Abstract: A hybrid random access memory for a system-on-chip (SOC), including a semiconductor substrate with a MRAM region and a ReRAM region, a first dielectric layer on the semiconductor substrate, multiple ReRAM cells in the first dielectric layer on the ReRAM region, a second dielectric layer above the first dielectric layer, and multiple MRAM cells in the second dielectric layer on the MRAM region.

Abstract: A projection device, including an illumination system, a control element, a driving element, a light valve, and a projection lens, is provided. The illumination system includes multiple light sources for providing multiple light beams to be combined into an illumination light beam. The driving element respectively drives the light sources in a first mode or a second mode, so that the light beams have respective luminous brightness, and the driving element is switched from the first mode to the second mode according to a first signal. The control element provides the first signal to the driving element according to an optical state or a time state of the projection device. The light valve is adapted to convert the illumination light beam into an image light beam. The projection lens is adapted to project the image light beam out of the projection device.

Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A device includes a substrate and a plurality of photosensitive regions in the substrate. The substrate has a first side and a second side opposite to the first side. The device further includes an interconnect structure on the first side of the substrate, and a plurality of recesses on the second side of the substrate. The plurality of recesses extend into a semiconductor material of the substrate.

Abstract: An illumination system for providing an illumination beam includes red, blue, and green light source modules, a first light combining element, and a light uniforming element. The red light source module includes a first red light emitting element emitting first red light and a second red light emitting element emitting second red light. A peak wavelength of the second red light is greater than a peak wavelength of the first red light. The blue light source module includes a first blue light emitting element emitting first blue light and a second blue light emitting element emitting second blue light. A peak wavelength of the second blue light is less than a peak wavelength of the first blue light. The green light source module generates green light. The first light combining element guides these lights into the light uniforming element, so that the illumination system outputs the illumination beam.

Abstract: A semiconductor device includes a substrate, a first and a second nitride-based semiconductor layers, a doped nitride-based semiconductor layer, a gate electrode, a first and a second dielectric protection layers. The second nitride-based semiconductor layer has a bandgap greater than a bandgap of the first nitride-based semiconductor layer. The first and the second dielectric protection layers include oxygen. The first dielectric protection layer is conformal with a profile collectively constructed by the gate electrode, the doped nitride-based semiconductor layer, and the second nitride-based semiconductor layer. The second dielectric protection layer is in contact with the first dielectric protection layer. The first dielectric protection layer has an oxygen concentration less than that of the second dielectric protection layer.

Abstract: An embodiment is a device including a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a first side of the package component. The device also includes a metal layer on a second side of the package component, the second side being opposite the first side. The device also includes a thermal interface material on the metal layer. The device also includes a lid on the thermal interface material. The device also includes a retaining structure on sidewalls of the package component and the thermal interface material. The device also includes a package substrate connected to the conductive connectors, the lid being adhered to the package substrate.

Abstract: A method of forming a semiconductor structure includes: attaching a semiconductor device to a first surface of a substrate; placing a thermal interface material (TIM) film over a first side of the semiconductor device distal from the substrate, where the TIM film is pre-formed before the placing, where after the placing, a peripheral portion of the TIM film extends laterally beyond sidewalls of the semiconductor device; and attaching a lid to the first surface of the substrate to form an enclosed space between the lid and the substrate, where after attaching the lid, the semiconductor device and the TIM film are disposed in the enclosed space, where a first side of the TIM film distal from the substrate contacts the lid.

Abstract: A switch mode power supply circuit with high voltage output, an electrostatic spray apparatus and agricultural plant protection apparatus using the same are provided. The switch mode power supply circuit is electrically connected in series with at least a pre-stage power converter and a post-stage power converter. In order to simplify the control, the switch of the pre-stage power converter is omitted, only one switch of the post-stage power converter is adopted to perform synchronous control. Since the multiple sets of power conversion circuits in the previous stage are connected in series, the turn ratio of the transformer in the power converter in the subsequent stage can be reduced. Therefore, the transformer can be miniaturized and the power supply circuit would be more suitable for agricultural plant protection machine and electrostatic spray apparatus.

Abstract: A method of forming a semiconductor structure includes: attaching a semiconductor device to a first surface of a substrate; placing a thermal interface material (TIM) film over a first side of the semiconductor device distal from the substrate, where the TIM film is pre-formed before the placing, where after the placing, a peripheral portion of the TIM film extends laterally beyond sidewalls of the semiconductor device; and attaching a lid to the first surface of the substrate to form an enclosed space between the lid and the substrate, where after attaching the lid, the semiconductor device and the TIM film are disposed in the enclosed space, where a first side of the TIM film distal from the substrate contacts the lid.

Abstract: A method of forming a semiconductor structure includes: attaching a semiconductor device to a first surface of a substrate; placing a thermal interface material (TIM) film over a first side of the semiconductor device distal from the substrate, where the TIM film is pre-formed before the placing, where after the placing, a peripheral portion of the TIM film extends laterally beyond sidewalls of the semiconductor device; and attaching a lid to the first surface of the substrate to form an enclosed space between the lid and the substrate, where after attaching the lid, the semiconductor device and the TIM film are disposed in the enclosed space, where a first side of the TIM film distal from the substrate contacts the lid.

Abstract: The application provides an information dissemination system including a first electronic device and a router. The first electronic device receives a first sound signal and recognizes the first sound signal according to a speech recognition algorithm to generate a first address information and a first coded information content. The router is connected to a local area network to receive the first encoded information content and semantically parse the first encoded information content to produce a parsed result. The router sends the parsed result over local area network. The router determines whether the first address indicated by the first address information is in the local area network according to the first address information, so as to send the parsed result to at least a second electronic device corresponding to the first address.

Abstract: The application provides an information dissemination system including a first electronic device and a router. The first electronic device receives a first sound signal and recognizes the first sound signal according to a speech recognition algorithm to generate a first address information and a first coded information content. The router is connected to a local area network to receive the first encoded information content and semantically parse the first encoded information content to produce a parsed result. The router sends the parsed result over local area network. The router determines whether the first address indicated by the first address information is in the local area network according to the first address information, so as to send the parsed result to at least a second electronic device corresponding to the first address.

Abstract: A tool-free hard disk bracket includes a base having abase body with a guide groove, and an engaging member connected to the base body. A frame includes a first side arm movably engaging with the engaging member. A handgrip is rotatably connected to one end of the base body. An operating unit includes an operating member releasably engaging with the handgrip and having a rotating shaft portion inserted rotatably and movably into the guide groove. The operating member is operated to rotate and release engagement with the handgrip, and is further operated to move along the guide groove toward the engaging member to push the engaging member to pivot and release engagement with the first side arm.

Abstract: An active duct noise control system and a method thereof are provided, including a duct, a noise source speaker, a microphone, a plurality of noise-cancelling speakers, and a plurality of controllers. Wherein, the noise source speaker generates the primary noise, and the microphone is disposed to receive the residual noise. The plurality of noise-cancelling speakers are disposed between the noise source speaker and the microphone and respectively generate noise-cancelling audio frequencies to offset the primary noise and reduce the residual noise. The plurality of controllers are respectively connected to the plurality of noise-cancelling speakers and the noise source speaker and calculate each of the noise-cancelling audio frequencies generated by each of the plurality of noise-cancelling speakers according to the multi-channel inverse filtering principle.

Abstract: This application provides an ultraviolet alignment illumination system and a detection device for same. The ultraviolet alignment illumination system includes an electronic calculator unit and a power-on device, a power-on device including a probe unit, and the probe unit including a plurality of probe ends.

Abstract: A tool-free hard disk bracket includes a base having abase body with a guide groove, and an engaging member connected to the base body. A frame includes a first side arm movably engaging with the engaging member. A handgrip is rotatably connected to one end of the base body. An operating unit includes an operating member releasably engaging with the handgrip and having a rotating shaft portion inserted rotatably and movably into the guide groove. The operating member is operated to rotate and release engagement with the handgrip, and is further operated to move along the guide groove toward the engaging member to push the engaging member to pivot and release engagement with the first side arm.