Abstract: A method of fabricating a semiconductor package is provided, including: disposing a semiconductor element on a carrier; forming an encapsulant on the carrier to encapsulant the semiconductor element; forming at least one through hole penetrating the encapsulant; forming a hollow conductive through hole in the through hole and, at the same time, forming a circuit layer on an active surface of the semiconductor element and the encapsulant; forming an insulating layer on the circuit layer; and removing the carrier. By forming the conductive through hole and the circuit layer simultaneously, the invention eliminates the need to form a dielectric layer before forming the circuit layer and dispenses with the conventional chemical mechanical polishing (CMP) process, thus greatly improving the fabrication efficiency.

Abstract: A semiconductor package is provided, which includes: a soft layer having opposite first and second surfaces and first conductive through hole vias; a chip embedded in the soft layer and having an active surface exposed from the first surface of the soft layer; a support layer formed on the second surface of the soft layer and having second conductive through hole vias in electrical connection with the first conductive through hole vias; a first RDL structure formed on the first surface of the soft layer and electrically connected to the active surface of the chip; and a second RDL structure formed on the support layer and electrically connected to the first RDL structure through the first and second conductive through hole vias. The invention prevents package warpage by providing the support layer, and allows disposing of other packages or electronic elements by electrically connecting the RDL structures through the conductive through hole vias.

Abstract: A method of fabricating a semiconductor package is provided, including: disposing a semiconductor element on a carrier; forming an encapsulant on the carrier to encapsulant the semiconductor element; forming at least one through hole penetrating the encapsulant; forming a hollow conductive through hole in the through hole and, at the same time, forming a circuit layer on an active surface of the semiconductor element and the encapsulant; forming an insulating layer on the circuit layer; and removing the carrier. By forming the conductive through hole and the circuit layer simultaneously, the invention eliminates the need to form a dielectric layer before forming the circuit layer and dispenses with the conventional chemical mechanical polishing (CMP) process, thus greatly improving the fabrication efficiency.

Abstract: A chip-scale package includes an encapsulating layer, a chip embedded in the encapsulating layer and having an active surface exposed from the encapsulating layer, a buffering dielectric layer formed on the encapsulating layer and the chip, a build-up dielectric layer formed on the buffering dielectric layer, and a circuit layer formed on the build-up dielectric layer and having conductive blind vias penetrating the build-up dielectric layer and being in communication with the openings of the buffering dielectric layer and electrically connected to the chip, wherein the build-up dielectric layer and the buffering dielectric layer are made of different materials. Therefore, delamination does not occur between the buffering dielectric layer and the encapsulating layer, because the buffering dielectric layer is securely bonded to the encapsulating layer and the buffering dielectric layer is evenly distributed on the encapsulating layer.

Abstract: A lead frame structure is provided, which includes a die pad having a first mounting portion and a second mounting portion separated from the first mounting portion by a gap. The first and second mounting portions are formed with corresponding blocking surfaces bordering the gap, so as to allow a flow rate of an encapsulating resin flowing through the gap during a molding process to be reduced by the blocking surfaces, such that different portions of the encapsulating resin respectively flowing above, in and below the die pad can have substantially the same flow rate, thereby preventing bonding wires from being deformed to cause short circuit and avoiding formation of voids. A semiconductor package with the lead frame structure is also provided.

Abstract: An electronic device includes a base and an adjustment mechanism including an elevating member, a first elastic member, a moveable member and a damper. The elevating member has a plurality of grooves, and is moveably disposed on the base. The elastic member connects the elevating member and the base. The moveable member has an engaging portion, and is moveable between a first position and a second position. The damper connects with the elevating member to limit speed of the elevating member. When the moveable member is in the first position, the engaging portion is engaged with one of the grooves. When the moveable member is in the second position, the engaging portion is disengaged from the engaged groove so that the elevating member is moveable with respect to the base so as to adjust the height of the electronic device.

Abstract: A lamp assembly and an air guide plate thereof. The lamp assembly and the air guide plate are positioned in a projector. The lamp assembly comprises a base with a bottom portion and an opening, and a lamp with a bulb disposed at the bottom portion in a manner such that it extends toward the opening. The air guide plate comprises a body, a first guide portion, a second guide portion, and a third guide portion. The first guide portion substantially extends between the bulb and the bottom portion. The second guide portion substantially extends toward the bulb. The third guide portion substantially extends between the bulb and the opening.

Abstract: An optical assembly includes a barrel including a slot, a lens installed inside the barrel for magnifying an image, a magnification-adjusting mechanism installed outside and around the barrel including an adjusting loop installed outside the barrel in a rotatable manner including a groove on a side facing the barrel, and a roller installed between the adjusting loop and the barrel. The optical machine further includes a rod for adjusting the magnification of the lens. One end of the rod is installed inside the slot of the barrel in a slidable manner, and another end of the rod is installed inside the groove of the adjusting loop in a slidable manner.

Abstract: A lead frame structure is provided, which includes a die pad having a first mounting portion and a second mounting portion separated from the first mounting portion by a gap. The first and second mounting portions are formed with corresponding blocking surfaces bordering the gap, so as to allow a flow rate of an encapsulating resin flowing through the gap during a molding process to be reduced by the blocking surfaces, such that different portions of the encapsulating resin respectively flowing above, in and below the die pad can have substantially the same flow rate, thereby preventing bonding wires from being deformed to cause short circuit and avoiding formation of voids. A semiconductor package with the lead frame structure is also provided.

Abstract: A projector includes a housing, a projection module installed inside the housing, a connection interface installed on the housing for connecting external devices, and an illumination module installed on the housing for illuminating the connection interface. The projector further includes a switch installed on the housing for switching on the illumination module.

Abstract: An optical assembly includes a barrel including a slot, a lens installed inside the barrel for magnifying an image, a magnification-adjusting mechanism installed outside and around the barrel including an adjusting loop installed outside the barrel in a rotatable manner including a groove on a side facing the barrel, and a roller installed between the adjusting loop and the barrel. The optical machine further includes a rod for adjusting the magnification of the lens. One end of the rod is installed inside the slot of the barrel in a slidable manner, and another end of the rod is installed inside the groove of the adjusting loop in a slidable manner.

Abstract: A projector having a light-shielding module. The projector comprises a housing, a light engine, and a light-shielding module. The housing has a aperture. The light engine includes a projection lens. The projection lens is disposed in the housing, and relative to the aperture in order to project an image. The light-shielding module has an adjustable light-shielding zone, and is used for selectably shielding the image.

Abstract: A projection optical system includes an illumination system, a first adjusting device for adjusting an aperture size of the illumination system, a projection lens, a second adjusting device for adjusting an aperture size of the projection lens, and a controller. According to a look-up table or a predetermined calculation equation, the controller is used for controlling the second adjusting device and the first adjusting device to synchronously adjust the aperture size of the projection lens and the aperture size of the illumination system.

Abstract: An electronic device includes a base and an adjustment mechanism including an elevating member, a first elastic member, a moveable member and a damper. The elevating member has a plurality of grooves, and is moveably disposed on the base. The elastic member connects the elevating member and the base. The moveable member has an engaging portion, and is moveable between a first position and a second position. The damper connects with the elevating member to limit speed of the elevating member. When the moveable member is in the first position, the engaging portion is engaged with one of the grooves. When the moveable member is in the second position, the engaging portion is disengaged from the engaged groove so that the elevating member is moveable with respect to the base so as to adjust the height of the electronic device.

Abstract: A lamp assembly and an air guide plate thereof. The lamp assembly and the air guide plate are positioned in a projector. The lamp assembly comprises a base with a bottom portion and an opening, and a lamp with a bulb disposed at the bottom portion in a manner such that it extends toward the opening. The air guide plate comprises a body, a first guide portion, a second guide portion, and a third guide portion. The first guide portion substantially extends between the bulb and the bottom portion. The second guide portion substantially extends toward the bulb. The third guide portion substantially extends between the bulb and the opening.

Abstract: An adjusting device comprising a foot member, a supporting member, and a moving member. The supporting member is fixed to the foot member, and the moving member includes at least a moving body, an elastic device and a button. The moving body includes two passageways, one of which is sized to receive the supporting member so that the moving body can move vertically and is coupled to the supporting member, and the other of which is sized to receive the elastic device so that the elasticity of the elastic device embeds in the passageway horizontally to clip to the supporting member so that the moving body is fixed to the supporting member. The button is movable horizontally or vertically and is buckled to the moving body, through which the user can impose a force horizontally or vertically to deform the elastic device, so that the elastic device can disengage from the supporting member for the adjustment.

Abstract: A method to modify the structure of sugars is provided.

Abstract: A novel pathway for the synthesis of polyhydroxyalkanoates is provided. A method of synthesizing a recombinant polyhydroxyalkanoate monomer synthase is also provided. These recombinant polyhydroxyalkanoate synthases are derived from multifunctional fatty acid synthases or polyketide synthases and generate hydroxyacyl acids capable of polymerization by a polyhydroxyalkanoate synthase. Also provided is a biosynthetic gene cluster for methymycin and pikomycin as well as a biosynthetic gene cluster for desosamine.

Abstract: An adjusting device comprising a foot member, a supporting member, and a moving member. The supporting member is fixed to the foot member, and the moving member includes at least a moving body, an elastic device and a button. The moving body includes two passageways, one of which is sized to receive the supporting member so that the moving body can move vertically and is coupled to the supporting member, and the other of which is sized to receive the elastic device so that the elasticity of the elastic device embeds in the passageway horizontally to clip to the supporting member so that the moving body is fixed to the supporting member. The button is movable horizontally or vertically and is buckled to the moving body, through which the user can impose a force horizontally or vertically to deform the elastic device, so that the elastic device can disengage from the supporting member for the adjustment.

Abstract: A novel pathway for the synthesis of polyhydroxyalkanoates is provided. A method of synthesizing a recombinant polyhydroxyalkanoate monomer synthase is also provided. These recombinant polyhydroxyalkanoate synthases are derived from multifunctional fatty acid synthases or polyketide synthases and generate hydroxyacyl acids capable of polymerization by a polyhydroxyalkanoate synthase. Also provided is a biosynthetic gene cluster for methymycin and pikomycin as well as a biosynthetic gene cluster for desosamine.