Abstract: A semiconductor package may include a redistribution substrate, a first semiconductor chip on the redistribution substrate, and a second semiconductor chip between the redistribution substrate and the first semiconductor chip. The second semiconductor chip may have a width in a first direction that is smaller than a width of the first semiconductor chip in the first direction. The first semiconductor chip may include a first alignment key pattern on a bottom surface thereof. The second semiconductor chip may be spaced apart from the first alignment key pattern. The second semiconductor chip may include a second interconnection layer on the bottom surface of the first semiconductor chip, a second semiconductor substrate on a bottom surface of the second interconnection layer and exposing a bottom surface of an edge region of the second interconnection layer, and a second alignment key pattern on the edge region of the second interconnection layer.

Abstract: An integrated circuit device includes a semiconductor substrate, first through-silicon-via (TSV) structures penetrating a first region of the semiconductor substrate and spaced apart from each other by a first pitch, a first individual device between the first TSV structures and spaced apart from the first TSV structures by a distance that is greater than a first keep-off distance, and second TSV structures penetrating a second region of the semiconductor substrate and spaced apart from each other by a second pitch that is less than the first pitch. The second region of the semiconductor device does not include an individual device that is homogeneous with the first individual device and between the second TSV structures.

Abstract: A semiconductor package includes a first semiconductor chip including a first substrate and a first bonding layer disposed on the first substrate, and having a flat first outer surface provided by the first bonding layer; and a second semiconductor chip disposed on the first outer surface of the first semiconductor chip, including a second substrate and a second bonding layer disposed on the second substrate, and having a flat second outer surface provided by the second bonding layer and contacting the first outer surface of the first semiconductor chip. The first bonding layer includes a first outermost insulating layer providing the first outer surface, a first internal insulating layer stacked between the first outermost insulating layer and the first substrate, first external marks disposed in the first outermost insulating layer and spaced apart from each other, and first internal marks interlaced with the first external marks within the first internal insulating layer.

Abstract: A semiconductor package includes a first semiconductor chip comprising a semiconductor substrate and a redistribution pattern on a top surface of the semiconductor substrate, the redistribution pattern having a hole exposing an inner sidewall of the redistribution pattern, a second semiconductor chip on a top surface of the first semiconductor chip, and a bump structure disposed between the first semiconductor chip and the second semiconductor chip. The bump structure is disposed in the hole and is in contact with the inner sidewall of the redistribution pattern.

Abstract: An artificial intelligence apparatus for generating training data includes a memory configured to store a target artificial intelligence model, and a processor configured to receive sensor data, determine whether the received sensor data is irrelevant to a learning of the target artificial intelligence model, determine whether the received sensor data is useful for the learning if the received sensor data is determined to be relevant to the learning, extract a label from the received sensor data by using a label extractor if the received sensor data is determined to be useful for the learning, determine a confidence level of the extracted label, and generate training data including the received sensor data and the extracted label if the determined confidence level exceeds a first reference value.

Abstract: An artificial intelligence (AI) device may acquire user information, use information of a home appliance and weather information, acquire whether use of the home appliance is recommended and a recommended use time of the home appliance from the user information, the use information of the home appliance and the weather information, using an appliance use recommendation model, and output a recommendation comment indicating information on use of the home appliance based on the recommended use time.

Abstract: A laundry treatment device includes a washing module configured to perform operation related to washing, a camera configured to capture an image of a tag attached to a laundry, and a processor configured to acquire laundry information of a plurality of laundries, to convert the acquired laundry information into encoding data, and to acquire values of laundry control variables corresponding to the converted encoding data based on a laundry course learning model learned using a plurality of reference data through a deep learning algorithm.

Abstract: A semiconductor package includes a package substrate, a lower semiconductor device arranged on the package substrate and including first through electrodes, first lower connection bumps arranged between the package substrate and the lower semiconductor device and electrically connecting the package substrate to the first through electrodes, a connecting substrate arranged on the package substrate and including second through electrodes, second lower connection bumps arranged between the package substrate and the connecting substrate and electrically connecting the package substrate to the second through electrodes, and an upper semiconductor device arranged on the lower semiconductor device and electrically connected to the first through electrodes and the second through electrodes.

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a first semiconductor structure and a second semiconductor structure that are on the first semiconductor chip and spaced apart from each other across the second semiconductor chip, and a resin-containing member between the second semiconductor chip and the first semiconductor structure and between the second semiconductor chip and the second semiconductor structure. The semiconductor package may be fabricated at a wafer level.

Abstract: A method of manufacturing a semiconductor package includes preparing a wafer structure having a first semiconductor substrate and a plurality of first front surface connection pads. A lower semiconductor chip having a preliminary semiconductor substrate and a plurality of second front surface connection pads are attached to the wafer structure such that the plurality of first front surface connection pads and the plurality of second front surface connection pads correspond to each other. A plurality of bonding pads is formed by bonding together the plurality of first front surface connection pads and the plurality of second front surface connection pads corresponding to each other. A second semiconductor substrate having a horizontal width that is less than that of the second wiring structure is formed by removing a portion of the preliminary semiconductor substrate.

Abstract: An integrated circuit device includes a semiconductor substrate, first through-silicon-via (TSV) structures penetrating a first region of the semiconductor substrate and spaced apart from each other by a first pitch, a first individual device between the first TSV structures and spaced apart from the first TSV structures by a distance that is greater than a first keep-off distance, and second TSV structures penetrating a second region of the semiconductor substrate and spaced apart from each other by a second pitch that is less than the first pitch. The second region of the semiconductor device does not include an individual device that is homogeneous with the first individual device and between the second TSV structures.

Abstract: An image sensor package comprises: an image sensor chip configured to convert light collected from an outside thereof into an electrical signal; a package substrate disposed under the image sensor chip the package substrate configured to process the electrical signal converted from the image sensor chip; a glass substrate disposed over the image sensor chip while being spaced apart from the image sensor chip; a seal pattern disposed between an upper surface of the package substrate and a lower surface of the glass substrate while surrounding the image sensor chip; and a protection pattern disposed on the package substrate outside the seal pattern, the protection pattern comprising a single-component material, wherein the seal pattern comprises a material different from the material of the protection pattern.

Abstract: According to an embodiment of the present disclosure, a refrigerator may include a storage compartment, a door, one or more cameras provided in the door, a global DB configured to store a plurality of default food identification items and a plurality of default product names respectively corresponding to the plurality of default food identification items, and a local DB configured to store edited product names and a food identification item corresponding to the edited product names, and a processor configured to photograph an internal image of the storage compartment, obtain one or more food identification items from the photographed internal image, and if the obtained one or more food identification items are stored in the local DB, recognize one or more product names of the obtained one or more food identification items as product names of the food identification items stored in the local DB.

Abstract: Disclosed is an artificial intelligence (AI) apparatus comprising: a short-range communication module configured for sensing a plurality of laundry treatment apparatuses positioned around the AI apparatus; and a processor configured for: acquiring laundry information about laundry and characteristic information of each of the detected laundry treatment apparatuses; determining a laundry group corresponding to the laundry, based on the acquired laundry information; comparing characteristic information of the determined laundry group and characteristic information of each of the plurality of laundry treatment apparatuses with each other; and determining a laundry treatment apparatus for washing the laundry among the plurality of laundry treatment apparatuses based on the comparison result.

Abstract: According to an embodiment of the present disclosure, a refrigerator may include a storage compartment, an outer door, one or more cameras provided in the outer door, a global DB configured to store a plurality of default food identification items and a plurality of default product names respectively corresponding to the plurality of default food identification items, and a local DB configured to store edited product names and a food identification item corresponding to the edited product names, and a processor configured to photograph an internal image of the storage compartment through the one or more cameras, obtain a food identification item from the photographed internal image, determine whether the obtained food identification item is stored in the local DB, and when the food identification item is not stored in the local DB, determine whether the obtained food identification item is stored in the global DB.

Abstract: According to an embodiment of the present disclosure, a refrigerator may include a storage compartment, a door, one or more cameras provided in the door, a global DB configured to store a plurality of default food identification items and a plurality of default product names respectively corresponding to the plurality of default food identification items, and a local DB configured to store edited product names and a food identification item corresponding to the edited product names, and a processor configured to photograph an internal image of the storage compartment, obtain one or more food identification items from the photographed internal image, and if the obtained one or more food identification items are stored in the local DB, recognize one or more product names of the obtained one or more food identification items as product names of the food identification items stored in the local DB.

Abstract: A package-on-package type package includes a lower semiconductor package and an upper semiconductor package. The lower semiconductor package includes a first semiconductor device including a through electrode, a second semiconductor device disposed on the first semiconductor device and including a second through electrode electrically connected to the first through electrode, a first molding member covering a sidewall of at least one of the first semiconductor device and the second semiconductor device, a second molding member covering a sidewall of the first molding member, and an upper redistribution layer disposed on the second semiconductor device and electrically connected to the second through electrode.

Abstract: An embodiment of the present invention provides an artificial intelligence (AI) apparatus for recognizing a speech of a user, the artificial intelligence apparatus includes a memory to store a speech recognition model and a processor to obtain a speech signal for a user speech, to convert the speech signal into a text using the speech recognition model, to measure a confidence level for the conversion, to perform a control operation corresponding to the converted text if the measured confidence level is greater than or equal to a reference value, and to provide feedback for the conversion if the measured confidence level is less than the reference value.

Abstract: An image forming apparatus may include a memory storing computer-executable instructions and a processor. The processor is to execute the computer-executable instructions to execute a service program management module of an application framework layer, according to a request of a user-defined service program having application service rights of an application layer, register a service provided by the user-defined service program in the service program management module, request an operation of a system service requiring system service rights of an operating system layer, and manage the registered service.

Abstract: A chip-stacked semiconductor package includes a first chip including a first detection pad and a second detection pad; a second chip provided on the first chip, the second chip including a third detection pad facing the first detection pad and a fourth detection pad facing the second detection pad; and a first medium provided between the first detection pad and the third detection pad to connect the first detection pad to the third detection pad through the first medium, and a second medium, different from the first medium, provided between the second detection pad and the fourth detection pad to connect the second detection pad to the fourth detection pad through the second medium.