Patents by Inventor Hua Zhao

Hua Zhao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9775920
    Abstract: The present invention relates to a novel use of N-(4-isopropylphenyl)-5-amino-isoindoline for diagnosing Alzheimer's disease and quantifying amyloid in the brain.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: October 3, 2017
    Assignee: INSTITUTE OF NUCLEAR ENERGY RESEARCH, ATOMIC ENERGY COUNCIL, EXECUTIVE YUAN, R.O.C.
    Inventors: Wan-I Kuo, Jian-Hua Zhao, Kang-Wei Chang, Tsai-Yueh Luo, Wei-Hsi Chen
  • Publication number: 20170242050
    Abstract: A high-precision magnetic suspension accelerometer for measuring the linear acceleration of a spacecraft is provided, comprising a magnetically shielded vacuum chamber system, a magnetic displacement sensing system, a magnetic suspension control system and a small magnetic proof mass. A optical coherence displacement detection technique is utilized for precisely measuring the position and the posture of the small magnetic proof mass in real time, and a magnetic suspension control technique is utilized for precisely controlling the position and the posture of the small magnetic proof mass to be brought back to the origin, so as to keep the small magnetic proof mass in the center of the systemic inner chamber. When the spacecraft is subject to a non-conservative force, the magnitude and direction of the acceleration can be precisely measured via the measurement of currents in the position control coils due to the acceleration of the spacecraft proportional to the currents of the position control coils.
    Type: Application
    Filed: February 17, 2017
    Publication date: August 24, 2017
    Applicant: CHINA THREE GORGES UNIVERSITY
    Inventors: Liqing PAN, Xianwei YANG, Zhihui LUO, Hua ZHAO, Mingxue SHAO, Qiongying REN, Chao TAN, Min LIU, Chao WANG, Chao ZHANG, Sheng ZHENG, Hongguang PIAO, Guangduo LU, Yunli XU, Xiufeng HUANG
  • Patent number: 9656856
    Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: May 23, 2017
    Assignee: Apple Inc.
    Inventors: Tongbi Jiang, Jie-Hua Zhao, Peter G. Hartwell
  • Patent number: 9633953
    Abstract: A methodology for addressing package warpage is described. In an embodiment a package includes a die mounted on a wiring board. Portion of a metal plane within the wiring board includes a reduced portion, characterized by a reduced thickness that is less than a baseline thickness.
    Type: Grant
    Filed: October 20, 2014
    Date of Patent: April 25, 2017
    Assignee: Apple Inc.
    Inventors: Jun Chung Hsu, Jie-Hua Zhao
  • Patent number: 9605417
    Abstract: A system for harvesting rainwater for use in a skirt building. The skirt building includes a main building and a podium supporting the main building. The system includes: a standpipe; a buffer channel; a filter channel; and a green roof. The green roof includes a vegetation region including a baffled diversion corridor, and a bottom filtering layer including a drainage pipe. The standpipe is arranged on the main building and is connected to the buffer channel where the energy of rainwater flowing out of the standpipe is dissipated. The buffer channel, the filter channel, and the green roof are arranged on the podium, and the buffer channel communicates with the filter channel. The filter channel is connected to the green roof. The filter channel is divided into a plurality of sections respectively filled with different matrix materials.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: March 28, 2017
    Assignees: CHONGQING UNIVERSITY, Promotion Centre of Science and Technology Development, Ministry of Housing and Urban-Rural Development of the People's Republic of China
    Inventors: Hongxiang Chai, Feng Zhang, Weijie Wang, Yanrong Bao, Luwei Guo, Shen Li, Hua Zhao
  • Patent number: 9580897
    Abstract: A system for purifying rainfall runoff including a bar screen; a collection and diversion device; a filter channel; a grass ditch; and a water storage tank. The bar screen is disposed around the collection and diversion device for preliminarily filtering the road rainfall runoff. The collection and diversion device collects the road rainfall runoff and diverts early rainfall runoff to the filter channel, after the filter channel is full, later rainfall runoff is directly diverted to the grass ditch through open channels. The grass ditch includes a percolation bed capable of filtering the early and later rainfall runoff. The water storage tank is connected to the grass ditch via a guiding pipe, to receive the rainfall runoff effusing out of the grass ditch. Part of the rainfall runoff received by the water storage is transported to the percolation bed by a return conduit.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: February 28, 2017
    Assignees: CHONGQING UNIVERSITY, Promotion Centre of Science and Technology Development, Ministry of Housing and Urban-Rural Development of the People's Republic of China
    Inventors: Hongxiang Chai, Feng Zhang, Weijie Wang, Yanrong Bao, Boyu Zou, Qiang Jiang, Hua Zhao
  • Patent number: 9570213
    Abstract: A USB cable (100), comprising: a power wire (1) transferring positive power, a pair of signal wires (2), a metallic braided layer (6) enclosing on the power wire and the signal wires, and an insulative outer jacket (7) surrounding the metallic braided layer. The power wire comprises a metallic inner conductor and an insulative layer surrounding the inner conductor, a mylar film (11) is surrounding on the power wire, and the mylar film is made of Heat Seal PET.
    Type: Grant
    Filed: April 11, 2014
    Date of Patent: February 14, 2017
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Xin-Guang Liang, Shang-Hua Zhao, Lu-Yu Chang
  • Publication number: 20170028087
    Abstract: The present invention relates to a novel use of N-(4-isopropylphenyl)-5-amino-isoindoline for diagnosing Alzheimer's disease and quantifying amyloid in the brain.
    Type: Application
    Filed: July 29, 2016
    Publication date: February 2, 2017
    Inventors: WAN-I KUO, JIAN-HUA ZHAO, KANG-WEI CHANG, TSAI-YUEH LUO, WEI-HSI CHEN
  • Publication number: 20160369566
    Abstract: A vertical shaft drilling rig using a novel drilling method, mainly comprising a derrick (1) and a mouth sealing flatcar (4) installed at the wellhead, and further comprising a drilling pipe (5), a pipe joint (6), a steady pressure device (7), a torque amplification driver (8), a cutter head (9), a muck removal system (10), a slurry treatment station (3), an electrical cabinet (14), a hydraulic station (13), and a power pipeline (11); a main drive (2) is mounted on the derrick; the lower part of the main drive is connected to the drilling pipe; the drilling pipe is provided with the pipe joint, the lower end of the drilling pipe is connected to the torque amplification driver; the lower end of the torque amplification driver is connected to the cutter head; the steady pressure device is mounted outside the torque amplification device; the slag dug up by the cutter head in the shaft is delivered to the slurry treatment station on the surface.
    Type: Application
    Filed: December 9, 2014
    Publication date: December 22, 2016
    Inventors: Jianbin LI, Kleuters Nikolaus, Hua Zhao, Ningchuan Zhang, Wei Xiao, Xingjian Zhuo, Dujuan Wang, Lianhui Jia, Yanping Dong, Qian Zhou
  • Publication number: 20160369629
    Abstract: A center-pillared full-face shaft drilling machine comprises a center pillar (1), device platforms (2), a derrick (3), a driving system (4), a personnel and material conveying system (5), a well wall support and protection system (6), a safeguard system (7), and an operation chamber (8). The derrick (3) is mounted at a wellhead. The operation chamber (8) is disposed on the derrick (3). The center pillar directly leads from the well bottom to the wellhead and is connected to a slide rack comprised in the derrick on the ground. The driving system (4) is mounted at the front end of the center pillar (1) of a device. The multiple device platforms (2) are sequentially mounted on the center pillar (1) of the device from rear to front. The personnel and material conveying system (5) and the safeguard system (7) are separately mounted on the device platforms at the rear of the driving system (4) and on the ground.
    Type: Application
    Filed: December 9, 2014
    Publication date: December 22, 2016
    Inventors: Hua ZHAO, Jianbin LI, Kleuters Nikolaus, Ningchuan Zhang, Wei Xiao, Xingjian Zhuo, Dujuan Wang, Lianhui Jia, Yanping Dong, Qian Zhou
  • Publication number: 20160340175
    Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
    Type: Application
    Filed: August 2, 2016
    Publication date: November 24, 2016
    Inventors: Tongbi Jiang, Jie-Hua Zhao, Peter G. Hartwell
  • Patent number: 9446941
    Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: September 20, 2016
    Assignee: Apple Inc.
    Inventors: Tongbi Jiang, Jie-Hua Zhao, Peter G. Hartwell
  • Patent number: 9394889
    Abstract: A chemical-electromagnetic hybrid propeller with variable specific impulse. Fuel gas ejected out from a spraying tube of the chemical propeller through chemical propulsion enters an ionization chamber through a first magnetic mirror tube for ionization. The fuel gas after ionization is heated up by radio-frequency ion cyclotron waves in an ion cyclotron wave heating chamber so as to improve the kinetic energy. Then a second magnetic mirror tube is used, so that ions in the fuel gas after the ionization are heated up many times in a reciprocating manner between the magnetic mirror tubes, and ejected to generate forward propulsion force. By means of the propeller, the propulsion force and the specific impulse are greatly increased.
    Type: Grant
    Filed: May 7, 2013
    Date of Patent: July 19, 2016
    Assignee: Beijing Institute of Spacecraft Environment Engineering
    Inventors: Hua Zhao, Zhong Yi, Yuming Liu, Yenan Liu, Lifei Meng, Chao Zhang, Qi Xiao, Jipeng Sun, Yanlin Xu
  • Publication number: 20160167949
    Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
    Type: Application
    Filed: December 12, 2014
    Publication date: June 16, 2016
    Inventors: Tongbi Jiang, Jie-Hua Zhao, Peter G. Hartwell
  • Patent number: 9302927
    Abstract: A vacuum melting furnace for infrared glass, includes an upper furnace body and a lower furnace body that can be connected with each other or isolated from each other. Vacuum melting of the infrared glass is achieved in the upper furnace body wherein the influence of water in the environment is eliminated. The vacuum negative pressure environments can promote separation of hydroxyl in the structure, which achieves removing of hydroxyl in the glass, and then discharging of the molten infrared glass is conducted at atmospheric pressure in the lower furnace body. By using the vacuum melting furnace for infrared glass, infrared glass with good spectrum transmission performance can be obtained with improved property stability and optical homogeneity, which facilitates the preparation and molding of large sized and special-shaped infrared glass products.
    Type: Grant
    Filed: June 17, 2014
    Date of Patent: April 5, 2016
    Assignee: CHINA BUILDING MATERIALS ACADEMY
    Inventors: Huifeng Zhao, Chengkui Zu, Bin Han, Yonghua Liu, Jiang Chen, Yanhang Wang, Yangli Jin, Hua Zhao
  • Publication number: 20160071807
    Abstract: A methodology for addressing package warpage is described. In an embodiment a package includes a die mounted on a wiring board. Portion of a metal plane within the wiring board includes a reduced portion, characterized by a reduced thickness that is less than a baseline thickness.
    Type: Application
    Filed: October 20, 2014
    Publication date: March 10, 2016
    Inventors: Jun Chung Hsu, Jie-Hua Zhao
  • Patent number: 9263426
    Abstract: A PoP (package-on-package) package includes a bottom package coupled to a top package. Terminals on the top of the bottom package are coupled to terminals on the bottom of the top package with an electrically insulating material located between the upper surface of the bottom package and the lower surface of the top package. The bottom package and the top package are coupled during a process that applies force to bring the packages together while heating the packages.
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: February 16, 2016
    Assignee: Apple Inc.
    Inventors: Jie-Hua Zhao, Yizhang Yang, Jun Zhai, Chih-Ming Chung
  • Patent number: 9214745
    Abstract: A fixture for electronic device includes a first frame and a second frame. The first frame is fixed to a tray. A backplane is disposed on the first frame. A first electronic device is connected to the backplane and set in the first frame. The backplane is electrically connected the first electronic device and a motherboard by a cable, in which the motherboard is arranged on the tray. The second frame is pivotally connected to the first frame. A transfer board is fixed to the second frame. A second electronic device is connected to the transfer board, and assembled into the second frame. The second frame is fixed onto the tray, and the transfer board is connected to a connection port of the motherboard when the second frame is located in a first position, so as to make the second electronic device electrically connect to the motherboard.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: December 15, 2015
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Ming-gang Li, Xiu-hua Zhao
  • Publication number: 20150266763
    Abstract: A vacuum melting furnace for infrared glass, includes an upper furnace body and a lower furnace body that can be connected with each other or isolated from each other. Vacuum melting of the infrared glass is achieved in the upper furnace body wherein the influence of water in the environment is eliminated. The vacuum negative pressure environments can promote separation of hydroxyl in the structure, which achieves removing of hydroxyl in the glass, and then discharging of the molten infrared glass is conducted at atmospheric pressure in the lower furnace body. By using the vacuum melting furnace for infrared glass, infrared glass with good spectrum transmission performance can be obtained with improved property stability and optical homogeneity, which facilitates the preparation and molding of large sized and special-shaped infrared glass products.
    Type: Application
    Filed: June 17, 2014
    Publication date: September 24, 2015
    Inventors: Huifeng ZHAO, Chengkui ZU, Bin HAN, Yonghua LIU, Jiang CHEN, Yanhang WANG, Yangli JIN, Hua ZHAO
  • Patent number: 9032912
    Abstract: An air connector is described mountable opposite an intake or exhaust port in an associated intake or exhaust pipe of an internal combustion engine to allow the port to communicate selectively with the associated pipe and with a compressed air storage tank. The connector comprises a stopper mounted on a rod movable by an actuator between an open position in which the port communicates with the associated pipe and a closed position in which the stopper seals around the entrance of the port to isolate the port from the associated pipe. An air passage is provided in the stopper and the rod to allow communication between the port and the compressed air storage tank when the stopper is in the closed position, and a check valve is arranged in the air passage and biased in a direction to prevent escape of air from the compressed air storage tank in all positions of the stopper.
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: May 19, 2015
    Assignee: BRUNEL UNIVERSITY
    Inventors: Thomas Ma, Hua Zhao