Abstract: Disclosed herein is a washing machine including a first data acquirer configured to collect data related to a laundry pattern of a user, a second data acquirer configured to collect data related to context information, and a processor configured to provide the laundry pattern of the user and the context information to a reinforcement learning model as an environment and to train the reinforcement learning model using feedback of the user on a recommended laundry course when the reinforcement learning model recommends the laundry course.

Abstract: A package-on-package type package includes a lower semiconductor package and an upper semiconductor package. The lower semiconductor package includes a first semiconductor device including a through electrode, a second semiconductor device disposed on the first semiconductor device and including a second through electrode electrically connected to the first through electrode, a first molding member covering a sidewall of at least one of the first semiconductor device and the second semiconductor device, a second molding member covering a sidewall of the first molding member, and an upper redistribution layer disposed on the second semiconductor device and electrically connected to the second through electrode.

Abstract: Disclosed is a laundry scheduling apparatus. The apparatus includes a communication unit, an output unit, and a processor configured to pair with at least one washing machine via the communication unit, obtain laundry preference parameters of a user generated by learning based on at least one of a deep learning algorithm or a machine learning algorithm, using at least one of a laundry log of the user or laundry satisfaction information of the user as input data, generate laundry scheduling information by using washing machine information about the paired at least one washing machine, the laundry preference parameters, and laundry item information obtained via at least one of a user input unit, an interface unit, or a sensor, and cause the output unit to output the laundry scheduling information.

Abstract: An embodiment of the present invention provides an artificial intelligence (AI) apparatus for recognizing a speech of a user, the artificial intelligence apparatus includes a memory to store a speech recognition model and a processor to obtain a speech signal for a user speech, to convert the speech signal into a text using the speech recognition model, to measure a confidence level for the conversion, to perform a control operation corresponding to the converted text if the measured confidence level is greater than or equal to a reference value, and to provide feedback for the conversion if the measured confidence level is less than the reference value.

Abstract: A semiconductor package including a substrate; a first semiconductor chip on the substrate; a second semiconductor chip on the first semiconductor chip; and at least one connection terminal between the first semiconductor chip and the second semiconductor chip, wherein the first semiconductor chip includes a first semiconductor chip body; and at least one upper pad on a top surface of the first semiconductor chip body and in contact with the at least one connection terminal, the at least one upper pad includes a recess that is downwardly recessed from a top surface thereof, and a depth of the recess is less than a thickness of the at least one upper pad.

Abstract: An image forming apparatus may include a memory storing computer-executable instructions and a processor. The processor is to execute the computer-executable instructions to execute a service program management module of an application framework layer, according to a request of a user-defined service program having application service rights of an application layer, register a service provided by the user-defined service program in the service program management module, request an operation of a system service requiring system service rights of an operating system layer, and manage the registered service.

Abstract: A chip-stacked semiconductor package includes a first chip including a first detection pad and a second detection pad; a second chip provided on the first chip, the second chip including a third detection pad facing the first detection pad and a fourth detection pad facing the second detection pad; and a first medium provided between the first detection pad and the third detection pad to connect the first detection pad to the third detection pad through the first medium, and a second medium, different from the first medium, provided between the second detection pad and the fourth detection pad to connect the second detection pad to the fourth detection pad through the second medium.

Abstract: A light output device for caring for a skin of a user using artificial intelligence includes a plurality of light sources configured to irradiate light, a memory configured to store a skin care model learned using a deep learning algorithm to infer a facial skin state of the user, a camera configured to capture an image of a face of the user, and a processor configured to acquire a skin state of each part of the face based on a first-type face image captured through the camera and the skin care model, and control light output of the plurality of light sources based on the acquired skin state.

Abstract: Disclosed are semiconductor packages and methods of fabricating the same. The semiconductor package comprises a molding layer, a silicon layer on the molding layer, a glass upwardly spaced apart from the silicon layer, and a connection dam coupled to the silicon layer and connecting the silicon layer to the glass. The silicon layer includes a silicon layer body, a silicon layer via extending vertically in the silicon layer body, and a micro-lens array on a top surface of the silicon layer body. A bottom surface of the silicon layer body contacts a top surface of the molding layer. The molding layer includes a molding layer body, a molding layer via that extends vertically in the molding layer body and has electrical connection with the silicon layer via, and a connection ball connected to a bottom surface of the molding layer via.

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a first semiconductor structure and a second semiconductor structure that are on the first semiconductor chip and spaced apart from each other across the second semiconductor chip, and a resin-containing member between the second semiconductor chip and the first semiconductor structure and between the second semiconductor chip and the second semiconductor structure. The semiconductor package may be fabricated at a wafer level.

Abstract: An image sensor package comprises: an image sensor chip configured to convert light collected from an outside thereof into an electrical signal; a package substrate disposed under the image sensor chip the package substrate configured to process the electrical signal converted from the image sensor chip; a glass substrate disposed over the image sensor chip while being spaced apart from the image sensor chip; a seal pattern disposed between an upper surface of the package substrate and a lower surface of the glass substrate while surrounding the image sensor chip; and a protection pattern disposed on the package substrate outside the seal pattern, the protection pattern comprising a single-component material, wherein the seal pattern comprises a material different from the material of the protection pattern.

Abstract: A laundry scheduling device according to an embodiment of the present invention includes an input interface that receives speech including a plurality of words respectively representing a plurality of laundry items from a use, and a processor that acquires one or more features represented by each of the plurality of words by inputting speech data corresponding to the received speech to a learning model and performing word embedding, and generates a laundry schedule of the plurality of laundry items based on the one or more features represented by each of the plurality of words.

Abstract: A semiconductor package includes a first semiconductor chip comprising a semiconductor substrate and a redistribution pattern on a top surface of the semiconductor substrate, the redistribution pattern having a hole exposing an inner sidewall of the redistribution pattern, a second semiconductor chip on a top surface of the first semiconductor chip, and a bump structure disposed between the first semiconductor chip and the second semiconductor chip. The bump structure is disposed in the hole and is in contact with the inner sidewall of the redistribution pattern.

Abstract: An embodiment of the present invention provides an AI apparatus comprising: a communication unit configured to communicate with a plurality of external AI apparatuses; and a processor configured to: receive sound signals of the user from the plurality of external AI apparatus, calculate a distance and a variation of the distance from each of the plurality of external AI apparatus to the user based on the obtained sound signals, determine a current path of the user based on the calculated distance and the calculated variation of the distance, and determine a future path of the user based on the current path.

Abstract: An integrated circuit device includes a semiconductor substrate, first through-silicon-via (TSV) structures penetrating a first region of the semiconductor substrate and spaced apart from each other by a first pitch, a first individual device between the first TSV structures and spaced apart from the first TSV structures by a distance that is greater than a first keep-off distance, and second TSV structures penetrating a second region of the semiconductor substrate and spaced apart from each other by a second pitch that is less than the first pitch. The second region of the semiconductor device does not include an individual device that is homogeneous with the first individual device and between the second TSV structures.

Abstract: An embodiment of the present invention provides an artificial intelligence (AI) apparatus for recognizing a speech of a user, the artificial intelligence apparatus includes a memory to store a speech recognition model and a processor to obtain a speech signal for a user speech, to convert the speech signal into a text using the speech recognition model, to measure a confidence level for the conversion, to perform a control operation corresponding to the converted text if the measured confidence level is greater than or equal to a reference value, and to provide feedback for the conversion if the measured confidence level is less than the reference value.

Abstract: Disclosed herein an artificial intelligence apparatus for recognizing speech with multiple languages including a microphone, and a processor configured to obtain, via the microphone, speech data including speech of a user with multiple languages, calculate a word recognition reliability of each word in the obtained speech data using an acoustic model of a main language, calculate a word recognition reliability of each word in the obtained speech data using an acoustic model of at least one sub language, select a language having a highest word recognition reliability for each word, convert the speech data into text in consideration of a word recognition result corresponding to the selected language for each word, and generate a speech recognition result corresponding to the speech data using the converted text.

Abstract: An AI device is provided. The AI device includes a memory to store data, a voice acquisition interface to acquire a voice signal, and a processor to perform preprocessing for the voice signal based on a parameter, to provide the preprocessed voice signal to a voice recognition model, to acquire a voice recognition result, to store a characteristic of the preprocessed voice signal in the memory, and to change the parameter using a distribution of characteristics of voice signals accumulated in the memory.

Abstract: A semiconductor package includes at least one second semiconductor chip stacked on a first semiconductor chip. An underfill layer is interposed between the first semiconductor chip and the at least one second semiconductor chip. The first semiconductor chip includes a first substrate, a first passivation layer disposed on the first substrate. The first passivation layer includes a first recess region. A first pad covers a bottom surface and sidewalls of the first recess region. The at least one second semiconductor chip includes a second substrate, a second passivation layer disposed adjacent to the first substrate, a conductive bump protruding outside the second passivation layer towards the first semiconductor chip and an inter-metal compound pattern disposed in direct contact with both the conductive bump and the first pad. The underfill layer is in direct contact with both the conductive bump and the inter-metal compound pattern.

Abstract: An electronic apparatus and a method of operating an electronic apparatus are provided. The method includes receiving an application including at least one of a user interface (UI) element, a data element, or a logical element, receiving a modifiability file indicating one or more of the at least one of the user interface (UI) element, the data element, or the logical element of the application that can be modified and an extent of the modifiability, installing the application including the modifiability file on the electronic apparatus, receiving a user selection to modify one or more of the UI element, the data element, or the logical element, creating a modification file based on the user modification, and storing the modification file for user selection and execution.