Patents by Inventor Hsin-Hung Chen

Hsin-Hung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180179568
    Abstract: Lignocellulose is pretreated using solvent with little water footprint. Both a solvent and water are used for saccharification and separating the components of lignocellulose. By adding a small amount of an inorganic acid, lignin is dissolved and hemicellulose is hydrolyzed under appropriate reaction temperature and pressure. Both are dissolved to form liquid phase with solid cellulose residue left. The relative volatility difference between the solvent and water is used to selectively remove more of the solvent. More particularly, drying with air-suction at a relatively low temperature helps remove and recycle the solvent from the cellulose solid residue. Thus, water consumption and the subsequent wastewater treatment can be significantly reduced with little water footprint while achieving the original desired efficiency of enzymatic hydrolysis.
    Type: Application
    Filed: December 27, 2016
    Publication date: June 28, 2018
    Inventors: Fong-Yu Yen, Hsin-Hung Chen, Gia-Luen Guo, Ming-Feng Jang, Wen-Hua Chen
  • Publication number: 20180184547
    Abstract: A liquid cooling system includes a liquid cooling head, a support frame, two positioning members and a radiator. The support frame is disposed on the liquid cooling head. The support frame has two side plates opposite to each other. Each of the positioning members is disposed on one of the two side plates. Each of the positioning members has at least two positioning recesses. The radiator is disposed between and pivotally connected to the two side plates. Opposite sides of the radiator have a positioning portion. The positioning portion is engaged with one of the at least two positioning recesses, such that the radiator is capable of rotating with respect to the liquid cooling head between at least two different positions.
    Type: Application
    Filed: March 16, 2017
    Publication date: June 28, 2018
    Inventors: Shui-Fa Tsai, Hsin-Hung Chen
  • Publication number: 20180172365
    Abstract: A liquid cooling system includes a liquid cooling head, a radiator, a first support member and a second support member. The liquid cooling head has at least one first outlet and at least one first inlet. The radiator has a second outlet and a second inlet. The first support member has at least one first end portion connected to the first outlet, a second end portion pivotally connected to the second inlet, and at least one first passage. The second support member has at least one third end portion connected to the first inlet, a fourth end portion pivotally connected to the second outlet, and at least one second passage. The first and second support members support the radiator and the radiator is capable of rotating with respect to the liquid cooling head by the second and fourth end portions.
    Type: Application
    Filed: August 13, 2017
    Publication date: June 21, 2018
    Inventors: Chang-Han Tsai, Shui-Fa Tsai, Hsin-Hung Chen
  • Patent number: 9985590
    Abstract: According to at least one aspect, a communication system is provided. The communication system includes a power amplifier configured to amplify an input signal to generate an amplified output signal and provide the amplified output signal to an antenna, a power supply coupled to the power amplifier and configured to provide power to the power amplifier based on a power supply control signal, and a controller coupled to the power supply. The controller is configured to identify a target transmit power level for transmission of a wireless signal, generate the power supply control signal based on the target transmit power level using information indicative of a relationship between the target transmit power level and a setting of the power supply, generate performance information indicative of a characteristic of the communication system when the wireless signal is transmitted, and update the information indicative of the relationship using the performance information.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: May 29, 2018
    Assignee: MediaTek Inc.
    Inventors: Po-Sen Tseng, Wei-Kai Chang, I-No Liao, Tzyuan Shiu, Hsin-Hung Chen, Caiyi Wang
  • Patent number: 9982896
    Abstract: A water supply structure of a liquid cooling device, a pump and a liquid cooling device having the water supply structure are disclosed. The water supply structure, disposed on the cooling device or on the pump, includes a lower lid, an upper lid, and a pressure control member. An outlet is in the lower lid and communicates with the cooling device or with the pump. The upper lid is combined on the lower lid. A chamber, formed between the lower lid and the upper lid, communicates with the outlet and accommodates a coolant. The pressure control member is moveable in the chamber and includes a piston and an elastic part controlling the piston to move inside the chamber. The elastic part pushes against the piston to move inside the chamber such that the coolant is injected into the cooling device until hydraulic pressure equilibrium is achieved.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: May 29, 2018
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Hsin-Hung Chen, Shui-Fa Tsai, Shih-Yi Chang
  • Publication number: 20180146575
    Abstract: In a heat dissipating device adapted to a plurality of memory modules, a base surrounds the memory modules and has two long edges parallel to the memory modules, a first short edge and a second short edge. A plurality of heat conducting members of a comb-shaped frame extends from a heat dissipating wall connected to the first short edge to the second short edge. The heat conducting members are arranged side by side to form a plurality of receiving spaces for receiving the memory modules. A cover is pivotally connected to the comb-shaped frame and can rotate with respect to a first axis parallel to the first short edge. A movable portion is fixed with the comb-shaped frame and two resilient wings of the cover push two outmost heat conducting members inwardly, such that the heat conducting members and the memory modules abut against each other tightly.
    Type: Application
    Filed: September 15, 2017
    Publication date: May 24, 2018
    Inventors: Chun-Ching Ho, Hsin-Hung Chen
  • Patent number: 9954067
    Abstract: A semiconductor device includes a gate structure on a substrate; a protection layer on the gate structure; a source/drain region adjacent to the gate structure; and an interconnect plug on the source/drain region. The gate structure includes a gate electrode including a top surface; and a sidewall spacer interfacing a sidewall of the gate electrode. The protection layer covers at least a first portion of the top surface and the sidewall spacer. The protection layer is interposed between the interconnect plug and the gate electrode.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: April 24, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Wei-Che Tsai, Hsin-Hung Chen
  • Patent number: 9949217
    Abstract: A method of transmit power control in a mobile telecommunications device is provided. One of a plurality of signal paths providing different output power and different gains is assigned in a first gain adjustment and a first power measurement in a current time slot. The same one of the signal paths is assigned in at least a second gain adjustment and a second power measurement in the same current time slot.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: April 17, 2018
    Assignee: MEDIATEK SINGAPORE PTE. LTD.
    Inventors: Hsin-Hung Chen, Yangjian Chen, Paul Muller, Hsiang-Hui Chang, Bernard Mark Tenbroek
  • Patent number: 9935401
    Abstract: An electrical receptacle connector includes an insulated member received in a metallic shell. First and second receptacle terminals are held in the insulated member. A shielding plate is between the first and second receptacle terminals. The metallic shell includes a shell body and a contact arm. The metallic shell includes a receptacle cavity for receiving the insulated member. The contact arm includes a supporting portion extending outward from the shell body, and a plurality of contact surfaces extending from the supporting portion. The contact arm is in contact with an inner wall of a housing of an electronic device, and the contact surfaces are conducted with the inner wall of the housing of the electronic device, thereby improving the performance of electromagnetic compatibility.
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: April 3, 2018
    Assignee: ADVANCED-CONNECTEK INC.
    Inventors: Yu-Lun Tsai, Pin-Yuan Hou, Chung-Fu Liao, Long-Fei Chen, Hsin-Hung Chen, Rui Su, Chien-Tsung Chuang
  • Patent number: 9935147
    Abstract: An image sensor device includes a substrate having a front surface and a back surface, and a deep trench disposed at the front surface of the substrate. The deep trench has sidewalls, a bottom and an opening. A dielectric layer is disposed along the sidewalls and the bottom of the deep trench. An epitaxial layer is disposed on the front surface of the substrate. The deep trench and the epitaxial layer collectively define an air chamber. The deep trench has a chamfered portion at an interface between the epitaxial layer and the front surface of the substrate. The chamfered portion is free of dielectric layer.
    Type: Grant
    Filed: November 19, 2016
    Date of Patent: April 3, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsin-Hung Chen, Dun-Nian Yaung, Jen-Cheng Liu, Alexander Kalnitsky, Wen-De Wang
  • Publication number: 20180068949
    Abstract: A through via structure includes a semiconductor substrate, an underlying insulation layer, a conductive via and a sidewall insulation layer. The underlying insulation layer is over the semiconductor substrate. The conductive via is through the semiconductor substrate and the underlying insulation layer. The sidewall insulation layer is between the semiconductor substrate and the conductive via. The sidewall insulation layer includes a protrusion proximal to an interface between the semiconductor substrate and the underlying insulation layer, and protruding outwardly into the semiconductor substrate.
    Type: Application
    Filed: September 8, 2016
    Publication date: March 8, 2018
    Inventors: HSIN-HUNG CHEN, MIN-FENG KAO, HSING-CHIH LIN, JEN-CHENG LIU, DUN-NIAN YAUNG
  • Publication number: 20180038528
    Abstract: A multifunction integrated connection head assembly structure includes a first connection head module and a second connection head module. The first connection head module includes a first carrier body, at least two first fluid connectors, a first power connector, and a first retaining body. The second connection head module includes a second carrier body detachably connected with the first carrier body, at least two second fluid connectors respectively detachably connected with the at least two first fluid connectors, a second power connector detachably electrically connected with the first power connector, and a second retaining body detachably mated with the first retaining body. An electrical device using a multifunction integrated connection head assembly structure is further disclosed.
    Type: Application
    Filed: October 17, 2017
    Publication date: February 8, 2018
    Inventor: HSIN-HUNG CHEN
  • Patent number: 9829132
    Abstract: A multifunction integrated connection head assembly structure includes a first connection head module and a second connection head module. The first connection head module includes a first carrier body, at least two first fluid connectors, a first power connector, and a first retaining body. The second connection head module includes a second carrier body detachably connected with the first carrier body, at least two second fluid connectors respectively detachably connected with the at least two first fluid connectors, a second power connector detachably electrically connected with the first power connector, and a second retaining body detachably mated with the first retaining body. An electrical device using a multifunction integrated connection head assembly structure is further disclosed.
    Type: Grant
    Filed: May 25, 2015
    Date of Patent: November 28, 2017
    Assignee: COOLER MASTER CO., LTD.
    Inventor: Hsin-Hung Chen
  • Publication number: 20170325357
    Abstract: A liquid cooling system includes a liquid cooling head, a fixing member and a radiator. The fixing member is disposed on the liquid cooling head. The radiator is disposed on the liquid cooling head through the fixing member. The radiator moves with respect to the liquid cooling head between at least two different positions through the fixing member.
    Type: Application
    Filed: February 10, 2017
    Publication date: November 9, 2017
    Inventors: Chang-Han Tsai, Shui-Fa Tsai, Hsin-Hung Chen
  • Patent number: 9795052
    Abstract: A handle structure includes a holding member, a press member, and a hook. The holding member includes a holding portion and a space formed in the holding portion. The press member includes a press portion and a plurality of adjustment holes. The press portion is movably disposed in the space. The adjustment holes are disposed on the other end of the press member opposite to the press portion. The hook includes a clasp portion and at least one fastening hole. The fastening hole is adjustably positioned corresponding to any of the adjustment holes, and the clasp portion is movable along with the movement of the press portion, wherein the clasp portion protrudes out of the holding member. The hook moves by pressing the press portion.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: October 17, 2017
    Assignee: SILVERSTONE TECHNOLOGY CO., LTD.
    Inventors: Chun-Lan Hsiao, Hsin-Hung Chen, Chih-Chiang Chang
  • Patent number: 9794105
    Abstract: A signal transmitting apparatus includes: a first converting device arranged to generate an up-converted in-phase signal according to an in-phase digital signal and a first pre-distortion signal; a second converting device arranged to generate an up-converted quadrature signal according to a quadrature digital signal and a second pre-distortion signal; an amplifying device arranged to generate an amplified signal according to the up-converted in-phase signal and the up-converted quadrature signal; and a processing device arranged to generate the first pre-distortion signal according to a first combination signal combined by a cube of the in-phase digital signal and a multiplication of the in-phase digital signal and a square of the quadrature digital signal, and to generate the second pre-distortion signal according to a second combination signal combined by a cube of the quadrature digital signal and a multiplication of the quadrature digital signal and a square of the in-phase digital signal.
    Type: Grant
    Filed: January 16, 2015
    Date of Patent: October 17, 2017
    Assignee: MediaTek Singapore Pte. Ltd.
    Inventors: Hsin-Hung Chen, Manel Collados Asensio, Wei-Kai Chang, Qian-Zhi Huang, Chi-Tsan Chen, Jun Hu
  • Publication number: 20170254459
    Abstract: A pipe connector for connecting with an additional pipe connector includes a first leak-proof pipe, a first sleeve, at least one clamping element and a restricting structure. The first sleeve covers the first leak-proof pipe and allows the first leak-proof pipe to relatively slide therein. The clamping element and the restricting structure are disposed on the first sleeve. The restricting structure is capable of driving the clamping element to clamp or release the additional pipe connector at different positions.
    Type: Application
    Filed: July 6, 2016
    Publication date: September 7, 2017
    Inventor: Hsin-Hung CHEN
  • Publication number: 20170214370
    Abstract: According to at least one aspect, a communication system is provided. The communication system includes a power amplifier configured to amplify an input signal to generate an amplified output signal and provide the amplified output signal to an antenna, a power supply coupled to the power amplifier and configured to provide power to the power amplifier based on a power supply control signal, and a controller coupled to the power supply. The controller is configured to identify a target transmit power level for transmission of a wireless signal, generate the power supply control signal based on the target transmit power level using information indicative of a relationship between the target transmit power level and a setting of the power supply, generate performance information indicative of a characteristic of the communication system when the wireless signal is transmitted, and update the information indicative of the relationship using the performance information.
    Type: Application
    Filed: December 9, 2016
    Publication date: July 27, 2017
    Applicant: MediaTek Inc.
    Inventors: Po-Sen Tseng, Wei-Kai Chang, I-No Liao, Tzyuan Shiu, Hsin-Hung Chen, Caiyi Wang
  • Publication number: 20170194745
    Abstract: An electrical receptacle connector includes an insulated member received in a metallic shell. First and second receptacle terminals are held in the insulated member. A shielding plate is between the first and second receptacle terminals. The metallic shell includes a shell body and a contact arm. The metallic shell includes a receptacle cavity for receiving the insulated member. The contact arm includes a supporting portion extending outward from the shell body, and a plurality of contact surfaces extending from the supporting portion. The contact arm is in contact with an inner wall of a housing of an electronic device, and the contact surfaces are conducted with the inner wall of the housing of the electronic device, thereby improving the performance of electromagnetic compatibility.
    Type: Application
    Filed: January 4, 2017
    Publication date: July 6, 2017
    Inventors: Yu-Lun TSAI, Pin-Yuan HOU, Chung-Fu LIAO, Long-Fei CHEN, Hsin-Hung CHEN, Rui SU, Chien-Tsung CHUANG
  • Publication number: 20170180181
    Abstract: A signal transmitting apparatus includes: a first converting device arranged to generate an up-converted in-phase signal according to an in-phase digital signal and a first pre-distortion signal; a second converting device arranged to generate an up-converted quadrature signal according to a quadrature digital signal and a second pre-distortion signal; an amplifying device arranged to generate an amplified signal according to the up-converted in-phase signal and the up-converted quadrature signal; and a processing device arranged to generate the first pre-distortion signal according to a first combination signal combined by a cube of the in-phase digital signal and a multiplication of the in-phase digital signal and a square of the quadrature digital signal, and to generate the second pre-distortion signal according to a second combination signal combined by a cube of the quadrature digital signal and a multiplication of the quadrature digital signal and a square of the in-phase digital signal.
    Type: Application
    Filed: January 16, 2015
    Publication date: June 22, 2017
    Inventors: Hsin-Hung Chen, Manel Collados Asensio, Wei-Kai Chang, Qian-Zhi Huang, Chi-Tsan Chen, Jun Hu