Abstract: A heat dissipating device (1) includes a heat spreader (10), a radiator (2), at least one U-shaped heat pipe (12), a fan (3) mounted on the radiator and a pair of clips (4). The radiator includes a first heat sink (20) and a second heat sink (22). The first heat sink (20) includes a first base (200) and a plurality of fins (202) extending from a side of the first base. The second heat sink (22) includes a second base (220) and a plurality of fins (222) extending from a side of the second base. The heat pipe (12) includes an evaporating portion (120) attached to the heat spreader and a pair of condensing portions (122) extending upwardly from opposite ends of the evaporating portion. The two condensing portions are sandwiched between the first base and the second base. The heat pipe transfers heat from the heat spreader to both of the first base and second base.

Abstract: A locking device (30) for mounting a heat sink (40) to a CPU (70), includes a supporting member (32), a pair of locking members (33) pivotably attached to the supporting member and each having a connecting portion (332) and a hook (333), a pressing member (34) resting on the connecting portions, a spring installed between the supporting member and the connecting portions, and an operating member (31) pivotably attached to the supporting member. The operating member is pivotable between a first position at which the operating member abuts against the pressing member and the locking members are located at a released position and a second position at which the abutting portion releases the pressing member to allow the elastic member to drive the locking members to interlock with a retention module around the CPU.

Abstract: A fluid guiding device (1) includes a ventilating pipe (10), a barrel (20) and a holding frame (30). The ventilating pipe includes two spring levers (154). A handling tab (156) and an engaging tab (158) extend from a free end of each spring lever, respectively outwardly and inwardly. The barrel forms two jagged members (262) thereon. Each jagged member forms a plurality of parallel teeth (264). The engaging tabs are selectively engaged with corresponding teeth respectively to position the barrel to the ventilating pipe when the barrel is moved to a desired location in the ventilating pipe. The engaging tabs escape from teeth by pulling the handling tabs outwardly to allow the barrel to be movable on the ventilating pipe. The holding frame is secured to the barrel for holding a fluid-driving device thereon.

Abstract: A liquid cooling device includes a heat-dissipating unit (1) and a heat-absorbing unit (2). The heat-dissipating unit (1) connects with the heat-absorbing unit (2) by an inlet pipe (4) and an outlet pipe (3) to form a closed circulation loop. The heat-dissipating unit (1) includes a base (10), a tank (20), a heat-dissipating body (30) beside the tank (20) and a cover (40), which are assembled together as a single unit. A pump (23) is placed in the tank (20) and operated to pump liquid coolant to flow in the circulation loop. During flowing through the base (10) and the cover (40), the liquid coolant transfers heat to the heat-dissipating body (30).

Abstract: A heat dissipation device includes a core including a base with a bottom face and a top face and a body extending from the top face of the base, thermally conductive medium spread on the bottom face fo the base, a plurality of fin stacked along the body above the base, and a protective cover firmly disposed around the base of the core. An offset exists between the bottom face of the cover and the spread area of the medium.

Abstract: A locking device (10) for securing a heat sink to an electronic device includes a rectangular main frame (20), four first fasteners (30) respectively pivotably attached to four corners of the main frame and two second fasteners (40) pivotably attached to the main frame at opposite sides thereof. Each of the first and second fasteners respectively is capable of rotating relative to the main frame from a non-stretched position to a stretched position for attachment of the heat sink to the electronic device.

Abstract: An apparatus (1) for supporting a cooling device (30) thereon includes a bracket (10) and a saddle (20) carrying the cooling device (30) thereon. The bracket (10) defines two opposing rails (12), (13) and a washboard-like member (14) extending along a direction in which the rails (12), (13) extend. The saddle (20) includes a positioning member (26) engaged in the washboard-like member (14) to position the saddle (20) to the bracket (10) and two blocks (24) slidable on the rails (12), (13) of the bracket (10) under condition that the positioning member (26) is disengaged from the washboard-like member (14).

Abstract: A locking device for securing a heat sink to a heat generating component includes a locking plate, a plurality of locking feet each pivotably attached to the locking plate and a plurality of locking members attached to the locking feet. Adjacent two of the plurality of locking feet are capable of rotating towards each other from a first position at which the locking feet are located apart from each other with the locking members defining a first mounting position to a second position at which the locking feet are stacked together with the locking members defining a second mounting position.

Abstract: A heat sink comprises a plurality of stacked fins being combined. Each fin comprises a plate body with two pairs of locking structures formed symmetrically on two opposite edges of the plate body. Each locking structure comprises an interval part extending integratedly from the plate body, a bearing part depending from the interval part, a lateral position portion and a detaining portion extend continuously from the bearing part. A tab is formed on each detaining portion. The fins are combined in such a manner that the bearing part of each fin bears against an adjacent fin; the plate body of each fin is sandwiched between the bearing part and the detaining portion of each locking structure of an adjacent fin, and between the lateral position portions of a pair of locking structures of the adjacent fin, the tabs of each fin bear against the corresponding interval parts of the adjacent fin.

Abstract: A clip (30) securing a heat sink (10) includes a pair of spaced V-shaped main bodies (32) respectively received in grooves (16) of the heat sink. A pair of spaced wings (38) extends outwardly from opposite ends of each main body. The wings are slanted slightly upwardly. A hook (42) is formed at a free end of each wing. Each hook has a V-shaped profile. The wings are wider than the hooks, for facilitating manual operation of the clip.

Abstract: A heat dissipation device includes a base (10) having a heat dissipating surface, a plurality of fins (20) and a pair of heat pipes (30). The fins cooperatively define a concave tunnel in a side thereof. The heat dissipating surface of the base is embedded in the tunnel of the fins. Each heat pipe has a vaporizing portion (32) engaged with the base and a condensing portion (31) engaged in the fins.

Abstract: A method of manufacturing a heat dissipating device, the method includes steps: a) affording a heat pipe, a solid solder bar and a heat sink, wherein the heat sink includes a base defining a groove at a side thereof; b) placing the solder bar and the heat pipe, in turn, into the groove of the heat sink; c) heating to melt the solder bar and simultaneously pressing the heat pipe to have an outer surface of the heat pipe coplanar with said side where the groove is defined; and d) cooling to achieve the heat dissipating device wherein the solder bar is evenly distributed between the heat pipe and the base.

Abstract: A heat dissipation device for an electronic unit includes a heat sink and at least a heat pipe. The heat sink includes a base for contacting with the electronic unit and a plurality of fins arranged on the base to create a first heat transfer path for the electronic unit. The heat pipe is attached to the heat sink and includes an evaporating portion for contacting with the electronic unit, and a condensing portion thermally contacting with the fins to create a second heat transfer path for the electronic unit.

Abstract: A clip for heat sink comprises an inverted T-shaped retaining member and an L-shaped operation member pivotably connected to the retaining member. The retaining member has a detaining portion defining several openings and a connecting portion extending from the detaining portion. The operation member has a press portion for bearing against the heat sink and a holding portion for being grasped extending from the press portion. The operation member is capable of being driven to rotate from a first position to a second position to cause the detaining portion to interlock with a retention module provided on a printed circuit board, thereby securing the heat sink to an electronic element package on the printed circuit board.

Abstract: A heat sink (1) includes a heat-conductive base (20), and a plurality of combined fins (10) uprightly attached onto the base. Each fin includes a main body (12), and a flange (14) extending perpendicularly from the main body. A pair of locking plates (16) is bent downwardly from an upper edge of the main body. A pair of blocking tabs (18) is stamped from the main body, corresponding to a middle portion of each locking plate. A receiving space is defined between said pair of blocking tabs and the main body. The locking plates and the blocking tabs are respectively located at opposite main faces of the main body. The locking plates of each fin are inserted in the receiving spaces of an adjacent fin, whereby the fins are firmly combined together.

Abstract: A heat dissipating device of the present invention includes a heat sink (20) and two locking devices (10) for securing the heat sink. The heat sink includes a base (22) for contacting an electronic component. Each locking device includes a spring member, a post (12) and a sleeve (18). The spring member elastically rests on the base. The post extends through the sleeve. The post has one end engaging with the spring member, and an opposite end thereof extending beyond the sleeve for locking the combination. The sleeve has one end tightly grasping the post, and an opposite end thereof preventing the locking device from departing from the heat sink.

Abstract: A liquid cooling device includes a casing (10) having a container (14) for accommodating liquid therein, a base (11) and a liquid inlet port (18) in communication with the container (14). The base (11) comprises a heat-absorbing surface and a rough surface for exchanging heat with liquid, and the rough surface is opposing to the heat-absorbing surface.

Abstract: A heat dissipation assembly includes a heat sink (100), a fan (200) and a fan holder (300). The heat sink includes a plurality of fins (110) and defines a groove (122) in the fins at a base end thereof. The holder includes a bracket (310). The fan is secured to a first main side of the bracket. A locating flange (352) is formed adjoining an edge of a second main side opposite to the first main side of the bracket. A pair of locking flanges (362) is formed adjoining opposite edges of the second main side of the bracket, disposed at opposite sides of the locating flange. The locating and locking flanges are received in the groove of the heat sink and abuttingly engaged with an inner defined at the heat sink in the groove. The base end of the heat sink is received between the bracket and the flanges.

Abstract: A liquid cooling system includes a cooling unit (100) and a coolant driving unit (200). The cooling unit includes a first cooling body (110) defining a first cavity, a second cooling body (130) defining a second cavity in communication with the first cooling body (110), and a heat sink (150) sandwiched between the first and second cooling bodies. The coolant driving unit is in flow communication with the first and second cooling bodies respectively, so that the first and second cooling bodies and the coolant driving unit together form a loop. Circulation of the coolant in the loop causes the heat generated by the heat generating component to be capable of being transferred from the first and second cooling bodies to the heat sink for dissipation.

Abstract: A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent (74) is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (30) mounted on an opposite side of the card, a first heat pipe (50, 50?) thermally connected to the first heat sink, a second heat pipe (60, 60?) discrete from the first heat pipe thermally connected to the second heat sink, and a connecting member (80, 80?) connected between the first and second heat pipes for transferring heat from the first heat pipe to the second heat pipe.