Abstract: The present disclosure provides an automatic push corer system including a base, a power group, a Geneva transmission group, an intermittent transmission group, a vertical coring transmission group, a clamp group and a coring group. The power group is used to drive the Geneva transmission group. The Geneva transmission group is configured to perform a first intermittent rotary motion. The intermittent transmission group is configured to perform a second intermittent rotary motion. The vertical coring transmission group is configured to cooperate with the second intermittent rotary motion to perform a third intermittent rotary motion. The clamp group is configured to cooperate with the third intermittent rotary motion to perform a lifting reciprocation. The coring group is configured to cooperate with the first intermittent rotary motion and the lifting reciprocation to respectively complete a coring operation and a tubing replacing operation.

Abstract: A package or a chip including a linear amplifier and a power amplifier is provided, wherein the linear amplifier is configured to receive an envelope tracking signal to generate an amplified envelope tracking signal, the power amplifier is supplied by an envelope tracking supply voltage comprising a DC supply voltage and the amplified envelope tracking signal, and the power amplifier is configured to receive an input signal to generate an output signal.

Abstract: An optical plate with protrusions, an optical structure, a backlight module and a display device are provided. The optical plate includes a main body and several protrusions. The main body has a first surface. The protrusions are formed on and projected from the first surface. An area ratio of the protrusions to the first surface is in a range of 0.03˜35%. The protrusions have a pitch in a range of 0.5˜10 mm, and a portion of the first surface other than the protrusions has a first center line mean roughness Ra in a range of 0.01˜0.1 ?m.

Abstract: A liquid cooling system includes a liquid cooling head, a fixing member and a radiator. The fixing member is disposed on the liquid cooling head. The radiator is disposed on the liquid cooling head through the fixing member. The radiator moves with respect to the liquid cooling head between at least two different positions through the fixing member.

Abstract: A heat dissipation device includes a heat dissipation piece, heat conduction plates, a rod piece and a switch. The heat conduction plates are connected to the heat dissipation piece and spaced apart from and arranged parallel to each other so as to define accommodating spaces. Each heat conduction plate has a free end away from the heat dissipation piece, and the free end has a through hole. The rod piece has a first end and a second end opposite to each other, the rod piece penetrates through the through holes, and the second end has a limitation portion. The switch has a cam portion pivoted to the first end. When the switch is pivoted with respect to the heat conduction plates, the cam portion drives the rod piece to move among the through holes, making the limitation portion to press against or be separated from the heat conduction plates.

Abstract: An adjustable desktop assembly includes a base frame having two inwardly tilted sliding plates at two opposite lateral sides thereof and a mounting unit at a rear side thereof for fastened to an external support frame assembly, an adjustment mechanism including a sliding base coupled to the bottom side of the base frame and an adjustment unit, two clamping plates bilaterally mounted in the sliding base, a lead screw mounted in the adjustment unit, and a pressure block affixed to the lead screw and movable with the lead screw between a locking position where the pressure block is abutted against an abutment block of the adjustment unit to lock a desktop to the base frame and an unlocking position where the pressure block is released from the abutment block for allowing adjustment of the forward and backward position of the desktop relative to the base frame.

Abstract: The invention provides method and associated signal system improving mitigation of injection-pulling effect for an oscillator which generates an output clock under control of a control signal. The method may include: by a loop filter, filtering a deviation signal to form a filtered signal; by a SIL (self-injection locked) controller, forming an auxiliary signal which tracks the deviation signal or a phase difference between a reference clock and an output signal resulting from the output clock; and, forming the control signal by summing the filtered signal and the auxiliary signal.

Abstract: A semiconductor device includes: a conductive structure, a conductive bump extending into the conductive structure and contacting the conductive structure along a first surface, the conductive bump configured to interface with an external semiconductor device at a second surface opposite the first surface, the conductive bump being wider along the first surface than the second surface.

Abstract: A backlight module includes an optical assembly, a plurality of first light units, and a light guide plate. The optical assembly includes a base film, a first conductive layer, and a first reflective layer. The first conductive layer is disposed on the base film, and the first reflective layer is disposed on the first conductive layer. The first reflective layer includes a first part and a second part. The first part is connected to the second part. The plurality of first light units are disposed on the first part and extend through the first part to be electrically connected to the first conductive layer. The light guide plate is disposed on the second part.

Abstract: A reserve tank has a container, an outlet component, and an inlet component. The outlet component and the inlet component are mounted on the container. The outlet component has an open end located at a center of the container. The inlet component has a branch portion mounted in the container and an inlet channel in the branch portion. Therefore, when the reserve tank is disposed obliquely, even though the reserve tank is not full of a working liquid and contains some gas, the gas can hardly flow into the open end of the outlet component. In addition, if some gas enters the container through the inlet channel and thus forms bubbles, the bubbles may move upward along part of the branch tunnels extending upward, so the entering bubbles are still far from the open end.

Abstract: A semiconductor device includes: a conductive structure, a conductive bump extending into the conductive structure and contacting the conductive structure along a first surface, the conductive bump configured to interface with an external semiconductor device at a second surface opposite the first surface, the conductive bump being wider along the first surface than the second surface.

Abstract: A radiator includes a main body, two connecting members and two taps. The two connecting members are disposed on opposite sides of the main body. Each of the two taps is rotatably connected to one of the two connecting members, such that the two taps are rotatably disposed on opposite sides of the main body.

Abstract: A semiconductor device includes a semiconductor substrate, an underlying insulation layer, a conductive via and a sidewall insulation layer. The underlying insulation layer is over the semiconductor substrate. The conductive via is through the semiconductor substrate and the underlying insulation layer. The sidewall insulation layer is between the semiconductor substrate and the conductive via. The sidewall insulation layer includes a protrusion stopping at an interface between the semiconductor substrate and the underlying insulation layer, and protruding outwardly into the semiconductor substrate.

Abstract: A semiconductor device includes: a gate structure on a substrate; a raised source/drain region adjacent to the gate structure; a channel region under the gate structure; and a protection layer between the substrate and the raised source/drain region. The protection layer is interposed between the substrate and the raised source/drain region. An atom stacking arrangement of the protection layer is different from the substrate and the raised source/drain region.

Abstract: A heat dissipation device includes a heat dissipation piece, heat conduction plates, a rod piece and a switch. The heat conduction plates are connected to the heat dissipation piece and spaced apart from and arranged parallel to each other so as to define accommodating spaces. Each heat conduction plate has a free end away from the heat dissipation piece, and the free end has a through hole. The rod piece has a first end and a second end opposite to each other, the rod piece penetrates through the through holes, and the second end has a limitation portion. The switch has a cam portion pivoted to the first end. When the switch is pivoted with respect to the heat conduction plates, the cam portion drives the rod piece to move among the through holes, making the limitation portion to press against or be separated from the heat conduction plates.

Abstract: In a heat dissipating device adapted to a plurality of memory modules, a base surrounds the memory modules and has two long edges parallel to the memory modules, a first short edge and a second short edge. A plurality of heat conducting members of a comb-shaped frame extends from a heat dissipating wall connected to the first short edge to the second short edge. The heat conducting members are arranged side by side to form a plurality of receiving spaces for receiving the memory modules. A cover is pivotally connected to the comb-shaped frame and can rotate with respect to a first axis parallel to the first short edge. A movable portion is fixed with the comb-shaped frame and two resilient wings of the cover push two outmost heat conducting members inwardly, such that the heat conducting members and the memory modules abut against each other tightly.

Abstract: A mask including patterned structures arranged sequentially along a predetermined direction and a peripheral area surrounding the patterned structures is provided. Each of the patterned structures includes an opening portion and a thinning portion surrounding the opening portion. The opening portion has through holes arranged in a matrix. An outline of the thinning portion has two side edges opposite to each other substantially parallel to the predetermined direction. The thinning portion is defined by an area demarked by the outline of the thinning portion and an outline of the opening portion. A thickness of the thinning portion is thinner than a thickness of the peripheral area.

Abstract: An external auxiliary heat dissipation device includes an external connection head module, a fluid driving module, a heat dissipation module, and a plurality of first pipes. The external connection head module includes a first carrier body and at least two first fluid connection disposed on the first carrier body. The first pipes connect to the first fluid connection head, the fluid driving module, and the heat dissipation module to form a first fluid pathway. The electronic system includes an internal connection head module and a plurality of second pipes. The second pipes connect to the internal connection head module to form a second fluid pathway. The internal connection head module is detachably connected to the external connection head module, so that the first and the second fluid pathways are in fluid communication with each other to form a loop fluid pathway.

Abstract: A through via structure includes a semiconductor substrate, an underlying insulation layer, a conductive via and a sidewall insulation layer. The underlying insulation layer is over the semiconductor substrate. The conductive via is through the semiconductor substrate and the underlying insulation layer. The sidewall insulation layer is between the semiconductor substrate and the conductive via. The sidewall insulation layer includes a protrusion proximal to an interface between the semiconductor substrate and the underlying insulation layer, and protruding outwardly into the semiconductor substrate.

Abstract: A multifunction integrated connection head assembly structure includes a first connection head module and a second connection head module. The first connection head module includes a first carrier body, at least two first fluid connectors, a first power connector, and a first retaining body. The second connection head module includes a second carrier body detachably connected with the first carrier body, at least two second fluid connectors respectively detachably connected with the at least two first fluid connectors, a second power connector detachably electrically connected with the first power connector, and a second retaining body detachably mated with the first retaining body. An electrical device using a multifunction integrated connection head assembly structure is further disclosed.