Abstract: In one example, a semiconductor device includes a first substrate with a first substrate top side, a first substrate bottom side opposite to the first substrate top side, a first substrate lateral side interposed between the first substrate top side and the first substrate bottom side, and a first substrate conductive structure. An electronic component is coupled to the first substrate top side and coupled to the first substrate conductive structure. A support includes a support wall having a first ledge coupled to the first substrate top side, a first riser coupled to the first substrate lateral side, and a second ledge extending from the first riser away from the first substrate lateral side. Other examples and related methods are also disclosed herein.

Abstract: An electrical connector assembly includes a housing defining an interior space and a slot and a spring pin terminal disposed within the slot of the housing. The spring pin terminal includes a first contact portion, a second contact portion, and an intermediate portion that extends between the first contact portion and the second contact portion. The first contact portion includes a contact point that engages a first electrically conductive structure and a retention force support that engages a portion of the intermediate portion of the spring pin terminal. The second contact portion includes a contact point that engages a second electrically conductive structure and a retention force and alignment support that engages the intermediate portion of the spring pin terminal.

Abstract: In one example, a semiconductor device comprises a first substrate comprising a first conductive structure, a first body over the first conductive structure and comprising an inner sidewall defining a cavity in the first body, a first interface dielectric over the first body, and a first internal interconnect in the first body and the first interface dielectric, and coupled with the first conductive structure. The semiconductor device further comprises a second substrate over the first substrate and comprising a second interface dielectric, a second body over the second interface dielectric, and a second conductive structure over the second body and comprising a second internal interconnect in the second body and the second interface dielectric. An electronic component is in the cavity, and the second internal interconnect is coupled with the first internal interconnect. Other examples and related methods are also disclosed herein.

Abstract: A sealed electrical connector assembly includes a connector housing having a first end, a second end, and an opening that extends from the first end to the second end. The opening defines an inner surface of the connector housing. A seal is disposed within the opening of the connector housing and includes a first end, a second end, an outer surface, and a slot that extends from the first end of the seal to the second end of the seal. The outer surface of the seal is in sealing engagement with the inner surface of the connector housing, and the slot defines an inner surface of the seal. A flat flexible conductor disposed within the slot of the seal and includes a plurality of electrically conductive traces and an outer surface. The outer surface of the flat flexible conductor is in sealing engagement with the inner surface of the seal.

Abstract: The present disclosure relates to a sensor boss, a sensor assembly and an exhaust system, wherein the sensor boss comprises a base and a fluid channel, the base comprises a base body and a mounting hole penetrating the base body, the mounting hole is used to install a sensor through it, the base body is used to fix the sensor boss on a fluid pipeline, and the fluid channel extends from an inlet end to an outlet end in a first direction to accommodate a probe of the sensor.

Abstract: A sealed electrical connector assembly includes a connector housing having a first end, a second end, and an opening that extends from the first end to the second end. The opening defines an inner surface of the connector housing. A seal is disposed within the opening of the connector housing and includes a first end, a second end, an outer surface, and a slot that extends from the first end of the seal to the second end of the seal. The outer surface of the seal is in sealing engagement with the inner surface of the connector housing, and the slot defines an inner surface of the seal. A flat flexible conductor disposed within the slot of the seal and includes a plurality of electrically conductive traces and an outer surface. The outer surface of the flat flexible conductor is in sealing engagement with the inner surface of the seal.

Abstract: An electrical connector assembly includes an electrically conductive structure having a flat flexible conductor that supports a plurality of electrically conductive traces. A wire contact wedge includes a base having an opening extending therethrough and first and second wedge arms that extend from the base. The electrically conductive structure extends through the opening of the base and between the first and second wedge arms. A connector housing supports the wire contact wedge and the electrically conductive structure. The connector housing includes a body having an abutment surface that engages a corresponding abutment surface of the base of the wire contact wedge. A front cover is supported on the connector housing and includes a retaining arm that cooperates with a corresponding protrusion provided on the wire contact wedge.

Abstract: An electrical connector assembly includes an electrically conductive structure having a flat flexible conductor that supports a plurality of electrically conductive traces. A wire contact wedge includes a base having an opening extending therethrough and first and second wedge arms that extend from the base. The electrically conductive structure extends through the opening of the base and between the first and second wedge arms. A connector housing supports the wire contact wedge and the electrically conductive structure. The connector housing includes a body having an abutment surface that engages a corresponding abutment surface of the base of the wire contact wedge. A front cover is supported on the connector housing and includes a retaining arm that cooperates with a corresponding protrusion provided on the wire contact wedge.

Abstract: In one example, a semiconductor device, comprises a first redistribution layer (RDL) substrate comprising a first dielectric structure and a first conductive structure through the first dielectric structure and comprising one or more first conductive redistribution layers, an electronic component over the first RDL substrate, wherein the electronic component is coupled with the first conductive structure, a body over a top side of the first RDL substrate, wherein the electronic component is in the body, a second RDL substrate comprising a second dielectric structure over the body, and a second conductive structure through the second dielectric structure and comprising one or more second conductive redistribution layers, and an internal interconnect coupled between the first conductive structure and the second conductive structure. Other examples and related methods are also disclosed herein.

Abstract: In one example, a semiconductor device comprises a first substrate comprising a first conductive structure, a first body over the first conductive structure and comprising an inner sidewall defining a cavity in the first body, a first interface dielectric over the first body, and a first internal interconnect in the first body and the first interface dielectric, and coupled with the first conductive structure. The semiconductor device further comprises a second substrate over the first substrate and comprising a second interface dielectric, a second body over the second interface dielectric, and a second conductive structure over the second body and comprising a second internal interconnect in the second body and the second interface dielectric. An electronic component is in the cavity, and the second internal interconnect is coupled with the first internal interconnect. Other examples and related methods are also disclosed herein.

Abstract: A semiconductor package structure and a method for making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a connect die that routes electrical signals between a plurality of other semiconductor die.

Abstract: Provided are a CIS/CGS/CIGS thin-film manufacturing method and a solar cell manufactured by using the same. The CIS/CGS/CIGS thin-film manufacturing method enables CIS, CGS, and CIGS thin-films through depositing an electrode layer on a substrate and depositing a light absorber layer by sputtering a single target of each of CIS including copper (Cu), indium (In), and selenium (Se) and CGS copper (Cu), gallium (Ga) and selenium (Se). In addition, a solar cell having excellent structural, optical and electrical properties is prepared by using the same. Thus, a thin-film can be prepared by depositing a CIG, CGS, or CIGS light absorber layer with a single sputtering process by using a single target of each of CIS (CuInSe2) and CGS (CuGaSe2), to thereby enable to manufacture thin-films of various characteristics according to a control of a composition ratio of In and Ga as well as simplification of the process, and to thus provide a very favorable effect on the economics and efficiency.