Patents by Inventor Hyuk-Soo Lee
Hyuk-Soo Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9874335Abstract: Provided is a printed circuit board including: a support substrate including a first area in which a light emitting device is mounted, and a second area extending from the first area; a bending part which is configured such that a part between the first area and the second area is bent; a through hole passing through the bending part; a connection wiring connected to the light emitting device and disposed on the bending part; and a wiring connected to the connection wiring.Type: GrantFiled: November 27, 2013Date of Patent: January 23, 2018Assignee: LG INNOTEK CO., LTD.Inventors: Seung Kwon Hong, Hyun Gyu Park, In Hee Cho, Hyuk Soo Lee
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Patent number: 9844142Abstract: Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.Type: GrantFiled: July 15, 2011Date of Patent: December 12, 2017Assignee: LG INNOTEK CO., LTD.Inventors: In Hee Cho, Yun Ho An, Eun Jin Kim, Hae Yeon Kim, Jae Man Park, Hyun Gyu Park, Hyuk Soo Lee
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Patent number: 9572250Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a first part, a second part below the first part, a third part between the first and second parts, and at least one barrier layer including a metal different from a metal of the first to third parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.Type: GrantFiled: December 23, 2011Date of Patent: February 14, 2017Assignee: LG INNOTEK CO., LTD.Inventors: Sang Myung Lee, Sung Woon Yoon, Hyuk Soo Lee, Sung Won Lee, Ki Do Chun
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Patent number: 9549458Abstract: Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.Type: GrantFiled: October 5, 2011Date of Patent: January 17, 2017Assignee: LG INNOTEK CO., LTD.Inventors: Hyun Gyu Park, Eun Jin Kim, Hae Yeon Kim, Jae Man Park, Yun Ho An, Hyuk Soo Lee, In Hee Cho
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Patent number: 9504146Abstract: Provided are a heat radiation printed circuit board and a method of manufacturing the same, the heat radiation printed circuit board being produced by the method including: forming a circuit layer having an insulating layer, a circuit pattern and a solder resist on a first area of one surface of a metal substrate; and forming a bending part in a second area, in which the insulating layer is not formed, by bending the metal substrate, whereby a crack can be prevented in advance from being generated in the insulating layer, and durability and reliability of the heat radiation printed circuit board and a backlight unit applying the same can be improved.Type: GrantFiled: December 17, 2012Date of Patent: November 22, 2016Assignee: LG INNOTEK CO., LTD.Inventors: Hyun Gyu Park, In Hee Cho, Seung Kwon Hong, Min Jae Kim, Hyuk Soo Lee
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Patent number: 9497853Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a center part having a first width and a contact part having a second width, the contact part makes contact with a surface of the core insulating layer, and the first width is larger than the second width. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.Type: GrantFiled: December 23, 2011Date of Patent: November 15, 2016Assignee: LG INNOTEK CO., LTD.Inventors: Sang Myung Lee, Sung Woon Yoon, Hyuk Soo Lee, Sung Won Lee, Ki Do Chun
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Patent number: 9488773Abstract: Provided are a circuit board for irradiating light to a light guide plate and a flat panel display having a structure for efficiently fixing the circuit board and the light guide plate, the circuit board, including: a support substrate comprising a first area and a second area, the second area being bent from the first area; a plurality of light emitting device mounting parts disposed in the first area; and a protective member connecting part of an outer side of the plurality of light emitting device mounting parts.Type: GrantFiled: January 15, 2014Date of Patent: November 8, 2016Assignee: LG INNOTEK CO., LTD.Inventors: Seung Kwon Hong, Hyun Gyu Park, In Hee Cho, Nam Yang Lee, Hyuk Soo Lee
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Patent number: 9307675Abstract: Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.Type: GrantFiled: October 10, 2011Date of Patent: April 5, 2016Assignee: LG INNOTEK CO., LTD.Inventors: Hyun Gyu Park, Eun Jin Kim, Hae Yeon Kim, Jae Man Park, Yun Ho An, Hyuk Soo Lee, In Hee Cho
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Patent number: 9282637Abstract: There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler.Type: GrantFiled: August 16, 2013Date of Patent: March 8, 2016Assignee: LG INNOTEK CO., LTD.Inventors: Sung Jin Yun, Hyuk Soo Lee, In Hee Cho, Jae Man Park, Myeong Jeong Kim, Jong Heum Yoon, Jeung Ook Park, Jong Sik Lee, Gun Young Gil, Thanh Kieu Giang, Jin Hwan Kim
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Publication number: 20150289358Abstract: Provided are a heat radiation printed circuit board and a method of manufacturing the same, the heat radiation printed circuit board being produced by the method including: forming a circuit layer having an insulating layer, a circuit pattern and a solder resist on a first area of one surface of a metal substrate; and forming a bending part in a second area, in which the insulating layer is not formed, by bending the metal substrate, whereby a crack can be prevented in advance from being generated in the insulating layer, and durability and reliability of the heat radiation printed circuit board and a backlight unit applying the same can be improved.Type: ApplicationFiled: December 17, 2012Publication date: October 8, 2015Inventors: Hyun Gyu Park, In Hee Cho, Seung Kwon Hong, Min Jae Kim, Hyuk Soo Lee
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Patent number: 9000071Abstract: An epoxy resin compound including an epoxy resin, a hardening agent, and an inorganic filler as a main component is provided. The epoxy resin includes an epoxy resin represented by a chemical formula. Therefore, the epoxy resin having a mesogen structure that increases crystallinity is used, and thus thermal conductivity can be increased. Further, the epoxy resin is used as an insulating material for a printed circuit board, and thus a high radiant heat substrate can be provided.Type: GrantFiled: April 29, 2013Date of Patent: April 7, 2015Assignee: LG Innotek Co., Ltd.Inventors: Jae Man Park, Hae Yeon Kim, SungBae Moon, Jeungook Park, SungJin Yun, JongHeum Yoon, Hyuk Soo Lee, Jaehun Jeong, In Hee Cho
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Patent number: 8956919Abstract: The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.Type: GrantFiled: December 23, 2009Date of Patent: February 17, 2015Assignee: LG Innotek Co., Ltd.Inventors: Hyun A. Chun, Jae Bong Choi, Sung Won Lee, Sung Wuk Ryu, Hyuk Soo Lee, Sai Ran Eom
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Patent number: 8806888Abstract: An air conditioning system includes a phase separator separating a gaseous refrigerant and a liquid refrigerant from a flowing refrigerant, an evaporator evaporating the liquid refrigerant separated by the phase separator, and at least one compressor including a first compressing part receiving the refrigerant via the evaporator and a second compressing part receiving both of the gaseous refrigerant separated by the phase separator and the refrigerant via the first compressing part.Type: GrantFiled: January 3, 2007Date of Patent: August 19, 2014Assignee: LG Electronics Inc.Inventors: Young Hwan Ko, Hyuk Soo Lee, Bum Suk Kim, Sang Kyoung Park, Byung Soon Kim
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Publication number: 20140198530Abstract: Provided are a circuit board for irradiating light to a light guide plate and a flat panel display having a structure for efficiently fixing the circuit board and the light guide plate, the circuit board, including: a support substrate comprising a first area and a second area, the second area being bent from the first area; a plurality of light emitting device mounting parts disposed in the first area; and a protective member connecting part of an outer side of the plurality of light emitting device mounting parts.Type: ApplicationFiled: January 15, 2014Publication date: July 17, 2014Applicant: LG INNOTEK CO., LTD.Inventors: Seung Kwon HONG, Hyun Gyu PARK, In Hee CHO, Nam Yang LEE, Hyuk Soo LEE
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Publication number: 20140153221Abstract: Provided is a printed circuit board including: a support substrate including a first area in which a light emitting device is mounted, and a second area extending from the first area; a bending part which is configured such that a part between the first area and the second area is bent; a through hole passing through the bending part; a connection wiring connected to the light emitting device and disposed on the bending part; and a wiring connected to the connection wiring.Type: ApplicationFiled: November 27, 2013Publication date: June 5, 2014Applicant: LG INNOTEK CO., LTD.Inventors: Seung Kwon HONG, Hyun Gyu PARK, In Hee CHO, Hyuk Soo LEE
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Publication number: 20140069705Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a first part, a second part below the first part, a third part between the first and second parts, and at least one barrier layer including a metal different from a metal of the first to third parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.Type: ApplicationFiled: December 23, 2011Publication date: March 13, 2014Applicant: LG INNOTEK CO., LTD.Inventors: Sang Myung Lee, Sung Woon Yoon, Hyuk Soo Lee, Sung Won Lee, Ki Do Chun
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Publication number: 20140060893Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer. The via includes a first part, a second part below the first part, and a third part between the first and second parts, and the third part includes a metal different from a metal of the first and second parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.Type: ApplicationFiled: December 23, 2011Publication date: March 6, 2014Applicant: LG INNOTEK CO., LTD.Inventors: Sang Myung Lee, Sung Woon Yoon, Hyuk Soo Lee, Sung Won Lee, Ki Do Chun
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Publication number: 20140054069Abstract: Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a center part having a first width and a contact part having a second width, the contact part makes contact with a surface of the core insulating layer, and the first width is larger than the second width. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.Type: ApplicationFiled: December 23, 2011Publication date: February 27, 2014Applicant: LG INNOTEK CO., LTD.Inventors: Sang Myung Lee, Sung Woon Yoon, Hyuk Soo Lee, Sung Won Lee, Ki Do Chun
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Patent number: 8659131Abstract: The present invention relates to structure and manufacture method for multi-row lead frame and semiconductor package, the method characterized by forming a pad portion on a metal material (first step); performing a surface plating process or organic material coating following the first pattern formation (second step); forming a second pattern on the metal material (third step); and packaging a semiconductor chip following the second pattern formation (fourth step), whereby an under-cut phenomenon is minimized by applying a gradual etching.Type: GrantFiled: September 25, 2009Date of Patent: February 25, 2014Assignee: LG Innotek Co., Ltd.Inventors: Ji Yun Kim, Hyun Sub Shin, Sung Won Lee, Hyung Eui Lee, Yeong Uk Seo, Sung Wuk Ryu, Hyuk Soo Lee
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Patent number: 8658471Abstract: The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.Type: GrantFiled: December 23, 2009Date of Patent: February 25, 2014Assignee: LG Innotek Co., Ltd.Inventors: Hyun A. Chun, Jae Bong Choi, Sung Won Lee, Sung Wuk Ryu, Hyuk Soo Lee, Sai Ran Eom