Abstract: A method of reducing particulate contamination in a deposition process including providing a semiconductor wafer having a process surface for depositing a deposition layer thereover according to one of a physical vapor deposition (PVD) and a chemical vapor deposition (CVD) process; depositing at least a portion of the deposition layer over the process surface; cleaning the semiconductor wafer including the process surface according to an ex-situ cleaning process to remove particulate contamination including at least one of spraying and scrubbing; and, repeating the steps of depositing and cleaning at least once to include reducing a level of occluded particulates.

Abstract: A mop assembly with liquid detergent supply has a detergent storage bottle connected between the mop and the handle of a mop, a pump installed inside the storage bottle, a sucking tube disposed at one end of the pump, and an outlet nozzle connected with the storage bottle disposed on the other end of the pump, so that the handle pushes the pump and compresses a spring to resume the pump into its original position. Such back and forth movement squeezes the liquid detergent out from the pump and sucks liquid detergent into the pump when the pump resumes its position, and thus spraying the detergent out from the outlet nozzle. By means of the handle directly driving the pump in the storage bottle for the back and forth squeezing, it gives the convenience of supplying detergent before mopping. Furthermore, an n-shape contractible support rod is disposed each on both sides of the mop to fit mops of different specifications, and thus having the effect of expanding the applications.

Abstract: A method of reducing particulate contamination in a deposition process including providing a semiconductor wafer having a process surface for depositing a deposition layer thereover according to one of a physical vapor deposition (PVD) and a chemical vapor deposition (CVD) process; depositing at least a portion of the deposition layer over the process surface; cleaning the semiconductor wafer including the process surface according to an ex-situ cleaning process to remove particulate contamination including at least one of spraying and scrubbing; and, repeating the steps of depositing and cleaning at least once to include reducing a level of occluded particulates.

Abstract: A mopstick inserting rod comprises a plurality of inserting tubes, a tightening head, and a tightening cover. The plurality of inserting tubes each has an inner reduced end which is used to be inserted into a front end of another inserting tube. The tightening head is punched to the inner reduced end of the inserting tube. The tightening cover resists against the stop edge of the tightening head. An outer surface of the tightening cover is tightly engaged to an inner surface of the inserting tube. The inner thread section is exactly engaged to the outer thread section of the tightening head. Therefore, the plurality of inserting tubes can be connected one by one so as to extend the length of the mopstick inserting rod, and the plurality of inserting tubes of the mopstick inserting rod can be detached from transferring and storage.

Abstract: An improved structure paper mop board facing that is adhesion mounted at the ground level aspect and, furthermore, efficiently removes by absorption dust on floors. The paper mop board facing is adhesively attached to the floor section of the mop board and consists of a number of a pliable and, furthermore, disconnected and cross-laterally arrayed three-dimensional pattern of diagonal ridges on a plane surface, with the lower plane surface of the three-dimensional pattern lined with a non-weave fabric that provides for the wiping of floors. As such, when the said three-dimensional pattern of the paper mop is swabbed against a floor surface, the three-dimensional pattern on the underside of the paper mop board facing becomes deformed from the applied pressure and scours the floor, while crevices interspersed within the three-dimensional pattern of the paper mop board facing entrap dust.

Abstract: A duster structure that can be positioned in any direction including a duster body, a retaining connector provided lockably at a rear end of the duster body, a front fork connector connected lockably with the retaining connector as a whole by means of a locking bolt, and a retractable rod provided lockably at a rear end of the front fork connector. The duster body has a handle at its rear end to connect to the retaining connector. The retaining connector has a circular flat pivot portion that has a central through hole and a plurality of retaining grooves extending radially outward from the through hole. The front forked connector has a forked portion, opposite inner portions of which are respectively provided with a retaining rib for engaging a respective one of the retaining grooves. By means of the retaining ribs that engage the retaining grooves, the retaining connector, hence the duster body, can be turned with respect to the front fork connector in any direction to facilitate cleaning.

Abstract: A method for cleaning a plasma etch chamber is described which can be carried out by first terminating an etch process by stopping a process gas flow into the chamber, then maintaining a RF power in the etch chamber, and flowing a cleaning gas consists of at least one inert gas and oxygen through the chamber at a flow rate higher than the flow rate for the process gas for a length of time sufficient to evacuate substantially all the contaminating byproducts formed by the process gas. A suitable cleaning gas contains at least one inert gas of Ar, He, or N.sub.2 mixed with O.sub.2. A sufficient length of time for the cleaning process is at least 5 seconds, and preferably at least 10 seconds.

Abstract: An improved structure of an extendable multi-directional connecting rod for dusters, in particular a duster having a bending structure and a retractable connecting rod structure connected to a rear end thereof, including a duster handle portion, a retaining connector, a locking connector, and a retractable connecting rod. The handle portion is hollow and internally threaded for receiving outer threads of the retaining connector. The retaining connector further has a curved plate portion behind the outer threads. The curved plate portion has a central round hole and radial grooves extending from the round holes at both sides of the curved plate portion. The locking connector includes a forked portion for receiving the curved plate portion and an internally threaded rear end portion for screwably engaging the retractable connecting rod.

Abstract: A mop head is secured to a mop handle through a positioning block, directional block and connecting rod, whereby the connecting rod is pivotal relative to the directional block along the longitudinal axis of the head and pivotal with the directional block relative to the positioning block along the transverse axis of the head to provide multidirectional dispositioning of the handle relative to the head for accessing different surfaces to be cleaned.