Abstract: A method of wafer dicing is provided. The method of wafer dicing includes: providing a wafer, wherein the wafer includes a substrate, dies formed in and over the substrate and a scribe line structure located in a scribe line region between adjacent dies; removing a portion of the scribe line structure around a test device in the scribe line structure; attaching a front side of the wafer with a first tape; removing a portion of the substrate overlapping with the scribe line region from a back side of the wafer; attaching the back side of the wafer with a second tape; and removing the first tape along with the remaining portion of the scribe line structure attached thereon, leaving the dies separately attached on the second tape.

Abstract: A method for fabricating a stacked electronic device is provided. A first three-dimensional (3D) printing is performed to form a first insulating layer and a plurality of first redistribution layers (RDLs) on a first substrate. A second 3D printing is performed to form a second substrate and a plurality of through-substrate vias (TSVs) on the first insulating layer, in which the plurality of TSVs is electrically connected to the plurality of first RDLs. A third 3D printing is performed to form a second insulating layer and a plurality of second RDLs on the second substrate, in which the plurality of second RDLs is electrically connected to the plurality of TSVs. A plurality of contacts of a third substrate is bonded to the plurality of second RDLs, so that the substrate is mounted onto the second insulating layer. The disclosure also provides a stacked electronic device formed by such a method.

Abstract: The present invention provides a patterned structure for an electronic device and a manufacturing method thereof. The patterned structure includes a patterned layer, a blocking structure, a cantilever structure, and a connection structure. The patterned layer is disposed on a substrate. The blocking structure is disposed on the substrate at one side of the patterned layer, wherein a thickness of the blocking structure is smaller than a thickness of the patterned layer. The cantilever structure is disposed on the substrate and located between the patterned layer and the blocking structure. The cantilever structure is connected with the patterned layer and the blocking structure. The connection structure is connected between the patterned layer and the substrate at one side of the patterned layer, and located on the cantilever structure and the blocking structure.

Abstract: A method for fabricating a stacked package device is provided. A second substrate is adhered onto a first substrate. The first substrate includes a plurality of first bonding pads, and the second substrate includes a plurality of second bonding pads. A three-dimensional (3D) printing is performed to form an encapsulating layer covering the first substrate and the second substrate and to form a plurality of bonding wires in the encapsulating layer. Each bonding wire includes a first portion connected to one of the plurality of first bonding pads. The disclosure also provides a stacked package device formed by such a method.

Abstract: A holder for antenna testing includes a track base, an antenna carrying device, and at least one displacement-measuring member. The track base has a track platform and a track module disposed on the track platform. A longitudinal direction of the track module defines a displacing direction. The antenna carrying device is movably disposed on the track module along the displacing direction. The displacement-measuring member is movably disposed on the track platform along the displacing direction and is arranged outside the track module. The displacement-measuring member has a zero point and a distance scale counting from the zero point along the displacing direction. The displacement-measuring member is adjustable to align the zero point to the antenna carrying device.

Abstract: A method for fabricating a stacked electronic device is provided. A first three-dimensional (3D) printing is performed to form a first insulating layer and a plurality of first redistribution layers (RDLs) on a first substrate. A second 3D printing is performed to form a second substrate and a plurality of through-substrate vias (TSVs) on the first insulating layer, in which the plurality of TSVs is electrically connected to the plurality of first RDLs. A third 3D printing is performed to form a second insulating layer and a plurality of second RDLs on the second substrate, in which the plurality of second RDLs is electrically connected to the plurality of TSVs. A plurality of contacts of a third substrate is bonded to the plurality of second RDLs, so that the substrate is mounted onto the second insulating layer. The disclosure also provides a stacked electronic device formed by such a method.

Abstract: A one-piece paper container is formed by cutting and pressing a single-layer coated paper into an unfolded container body and cover, then steaming to soften one of the surfaces thereof and thermoforming with an upper and lower moldings at 120° C.˜160° C., combining a coating film covering on a plurality of coincided surfaces at the corners and forming enhanced surfaces with protrusions at on the container body and the cover in the meantime, therefore forming a strong structure. Finally, conducting a moisture examination to decide if the product is qualified or not, so as to ensure safety for the consumers.

Abstract: A method for fabricating a stacked package device is provided. A second substrate is adhered onto a first substrate. The first substrate includes a plurality of first bonding pads, and the second substrate includes a plurality of second bonding pads. A three-dimensional (3D) printing is performed to form an encapsulating layer covering the first substrate and the second substrate and to form a plurality of bonding wires in the encapsulating layer. Each bonding wire includes a first portion connected to one of the plurality of first bonding pads. The disclosure also provides a stacked package device formed by such a method.

Abstract: A pulp molded container with double-sided coating comprises an inner container formed by a pulp molded inner body, an inner film molded and coated on the top surface of the inner body to form a coated inner pulp molded container, an outer container formed by a pulp molded outer body, and an outer film molded and coated on the undersurface of the outer body to form a coated outer pulp molded container. Then overlaying and binding the inner pulp molded container on the outer pulp molded container to form a pulp molded container with double-sided coating that has the softening problem improved since the liquid inside would not permeate and the container would not soften due to dampness; also, because of the perfectly sealed structure, it would not have scraps of paper attached when being piled up.

Abstract: A control system may be switched between a Pseudo-Derivative Feedforward (PDFF) control manner and a Proportional Integral (PI) control manner. The control system includes a first operational element, a second operational element, a feedback proportion controller, an integrator, and a feedforward proportion controller. The first operational element and the second operational element are used to perform calculation of addition or subtraction on an input signal, a feedback signal, and a feedforward signal. The integrator generates an integral signal. The feedback proportion controller generates a feedback proportion signal according to a first feedback gain or a second feedback gain. The feedforward proportion controller generates a feedforward proportion signal according to a first feedforward gain or a second feedforward gain.

Abstract: A holder for antenna testing includes a track base, an antenna carrying device, and at least one displacement-measuring member. The track base has a track platform and a track module disposed on the track platform. A longitudinal direction of the track module defines a displacing direction. The antenna carrying device is movably disposed on the track module along the displacing direction. The displacement-measuring member is movably disposed on the track platform along the displacing direction and is arranged outside the track module. The displacement-measuring member has a zero point and a distance scale counting from the zero point along the displacing direction. The displacement-measuring member is adjustable to align the zero point to the antenna carrying device.

Abstract: A tamper-evident food container includes a container body and a cover respectively having a coupling flange with sealing structure, and the cover has an enlarged surface, a frangible score line, and a pull tab on at least one end of the frangible score line. when the cover fastens to the container body, the plurality of the male engaging members are fixed into the female engaging members and the downward hem is inserted into the recessed portion; when opening the cover, upward pulling the pull tab to tear the frangible score line for detaching the cover from the second enlarged surface. Thus, the present invention ensures the integrity, security, and the ability to maintain high quality the food reserved in the tamper-evident food container.

Abstract: A tamper-evident food container comprises a container body and a cover respectively having a coupling flange with sealing structure, and the cover has an enlarged surface, a frangible score line, and a pull tab on at least one end of the frangible score line. when the cover fastens to the container body, the plurality of the male engaging members are fixed into the female engaging members and the downward hem is inserted into the recessed portion; when opening the cover, upward pulling the pull tab to tear the frangible score line for detaching the cover from the second enlarged surface. Thus, the present invention ensures the integrity, security, and the ability to maintain high quality the food reserved in the tamper-evident food container.

Abstract: A method of fabricating a semiconductor package is provided, including: disposing a semiconductor element on a carrier; forming an encapsulant on the carrier to encapsulant the semiconductor element; forming at least one through hole penetrating the encapsulant; forming a hollow conductive through hole in the through hole and, at the same time, forming a circuit layer on an active surface of the semiconductor element and the encapsulant; forming an insulating layer on the circuit layer; and removing the carrier. By forming the conductive through hole and the circuit layer simultaneously, the invention eliminates the need to form a dielectric layer before forming the circuit layer and dispenses with the conventional chemical mechanical polishing (CMP) process, thus greatly improving the fabrication efficiency.

Abstract: A semiconductor package is provided, which includes: a soft layer having opposite first and second surfaces and first conductive through hole vias; a chip embedded in the soft layer and having an active surface exposed from the first surface of the soft layer; a support layer formed on the second surface of the soft layer and having second conductive through hole vias in electrical connection with the first conductive through hole vias; a first RDL structure formed on the first surface of the soft layer and electrically connected to the active surface of the chip; and a second RDL structure formed on the support layer and electrically connected to the first RDL structure through the first and second conductive through hole vias. The invention prevents package warpage by providing the support layer, and allows disposing of other packages or electronic elements by electrically connecting the RDL structures through the conductive through hole vias.

Abstract: A method of fabricating a semiconductor package is provided, including: disposing a semiconductor element on a carrier; forming an encapsulant on the carrier to encapsulant the semiconductor element; forming at least one through hole penetrating the encapsulant; forming a hollow conductive through hole in the through hole and, at the same time, forming a circuit layer on an active surface of the semiconductor element and the encapsulant; forming an insulating layer on the circuit layer; and removing the carrier. By forming the conductive through hole and the circuit layer simultaneously, the invention eliminates the need to form a dielectric layer before forming the circuit layer and dispenses with the conventional chemical mechanical polishing (CMP) process, thus greatly improving the fabrication efficiency.

Abstract: A feedback switching device and a method allow a drive control loop for a servo motor to actively switch the feedback mode in accordance with the rotating speed of the servo motor. When the servo motor is under a high speed operation, a sensorless position estimation feedback technology is used as the feedback mode; on the other hand, when the servo motor is under a low speed operation, the switching mode is automatically switched to a position sensing feedback technology. Therefore, the development needs for multi-function, high performance and low cost in the field of the servo motor control are met, and the conventional problem is solved that, when being applied to a servo driving system having a wide speed range, the single use of the position sensing feedback technology or the sensorless position estimation feedback technology fails to satisfy the application for a wide speed range.

Abstract: A control system may be switched between a Pseudo-Derivative Feedforward (PDFF) control manner and a Proportional Integral (PI) control manner. The control system includes a first operational element, a second operational element, a feedback proportion controller, an integrator, and a feedforward proportion controller. The first operational element and the second operational element are used to perform calculation of addition or subtraction on an input signal, a feedback signal, and a feedforward signal. The integrator generates an integral signal. The feedback proportion controller generates a feedback proportion signal according to a first feedback gain or a second feedback gain. The feedforward proportion controller generates a feedforward proportion signal according to a first feedforward gain or a second feedforward gain.

Abstract: A method for controlling starting of a motor is described, which is mainly applicable to estimate a possible initial position of a rotor of a motor by detecting a rotor rotation signal of the motor, and find out a most possible initial position of the rotor after making statistics. In the method for controlling the starting of the motor, a starting angle position region of the motor is calculated simply by using the rotor rotation signal of the motor, without additionally arranging a Hall sensor, so as to save a cost of a Hall device and an assembling cost. Furthermore, accuracy for estimating the starting position region can be increased according to an accuracy specification of products, thereby achieving a high flexibility.