Abstract: The invention is a UV sterilizing box structure. A box body has a round chamber, an inlet, and an outlet. The round chamber is formed with an arc-shaped guiding channel. A UV light module is disposed on a side of the box body. An external fluid enters the round chamber via the inlet and spirally flows through an inside of the round chamber along the arc-shaped guiding channel so as to make the fluid in the box body generate a flow with a specific direction and stay for enough time to be sufficiently irradiated by UV rays. Thereby, a better effect of sterilization may be obtained.

Abstract: A primary controller applied to a primary side of a power converter includes a ripple cancellation circuit, a compensation voltage generation circuit, and a gate control signal generation circuit. The ripple cancellation circuit generates an adjustment according to a current flowing through a feedback pin of the primary controller during turning-on of a power switch of the primary side of the power converter. The compensation voltage generation circuit generates a compensation voltage of a compensation pin of the primary controller according to the adjustment, a reference voltage, and a feedback voltage of the feedback pin. The gate control signal generation circuit generates a gate control signal to the power switch to reduce an output voltage of a secondary side of the power converter according to the compensation voltage and a detection voltage.

Abstract: A topical subcutaneous microcirculation detection device includes a first light source module, a second light source module, a lens plate, a first light sensor, and a second light sensor. The first and second light source modules are configured to emit first and second illumination beams, respectively. A flat plate portion of the lens plate is disposed to lean against a first portion of skin of a subject. A convex surface of a first convex lens portion of the lens plate is disposed to push into a second portion of the skin of the subject. The first and second illumination beams are reflected into first and second reflected beams by the first and second portions of the skin, respectively. The first and second reflected beams are transmitted to the first and second light sensors, respectively.

Abstract: A data reading method is provided. The method includes: according to a first read command received from a host system, sending a first read command sequence, which is configured to instruct a reading of a plurality of physical units of the rewritable non-volatile memory module to obtain first data; identifying data stored in at least one first physical unit in the physical units as uncorrectable data according to the first data; according to a second command received from the host system, sending a second read command sequence, which is configured to instruct a reading of the physical units of the rewritable non-volatile memory module to obtain second data; generating response data corresponding to the second read command according to the second data and padding data, which is configured to replace the data read from the at least one first physical unit; and transmitting the response data to the host system.

Abstract: The invention refers to a terminal structure of a high-frequency signal connector and the manufacturing method thereof, in which multiple first terminals and multiple second terminals, multiple excavation areas and multiple trimming lines are trimmed from a tape, each of the first terminals is located on one side of each of the second terminals, each of the excavation areas and each of the trimming lines are located between each of the first terminals and each of the second terminals, respectively, followed by stamping each of the first terminals and each of the second terminals to form a first terminal set and a second terminal set.

Abstract: A method for forming a semiconductor device structure includes providing a substrate and forming a gate electrode on the substrate. A first contact structure is formed in and on the gate electrode. The first contact structure comprises a first portion and a second portion. The first portion is formed in the gate electrode, and the second portion is formed on the first portion.

Abstract: An optical transceiver module and an optical cable module using the same are provided. The optical transceiver module: a substrate; at least one optical receiving device connected to the substrate; a plurality of optical transmitting devices connected to the substrate, wherein the optical transmitting devices comprise a plurality of first optical transmitting devices and a plurality of second optical transmitting devices, and the optical transmitting devices are misaligned to each other.

Abstract: A primary controller applied to a primary side of a power converter includes a ripple cancellation circuit, a compensation voltage generation circuit, and a gate control signal generation circuit. The ripple cancellation circuit generates an adjustment according to a current flowing through a feedback pin of the primary controller during turning-on of a power switch of the primary side of the power converter. The compensation voltage generation circuit generates a compensation voltage of a compensation pin of the primary controller according to the adjustment, a reference voltage, and a feedback voltage of the feedback pin. The gate control signal generation circuit generates a gate control signal to the power switch to reduce an output voltage of a secondary side of the power converter according to the compensation voltage and a detection voltage.

Abstract: Semiconductor devices and methods of forming the same are provided. A method according to an embodiment includes receiving a substrate including a lower contact feature, depositing a first dielectric layer over a substrate, forming a metal-insulator-metal (MIM) structure over the first dielectric layer, depositing a second dielectric layer over the MIM structure, performing a first etch process to form an opening that extends through the second dielectric layer to expose the MIM structure, performing a second etch process to extend the opening through the MIM structure to expose the first dielectric layer; and performing a third etch process to further extend the opening through the first dielectric layer to expose the lower contact feature. Etchants of the first etch process and the third etch process include fluorine while the etchant of the second etch process is free of fluorine.

Abstract: An electronic device includes a rod, a first sleeve, and a second sleeve. The rod has a first portion and a second portion. The first portion includes a touch head. The first sleeve is slidably sleeved on the first portion of the rod, and is movable between a first position and a second position of the first portion. When the first sleeve is at the first position, the electronic device is adapted to serve as a roller-type input device. A function of the roller-type input device is controlled according to information of the first sleeve or the second sleeve rotating relative to the rod. When the first sleeve is at the second position, the touch head is exposed from the first sleeve and enabled, so that the electronic device is adapted to serve as a stylus. In addition, an electronic system with the electronic device is also mentioned.

Abstract: The present invention is to provide an optical transceiver module comprising a housing, a substrate, an optical receiving device and a plurality of optical transmitting devices. The substrate is disposed in the housing. The optical receiving device is disposed on the substrate. The plurality of optical transmitting devices are connected to the substrate, and there is a tilt angle between the optical transmitting devices and the substrate.

Abstract: Semiconductor devices and methods of forming the same are provided. A method according to an embodiment includes receiving a substrate including a lower contact feature, depositing a first dielectric layer over a substrate, forming a metal-insulator-metal (MIM) structure over the first dielectric layer, depositing a second dielectric layer over the MIM structure, performing a first etch process to form an opening that extends through the second dielectric layer to expose the MIM structure, performing a second etch process to extend the opening through the MIM structure to expose the first dielectric layer; and performing a third etch process to further extend the opening through the first dielectric layer to expose the lower contact feature. Etchants of the first etch process and the third etch process include fluorine while the etchant of the second etch process is free of fluorine.

Abstract: The disclosure provides an electronic package and a method of manufacturing the same. The method is characterized by encapsulating an electronic component with a packaging layer and forming on an upper surface of the packaging layer a circuit structure that is electrically connected to the electronic component; and forming a stress-balancing layer on a portion of the lower surface of the packaging layer to balance the stress exerted on the upper and lower surfaces of the packaging layer, thereby reducing the overall package warpage and facilitating the manufacturing process.

Abstract: A portable electronic device includes a cover, a hinge structure, a base, and a removable component. The base is pivotally connected to the cover through the hinge structure, and the base comprises an accommodating groove adjacent to the cover. The removable component is detachably disposed in the accommodating groove. When the removable component is disposed at a first position in the accommodating groove, the hinge structure locks a rotation of the cover relative to the base.

Abstract: A light field near-eye display device and a method of light field near-eye display are provided. The light field near-eye display device includes a display, a processor, a lens array, and at least one lens. The display is configured to emit an image beam. The processor is electrically connected to the display, and configured to control a display content of the display. The lens array is disposed on a transmission path of the image beam. The lens is disposed between the display and an eye. The image beam is projected to the eye through the lens array and the lens, so as to form a light field virtual image. The processor is configured to receive aberration data of the eye which is input by the user and cause the light field virtual image to be formed in focus range corresponding to the aberration data of the eye.

Abstract: Provided is an optical cable module, comprising an optical fiber cable, and an optical transceiver module. The optical transceiver module comprises a substrate; at least one optical transmitting device connected to the substrate; a plurality of optical receiving devices connected to the substrate, wherein the optical receiving devices are cylindrical optical receiving devices, and an air tightness of each of the cylindrical optical receiving devices is in a range of 1×10-12 atm*cc/sec to 5*10-7 atm*cc/sec; at least one optical receiving holder configured to assemble the optical receiving devices, wherein the optical receiving devices are secured in the optical receiving holder.

Abstract: Provided is an optical transceiver module, comprising a housing, a substrate, an optical receiving device and a plurality of optical transmitting devices. The substrate is disposed in the housing. The optical receiving device is disposed on the substrate. The plurality of optical transmitting devices are connected to the substrate, and the optical transmitting devices are arranged in an alternating manner. The optical transceiver module effectively utilizes the internal space thereof for a compact design and can have a simple structure for manufacturing.

Abstract: A display device is provided. The display device includes a display module and an antenna coil. The display panel has a first substrate, a second substrate, a common electrode layer, a TFT layer and a light modulating layer. The common electrode layer is disposed between the first substrate and the second substrate. The antenna coil is disposed on the side of the first substrate or the second substrate facing away from the light modulating layer. The orthogonal projection of the antenna coil on the light common electrode defines a contour of the antenna coil, wherein the common electrode layer is discontinuous along at least one part of the contour.

Abstract: An integrated circuit includes a plurality of peripheral input/output pins, a plurality of general-purpose input/output pins, a link network, and a network control circuit. The link network is coupled to the plurality of peripheral input/output pins and the plurality of general-purpose input/output pins. The network control circuit is coupled to the link network, and controls the respective connections between the plurality of peripheral input/output pins and the plurality of general-purpose input/output pins via the link network according to correspondence between the plurality of peripheral input/output pins and the plurality of general-purpose input/output pins.

Abstract: Semiconductor devices, integrated circuits and methods of forming the same are provided. In one embodiment, a method includes depositing a first dielectric layer over a metal pad disposed over a workpiece, forming a first opening in the first dielectric layer to expose a portion of the metal pad, after the forming of the first opening, forming a second dielectric layer over the exposed portion of the metal pad, depositing a first polymeric material over the second dielectric layer, forming a second opening through the first polymeric material and the second dielectric layer to expose the metal pad, and forming a bump feature over the exposed metal pad.