Patents by Inventor Hua Zhao

Hua Zhao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240084380
    Abstract: The present disclosure provides compositions and related methods, e.g., for preparing immobilized nucleic acid nanostructures using compaction oligonucleotides. In some embodiments, rolling circle amplification reaction can be conducted with compaction oligonucleotides on-support or in-solution to generate concatemer molecules having multiple copies of a polynucleotide unit arranged in tandem. Each polynucleotide unit comprises a sequence-of-interest and at least one universal adaptor sequence that binds one end of a compaction oligonucleotide. The 5? and 3? regions of the compaction oligonucleotide can hybridize to the concatemer to pull together distal portions of the concatemer causing compaction of the concatemer to form a nanostructure. Nanostructures having tighter size and shape compared to concatemers generated in the absence of the compaction oligonucleotides.
    Type: Application
    Filed: August 15, 2023
    Publication date: March 14, 2024
    Inventors: Sinan ARSLAN, Michael KIM, Ramreddy TIPANNA, Chunhong ZHOU, William LIGHT, Hua YU, Junhua ZHAO, Tsung-Li LIU
  • Patent number: 11920669
    Abstract: The present disclosure provides a gearbox of a rail vehicle, which belongs to the technical field of gear transmission.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: March 5, 2024
    Assignee: CRRC QISHUYAN INSTITUTE CO., LTD.
    Inventors: Feng Li, Hongbo Que, Hui Zhao, Hua Li, Siqin Jin
  • Patent number: 11915956
    Abstract: The present invention provides a vertical feeding and wafer inserting integrated machine, comprising a rack and a silicon wafer transfer device provided on the rack; a carrying-transporting water tank for carrying and transporting silicon wafers is provided on one end of the rack; the rack is further provided with a feeding unit for conveying the silicon wafers in the carrying-transporting water tank to a silicon wafer transfer belt a wafer inserting unit for inserting the silicon wafers into wafer baskets is provided on one end, away from the feeding unit, of the silicon wafer transfer device, and a wafer basket arraying mechanism is provided on the other end of the wafer inserting unit; and a washing manipulator for transferring grouped wafer baskets to a washing procedure is further correspondingly provided on the rack.
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: February 27, 2024
    Assignee: TIANJIN HUANBO SCIENCE AND TECHNOLOGY CO., LTD
    Inventors: Lihui Jin, Hua Yang, Mingqiang Geng, Xiaoguang Zhao, Chenpeng Du, Qing Yin
  • Publication number: 20240039539
    Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.
    Type: Application
    Filed: October 5, 2023
    Publication date: February 1, 2024
    Inventors: Sanjay Dabral, Bahattin Kilic, Jie-Hua Zhao, Kunzhong Hu, Suk-Kyu Ryu
  • Patent number: 11871745
    Abstract: Bacteria repellant polymer composite having a reduced yellowness index prepared by melt processing a base polymer an epoxy resin and a bacteria repellant agent and methods of preparation thereof.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: January 16, 2024
    Assignee: Ka Shui Plastic Technology Co. Ltd.
    Inventors: You Wu, Hoi-Kuan Kong, Yan-Hua Zhao, Ho-Man Au, Wai-Chung Peter Wong, Cheuk-Nang Daniel Sung, Yuen-Fat Lee
  • Publication number: 20230394438
    Abstract: Systems, methods and/or computer program products for automating evaluations of code deliveries for software projects. Automated evaluations are generated by selecting software projects and dividing a project into a plurality of code blocks by analyzing the code, build file and build log. Attributes of code blocks are extracted and correlations between code blocks are calculated. Dynamic distance between code blocks is calculated by the correlation and code delivery history, to create a Dynamic General Distance Map and Dynamic User Distance Map for the code blocks. Code delivery distance indicating the code delivery behavior is generated by the Dynamic User Distance Map while the delivery assessment criteria is generated to evaluate code delivery and assess levels of risk associated with delivery of the code. High-level risk indicates that a code delivery may not follow best practices and users are alerted to pay more attention to the code delivery during review.
    Type: Application
    Filed: June 6, 2023
    Publication date: December 7, 2023
    Inventors: Bo Tong Liu, Qi Li, Cheng Fang Wang, Yan Wei Zhao, Cai Hua Zhao
  • Patent number: 11838304
    Abstract: Methods, apparatus, computer program products for tracking sensitive data are provided. A method for tracking sensitive data comprises identifying, by one or more processing units, for a type of sensitive data, at least one key interface that carries the type of sensitive data and recording the at least one key interface. The method further comprises generating, by one or more processing units, for the type of sensitive data, for each type of sensitive data, a series of service nodes based on the at least one key interface, and monitoring, by one or more processing units, for the type of sensitive data, corresponding data traffic flowing through corresponding series of service nodes, based on the identified at least one key interface.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: December 5, 2023
    Assignee: International Business Machines Corporation
    Inventors: Pei Jian Liu, Yan Liu, Bing Hua Zhao, Mei Rui Su, Na Liu
  • Patent number: 11831312
    Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.
    Type: Grant
    Filed: February 23, 2022
    Date of Patent: November 28, 2023
    Assignee: Apple Inc.
    Inventors: Sanjay Dabral, Bahattin Kilic, Jie-Hua Zhao, Kunzhong Hu, Suk-Kyu Ryu
  • Publication number: 20230359549
    Abstract: Training a predict model with network traffic and data change messages generated by an existing web application running in a production environment. The predict model being is trained to predict data changes resulted from API calls embodied in network traffic. A stream of network traffic of the existing web application is replayed with an upgraded version of the existing web application to generate real data changes. The stream of network traffic is applied to the predict model to generate predicted data change messages. The predicted data change messages are comparing with real data change messages representing the real data changes. One or more existing APIs is identified as being possibly functionally degraded based on any inconsistency of the predicted data change messages with the real data change messages.
    Type: Application
    Filed: July 17, 2023
    Publication date: November 9, 2023
    Inventors: Pei Jian Liu, Bing Hua Zhao, Na Liu, Yan Liu, Mei Rui Su
  • Publication number: 20230317624
    Abstract: Microelectronic packages and methods of fabrication are described. In an embodiment, a redistribution layer spans across multiple components, and includes a region of patterned wiring traces that may mitigate stress in the RDL between the multiple components.
    Type: Application
    Filed: November 28, 2022
    Publication date: October 5, 2023
    Inventors: Wei Chen, Yi Xu, Jie-Hua Zhao, Jun Zhai
  • Publication number: 20230317708
    Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 5, 2023
    Inventors: Wei Chen, Jie-Hua Zhao, Jun Zhai, Po-Hao Chang, Hsien-Che Lin, Ying-Chieh Ke, Kunzhong Hu
  • Patent number: 11748244
    Abstract: Training a predict model with network traffic and data change messages generated by an existing web application running in a production environment. The predict model being is trained to predict data changes resulted from API calls embodied in network traffic. A stream of network traffic of the existing web application is replayed with an upgraded version of the existing web application to generate real data changes. The stream of network traffic is applied to the predict model to generate predicted data change messages. The predicted data change messages are comparing with real data change messages representing the real data changes. One or more existing APIs is identified as being possibly functionally degraded based on any inconsistency of the predicted data change messages with the real data change messages.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: September 5, 2023
    Assignee: International Business Machines Corporation
    Inventors: Pei Jian Liu, Bing Hua Zhao, Na Liu, Yan Liu, Mei Rui Su
  • Publication number: 20230276593
    Abstract: A server includes a casing, a first disk drive assembly, a fan assembly, a host assembly, a first expansion card assembly, a second expansion card assembly, a power supply assembly, and a second disk drive assembly. The casing has a first to third space. The second space is located between the first and third space. The first disk drive assembly, the fan assembly, and the host assembly are respectively located in the first to third space. The first and second expansion card assembly are located in the third space and above the host assembly. The power supply assembly is located in the third space. The second expansion card assembly is located between the first expansion card assembly and the power supply assembly. The second disk drive assembly is located in the third space and located between the power supply assembly and the second expansion card assembly.
    Type: Application
    Filed: June 14, 2022
    Publication date: August 31, 2023
    Inventors: Fanpu He, JiaQi Yuan, Xiu-Hua Zhao
  • Patent number: 11734649
    Abstract: Systems, methods and/or computer program products for automating evaluations of code deliveries for software projects. Automated evaluations are generated by selecting software projects and dividing a project into a plurality of code blocks by analyzing the code, build file and build log. Attributes of code blocks are extracted and correlations between code blocks are calculated. Dynamic distance between code blocks is calculated by the correlation and code delivery history, to create a Dynamic General Distance Map and Dynamic User Distance Map for the code blocks. Code delivery distance indicating the code delivery behavior is generated by the Dynamic User Distance Map while the delivery assessment criteria is generated to evaluate code delivery and assess levels of risk associated with delivery of the code. High-level risk indicates that a code delivery may not follow best practices and users are alerted to pay more attention to the code delivery during review.
    Type: Grant
    Filed: June 3, 2022
    Date of Patent: August 22, 2023
    Assignee: International Business Machines Corporation
    Inventors: Bo Tong Liu, Qi Li, Cheng Fang Wang, Yan Wei Zhao, Cai Hua Zhao
  • Patent number: 11714025
    Abstract: A pseudo-static test device and method for seismic behavior of connection joints of a wallboard. The device includes ground anchor holes, a support frame including a steel beam and two steel columns, and a test wallboard. A bottom plate of the steel beam is provided with at least two first connecting holes. A top plate each steel column is provided with a second connecting hole. A bottom plate of each steel column is provided with a third connecting hole. The bottom plate of the steel beam is provided with a connection joint assembly configured to hingedly or rigidly connect a top of the test wallboard to the steel beam. Each first connecting hole is connected to the second connecting hole through a flange assembly.
    Type: Grant
    Filed: March 3, 2023
    Date of Patent: August 1, 2023
    Assignee: Chengdu University of Technology
    Inventors: Hua Zhao, Weiguang Yuan, Yongtao Gao, Da Zheng
  • Publication number: 20230221211
    Abstract: A pseudo-static test device and method for seismic behavior of connection joints of a wallboard. The device includes ground anchor holes, a support frame including a steel beam and two steel columns, and a test wallboard. A bottom plate of the steel beam is provided with at least two first connecting holes. A top plate each steel column is provided with a second connecting hole. A bottom plate of each steel column is provided with a third connecting hole. The bottom plate of the steel beam is provided with a connection joint assembly configured to hingedly or rigidly connect a top of the test wallboard to the steel beam. Each first connecting hole is connected to the second connecting hole through a flange assembly.
    Type: Application
    Filed: March 3, 2023
    Publication date: July 13, 2023
    Inventors: Hua ZHAO, Weiguang YUAN, Yongtao GAO, Da ZHENG
  • Publication number: 20230207229
    Abstract: An apparatus includes: a shaft rotatable to a plurality of predetermined positions to change a state of an electric switching device; a motor rotating the shaft via a transmission mechanism when the apparatus operates in an electric operating mode; a braking mechanism configured to brake the motor in response to the shaft rotated to each position when operating in the electric operating mode; a disc coupled to, and rotatable with the shaft, and comprising a plurality of blocking parts and slots therebetween; and a manual lever comprising a rotatable part and a projecting part arranged at an end thereto, wherein in an apparatus manual operating mode, the projecting part is rotatable into the disc via one of the slots when the shaft is located at one of the positions, and slides out from the disc via another slot when the shaft is rotated to another one of the positions.
    Type: Application
    Filed: May 19, 2020
    Publication date: June 29, 2023
    Inventors: Chao Xu, Hua Zhao, Xiaoli Yang, Zhipeng Yuan
  • Publication number: 20230185701
    Abstract: Training a predict model with network traffic and data change messages generated by an existing web application running in a production environment. The predict model being is trained to predict data changes resulted from API calls embodied in network traffic. A stream of network traffic of the existing web application is replayed with an upgraded version of the existing web application to generate real data changes. The stream of network traffic is applied to the predict model to generate predicted data change messages. The predicted data change messages are comparing with real data change messages representing the real data changes. One or more existing APIs is identified as being possibly functionally degraded based on any inconsistency of the predicted data change messages with the real data change messages.
    Type: Application
    Filed: December 15, 2021
    Publication date: June 15, 2023
    Inventors: Pei Jian Liu, Bing Hua Zhao, Na Liu, Yan Liu, Mei Rui Su
  • Publication number: 20230147273
    Abstract: Electronic assemblies and methods of assembly are described. In an embodiment, an electronic assembly includes a stiffener structure shear bonded to an opposite side of a module substrate from a ball grid array (BGA) package. The stiffener structure may be shear bonded at elevated temperature after bonding of the BGA package to lock in a flat or near-flat surface contour of the module substrate.
    Type: Application
    Filed: August 24, 2022
    Publication date: May 11, 2023
    Inventors: Brett W. Degner, Jie-Hua Zhao, Kristopher P. Laurent, Michael E. Leclerc, Rangaraj Dhanasekaran, Simon J. Trivett
  • Patent number: D1015679
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: February 27, 2024
    Assignee: Sheng Zhuo Chuang Yu Technology Co., Ltd
    Inventor: Hua Zhao