Abstract: The present invention discloses an air compression system having a characteristic of storing unstable energy and a method for controlling the same. The air compression system comprises an energy conversion system, an energy storage device, a compression device, and an air storage device. The control method comprises the steps of: the energy conversion system collecting the unstable natural energy and converting the unstable energy into a mechanical energy; the energy conversion system transmitting the mechanical energy to the energy storage device for storage; the energy storage device transmitting the energy to the compression device; the compression device utilizing the energy for compressing air for at least one whole stroke; and the compression device storing the compressed air in the air storage device.

Abstract: A mold making system for surface patterning of a roller mold is provided. The roller mold includes a transparent hollow roller and a polymer layer disposed at an outer surface of the transparent hollow roller. The mold making system includes a laser generation device, an optical path changing device, and a control device connected to the optical path changing device. The laser generation device is used for generating an ultrafast laser. The optical path changing device is disposed at an inner space of the transparent hollow roller to receive the ultrafast laser. The control device controls the optical path changing device to guide the ultrafast laser to pass through the transparent hollow roller and to be focused at a focus position in the polymer layer.

Abstract: An automatic search system and a method for assisting a mobile apparatus to search for a matching device are provided. The automatic search method includes the following steps. First, N sets of consecutive images are captured at N time points respectively when the mobile apparatus moves along a first direction. The N is a positive integer greater than 1. Next, the N sets of consecutive images are received, and several image features of the N sets of images are compared, so as to determine accordingly whether the matching device exists in the first direction. If it is determined that the matching device exists, a route signal and an adjustment signal are generated. Next, according to the route signal, the mobile apparatus is controlled to move to an adjacent position of the matching device. Also, according to the adjustment signal, the mobile apparatus is controlled to be combined with the matching device.

Abstract: An image capturing system and a sensing module are provided. The image capturing system includes a lens module, an image sensing element, and an adjustment element. The lens module is used for converging light of an object to an imaging surface. The image sensing element has a receiving surface for receiving the light of the object to form an image. The adjustment element is connected to the image sensing element and used for adjusting a curvature value of the receiving surface, so that the receiving surface matches the imaging surface.

Abstract: A method for bonding two pieces of a glassy metal includes:(a) partially immersing the two pieces of the glassy metal in a liquid cooling medium; and (b) welding the two pieces of the glassy metal, which are cooled by the cooling medium at the same time, using pulsed electric arc techniques. The cooling medium provides a cooling rate that is sufficient to prevent crystallization in melted portions of the two pieces of the glassy metal from occurring during welding.

Abstract: A method for manufacturing a bonded wafer with ultra-thin single crystal ferroelectric film is provided, comprising the following steps: providing a single crystal ferroelectric wafer and a carrier wafer while activating the surfaces of the single crystal ferroelectric wafer and the carrier wafer; bonding the activated surface of the single crystal ferroelectric wafer to the activated surface of the carrier wafer; and thinning the single crystal ferroelectric wafer for forming an ultra-thin single crystal ferroelectric film. Wherein, the thinning process in the aforesaid preferred embodiment is the method of polishing, grinding, chemical mechanical polishing, or etching. And the bonding force generated in the bonding process is strong enough to resist the shearing force.

Abstract: The present invention is related to a method for fabricating an imprint mold which can be used in the field of nano-imprint lithography. Firstly, a diamond film and a photoresist film are successively formed onto a substrate; wherein the photoresist film is more capable of anticorrosion than the diamond film. Then an energy beam lithography system is provided to make the photoresist film form a photoresist mask with particularly arranged patterns. Because of the etching selectivity between the diamond film and the photoresist film, on the surface of the diamond film a pattern can be easily formed with recessions and protrusions according to the photoresist mask by dry etching method.

Abstract: A method for manufacturing a bonded wafer with ultra-thin single crystal ferroelectric film is provided, comprising the following steps: providing a single crystal ferroelectric wafer and a carrier wafer while activating the surfaces of the single crystal ferroelectric wafer and the carrier wafer; bonding the activated surface of the single crystal ferroelectric wafer to the activated surface of the carrier wafer; and thinning the single crystal ferroelectric wafer for forming an ultra-thin single crystal ferroelectric film. Wherein, the thinning process in the aforesaid preferred embodiment is the method of polishing, grinding, chemical mechanical polishing, or etching. And the bonding force generated in the bonding process is strong enough to resist the shearing force.

Abstract: The processing chamber comprises an energy wave source and a curved spherical surface, wherein the curved spherical surface of the chamber is composed of at least a Fresnel reflector for reflecting the energy wave discharged from the energy wave source and projecting the same onto a platform as the energy wave source is operating in coordination with the curved spherical surface. In addition, the energy wave source can be a microwave source or a light source. It is noted that the curved spherical surface can be a Fresnel reflector, a wave spherical surface with a portion thereof being replaced by a Fresnel reflector, a curved spherical surface with a portion therof being replaced by at least two Fresnel reflectors, and a surface entirely formed of a plurality of Fresnel reflectors.

Abstract: A process for making a diamond film with low surface roughness. A substrate is provided. A diamond layer is deposited on the substrate. A binder layer is coated over the diamond layer. A carrier plate is provided to join with the binder layer, thereby forming a laminate structure. The substrate is then removed, thereby obtaining a diamond film with a low surface roughness with respect to the surface roughness of the removed substrate.

Abstract: The present invention is related to a structure of an imprint mold and a method for fabricating the same, which can be used in the field of nano-imprint lithography. Firstly, a diamond film and a photoresist film are successively formed onto a substrate; wherein the photoresist film is more capable of anticorrosion than the diamond film. Then an energy beam lithography system is provided to make the photoresist film form a photoresist mask with particularly arranged patterns. Because of the etching selectivity between the diamond film and the photoresist film, on the surface of the diamond film can be easily formed a pattern with recessions and protrusions according to the photoresist mask by dry etching method. Thus an imprint mold characterized as better antifriction and easily taking off from imprinted materials is completed.

Abstract: A conductive wiring layer structure, applied to the conductive wiring layer structure under bonding pads of a die. The die has a substrate and can be partitioned into a central core circuit and a peripheral bonding pad area. The conductive wire layer structure has a plurality of trapezium conductive wiring regions and a plurality of inverse trapezium conductive wiring regions alternately arranged in the bonding pad area. Each of the equilateral and inverse trapezium conductive wiring regions has a plurality of dielectric layers and a plurality of conductive wiring layers alternately overlaying each other on the substrate. The conductive wiring layers of the trapezium conductive wiring region are wider as approaching the substrate, and become narrower as distant away from the substrate. The conductive wiring layers of the inverse trapezium conductive wiring region are narrower as approaching the substrate, and wider as distant away from the substrate.

Abstract: A substrate temperature control apparatus adopted for use in plasma diamond coating of a substrate to reduce warping caused by excessive temperature variations includes a holding dock with a temperature sensor, a cooler and a heater installed therein. During the plasma process, if the detected temperature variation is excessive, the cooler or heater is activated to control the temperature of the upper surface and the lower surface of the substrate so that the temperature on two sides are controlled within a selected range to reduce warping.

Abstract: A process for making a diamond film with low surface roughness. A substrate is provided. A diamond layer is deposited on the substrate. A binder layer is coated over the diamond layer. A carrier plate is provided to join with the binder layer, thereby forming a laminate structure. The substrate is then removed, thereby obtaining a diamond film with a low surface roughness with respect to the surface roughness of the removed substrate.

Abstract: A chip package structure comprising a carrier, a chip, a plurality of passive components, a plurality of conductive wires and some insulating material is provided. The passive components are attached to the surface of the carrier with its electrodes connected to a power contact and a ground contact respectively. The conductive wires cross over the passive components with its ends connected respectively to a bonding pad on the chip and a signal contact close to the edge of the carrier. With the wires crossing over the passive components that are positioned close to a chip bonding area of the carrier, contact between the wires and the electrodes is prevented and the space for accommodating conductive wires is increased.

Abstract: A method for bonding patterned imprint by transferring is disclosed, which comprises the following steps: (a) providing a first module having a molding substrate, a molding layer and a patterned molding features, and a second module having a substrate; wherein said molding layer and said patterned molding features are located on said molding substrate; (b) coating a release layer on said molding features; (c) filling a transfer layer into the recess which is located between the patterned molding features; (d) coating an adhesion layer on said substrate of said second module; (e) combining and contacting said second module and said first module together for transferring said transfer layer to said substrate of said second module; and (f) separating said second module from said first module.

Abstract: A grid array packaged integrated circuit includes a substrate and a chip with a core circuit. The chip is disposed on the substrate. The chip includes I/O devices, bonding pad arranged on the chip in a multi-tier manner surrounding the I/O devices, metal traces and vias on metal layers of the chip for electrically connecting each I/O device and each bonding pad, rings and fingers surrounding the chip on the substrate, and bonding wires for electrically connecting each bonding pad to a corresponding finger or to a corresponding ring. Bonding pads electrically connected to different voltage levels can share the same I/O device.

Abstract: A microelement piezoelectric feedback type picking and releasing device is constructed to include a piezoelectric material, an IDT (interdigital transducer) electrode plated and a progressive electrode plated on the piezoelectric material, the progressive electrode having a plurality of electrode elements of different sizes arranged in proper order in one direction, the IDT electrode forming a releasing unit by means of surface acoustic wave/ultrasonic wave and serving as a voltage signal feedback sensor for clamping force control.

Abstract: A microelement piezoelectric feedback type picking and releasing device is constructed to include a piezoelectric material, an IDT (interdigital transducer) electrode plated and a progressive electrode plated on the piezoelectric material, the progressive electrode having a plurality of electrode elements of different sizes arranged in proper order in one direction, the IDT electrode forming a releasing unit by means of surface acoustic wave/ultrasonic wave and serving as a voltage signal feedback sensor for clamping force control.

Abstract: A process method of using excimer laser for forming micro spherical and non-spherical polymeric structure array includes a photomask which has a selected curved pattern formed thereon. The curved pattern has non-constant widths along a straight line direction. An excimer laser beam source is deployed to project through the photomask on a substrate coated with a polymeric material while the substrate is moving in a direction normal to the straight line direction for the polymeric material to receive laser beam projection with different time period. The polymeric material thus may be etched to different depth to form a three dimensional pattern desired. By projecting and etching the polymeric material two times at different directions or through different photomask patterns, a sphere like or non-sphere like surface of micro array structure may be obtained.