be connected to a movable assembly; and controlling at least one first coil of the first coil group by a control circuit at least according to position information of the movable assembly relative to the fixed assembly to act with the magnetic element to generate an electromagnetic driving force, thereby driving the movable assembly to move relative to the fixed assembly in a first direction toward a target position.