Patents by Inventor Hyuk-Soo Lee
Hyuk-Soo Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8658471Abstract: The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.Type: GrantFiled: December 23, 2009Date of Patent: February 25, 2014Assignee: LG Innotek Co., Ltd.Inventors: Hyun A. Chun, Jae Bong Choi, Sung Won Lee, Sung Wuk Ryu, Hyuk Soo Lee, Sai Ran Eom
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Publication number: 20140048316Abstract: There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler.Type: ApplicationFiled: August 16, 2013Publication date: February 20, 2014Applicant: LG INNOTEK CO., LTD.Inventors: Sung Jin YUN, Hyuk Soo LEE, In Hee CHO, Jae Man PARK, Myeong Jeong KIM, Jong Heum YOON, Jeung Ook PARK, Jong Sik LEE, Gun Young GIL, Thanh Kieu GIANG, Jin Hwan KIM
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Publication number: 20130284502Abstract: An epoxy resin compound including an epoxy resin, a hardening agent, and an inorganic filler as a main component is provided. The epoxy resin includes an epoxy resin represented by a chemical formula. Therefore, the epoxy resin having a mesogen structure that increases crystallinity is used, and thus thermal conductivity can be increased. Further, the epoxy resin is used as an insulating material for a printed circuit board, and thus a high radiant heat substrate can be provided.Type: ApplicationFiled: April 29, 2013Publication date: October 31, 2013Applicant: LG INNOTEK CO., LTD.Inventors: Jae Man PARK, Hae Yeon KIM, SungBae MOON, Jeungook PARK, SungJin YUN, JongHeum YOON, Hyuk Soo LEE, Jaehun JEONG, In Hee CHO
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Patent number: 8561439Abstract: A fabric treating machine according to the present invention comprises a connector which is disposed at an outer tub and is connected to a driving part which is disposed at either the center or the off-center position of the connector optionally. Therefore, not only the direct driving motor but the indirect driving motor can be disposed without change of the outer tub and the connector. Because the common use of the outer tub is possible regardless of the connecting method of the driving part, there are the advantages that the cost is reduced and productivity and assembly are improved.Type: GrantFiled: February 18, 2010Date of Patent: October 22, 2013Assignee: LG Electronics Inc.Inventors: Hyuk Soo Lee, Tae Hee Lee, Young Jong Kim
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Publication number: 20130206459Abstract: Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.Type: ApplicationFiled: October 5, 2011Publication date: August 15, 2013Applicant: LG INNOTEK CO., LTD.Inventors: Hyun Gyu Park, Eun Jin Kim, Hae Yeon Kim, Jae Man Park, Yun Ho An, Hyuk Soo Lee, In Hee Cho
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Publication number: 20130188359Abstract: Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.Type: ApplicationFiled: October 10, 2011Publication date: July 25, 2013Applicant: LG INNOTEK CO., LTD.Inventors: Hyun Gyu Park, Eun Jin Kim, Hae Yeon Kim, Jae Man Park, Yun Ho An, Hyuk Soo Lee, In Hee Cho
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Patent number: 8459754Abstract: A washing machine comprises a casing, a top cover installed on an upper surface of the casing, a door installed at the top cover, through which laundry is accommodated into the casing, and a tub installed in the casing, wherein the door is connected to the top cover by a hinge assembly or a damper assembly provided thereat. The hinge assembly includes a first hinge portion, and a second hinge portion having a torsion spring therein. The damper assembly includes a first damper portion, a second damper portion, and a ring member having a round shape and fitted into an outer circumferential surface of the second damper portion. Accordingly, even when the door has a heavy weight due to its material of a reinforcing glass, the hinge assembly or the damper assembly can endure the weight of the door. This may prevent noise or impact occurring when the door is closed.Type: GrantFiled: March 13, 2009Date of Patent: June 11, 2013Assignee: LG Electronics Inc.Inventors: Cheon-Soo Cho, Hyuk-Soo Lee
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Publication number: 20130118782Abstract: Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.Type: ApplicationFiled: July 15, 2011Publication date: May 16, 2013Applicant: LG INNOTEK CO., LTD.Inventors: In Hee Cho, Yun Ho An, Eun Jin Kim, Hae Yeon Kim, Jae Man Park, Hyun Gyu Park, Hyuk Soo Lee
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Publication number: 20120186307Abstract: A fabric treating machine according a present invention comprises a first vibration mitigation part which is disposed between a stator and a bearing unit. Therefore, it can reduce the transfer of the vibration from the driving unit to the bearing unit, and the vibration of an inner tub and an outer tub can be reduced, and a noise can be reduced. Thus, a reliability of product can be improved. Also, a fabric treating machine according a present invention comprises a vibration mitigation part which is disposed between an upper bearing unit and a lower bearing unit. Therefore, it can reduce the vibration transfer from the lower bearing unit to the upper bearing unit, and the vibration of an inner tub and an outer tub can be reduced, and a noise can be reduced.Type: ApplicationFiled: July 29, 2010Publication date: July 26, 2012Applicant: LG ELECTRONICS INC.Inventors: Young Jong Kim, Hyuk Soo Lee
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Patent number: 8216503Abstract: A method for manufacturing a printed circuit board, in which an oxidant capable of polymerizing conductive polymers is selectively marked on a board using imprinting, and the monomer of a conductive polymer is filled in the selected pattern and polymerized, to provide a conductive polymer wiring pattern. With the method for manufacturing a printed circuit board, a printed circuit board can be given finer wiring widths to allow a highly integrated, highly efficient printed circuit board. Thus, a printed circuit board (PCB) or a flexible printed circuit boards (FPCB) can be manufactured that is applicable to industrial, clerical, and domestic electric electronic products, by forming conductive polymer wiring using imprinting.Type: GrantFiled: June 28, 2007Date of Patent: July 10, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae-Choon Cho, Myeong-Ho Hong, Senug-Hyun Ra, Hyuk-Soo Lee, Jeong-Bok Kwak, Jung-Woo Lee, Choon-Keun Lee, Sang-Moon Lee
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Publication number: 20120144875Abstract: The present invention relates to a laundry processing apparatus. In particular, the laundry processing apparatus comprises: a cabinet; an outer chamber provided within the cabinet and in which wash water is filled; an inner chamber rotatably provided within the outer chamber to hold laundry; an upper balancer disposed at an upper portion of the inner chamber; and a lower balancer disposed at a lower portion of the inner chamber, wherein either the upper balancer or the lower balancer is a liquid balancer filled with liquid, and the other balancer is a ball balancer having a ball therein, such that the advantages of maximized balancing results and an effective reduction in vibration may be achieved.Type: ApplicationFiled: March 19, 2010Publication date: June 14, 2012Applicant: LG ELECTRONICS INC.Inventors: Young Jong Kim, Hyuk Soo Lee, Seong No Yoon, Dong Yoon Kim, Dong Min Kim
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Publication number: 20120038036Abstract: The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.Type: ApplicationFiled: December 23, 2009Publication date: February 16, 2012Applicant: LG Innotek Co., Ltd.Inventors: Hyun A. Chun, Jae Bong Choi, Sung Won Lee, Sung Wuk Ryu, Hyuk Soo Lee, Sai Ran Eom
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Publication number: 20110227208Abstract: The present invention relates to structure and manufacture method for multi-row lead frame and semiconductor package, the method characterized by forming a pad portion on a metal material (first step); performing a surface plating process or organic material coating following the first pattern formation (second step); forming a second pattern on the metal material (third step); and packaging a semiconductor chip following the second pattern formation (fourth step), whereby an under-cut phenomenon is minimized by applying a gradual etching.Type: ApplicationFiled: September 25, 2009Publication date: September 22, 2011Inventors: Ji Yun Kim, Hyun Sub Shin, Sung Won Lee, Hyung Eui Lee, Yeong Uk Seo, Sung Wuk Ryu, Hyuk Soo Lee
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Publication number: 20110018408Abstract: A washing machine comprises a casing, a top cover installed on an upper surface of the casing, a door installed at the top cover, through which laundry is accommodated into the casing, and a tub installed in the casing, wherein the door is connected to the top cover by a hinge assembly or a damper assembly provided thereat. The hinge assembly includes a first hinge portion, and a second hinge portion having a torsion spring therein. The damper assembly includes a first damper portion, a second damper portion, and a ring member having a round shape and fitted into an outer circumferential surface of the second damper portion. Accordingly, even when the door has a heavy weight due to its material of a reinforcing glass, the hinge assembly or the damper assembly can endure the weight of the door. This may prevent noise or impact occurring when the door is closed.Type: ApplicationFiled: March 13, 2009Publication date: January 27, 2011Inventors: Cheon-Soo Cho, Hyuk-Soo Lee
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Patent number: 7849705Abstract: An air conditioning system, comprising: a channel to carry a flow of refrigerant, and a first noise reducer to change at least one property of the refrigerant as the refrigerant flows through the channel.Type: GrantFiled: April 4, 2007Date of Patent: December 14, 2010Assignee: LG Electronics Inc.Inventors: Hyuk Soo Lee, Young Hwan Ko, Byung Soon Kim
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Publication number: 20100275624Abstract: An air-conditioning system and a controlling method for the same that is capable of improving the operational efficiency of the air-conditioning system are disclosed. The air-conditioning system includes a phase separator (500) for separating a flowing refrigerant into a gas-phase refrigerant and a liquid-phase refrigerant, an evaporator (600) for evaporating the liquid-phase refrigerant separated by the phase separator (500), a compressor (100) having a first compression part into which the refrigerant having passed through the evaporator (600) is introduced and a second compression part into which both the gas-phase refrigerant separated by the phase separator (500) and the refrigerant having passed through the first compression part are introduced, and a control unit for simultaneously or selectively controlling the amount of the refrigerant introduced into the phase separator (500) and the amount of the refrigerant discharged from the phase separator (500).Type: ApplicationFiled: February 15, 2007Publication date: November 4, 2010Applicant: LG ELECTRONICS INC.Inventors: Hyuk Soo Lee, Young Hwan Ko, Byung Soon Kim
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Publication number: 20100251781Abstract: A washing machine includes: a cabinet forming an external appearance; an outer tub hanging within the cabinet and having an open upper portion allowing the clothes to enter therethrough, and allowing washing water to be put therein; and an inner tub disposed within the outer tub and rotating based on a vertical shaft, wherein the outer tub includes: a base through which a driving shaft rotating the inner tub; and a side wall part extending upward from the base to form a side wall of the outer tub and having a lower portion thicker than an upper portion thereof. The increase in weight according to an increase in capacity can be reduced and a loss of rigidity can be to minimized. Also, because the center of gravity is removed to a lower side, stability with respect to vibrations can be obtained.Type: ApplicationFiled: April 2, 2010Publication date: October 7, 2010Applicant: LG Electronics Inc.Inventors: Hyuk Soo LEE, Tae Hee Lee, Young Jong Kim
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Publication number: 20100212370Abstract: A fabric treating machine according to the present invention comprises a connector which is disposed at an outer tub and is connected to a driving part which is disposed at either the center or the off-center position of the connector optionally. Therefore, not only the direct driving motor but the indirect driving motor can be disposed without change of the outer tub and the connector. Because the common use of the outer tub is possible regardless of the connecting method of the driving part, there are the advantages that the cost is reduced and productivity and assembly are improved.Type: ApplicationFiled: February 18, 2010Publication date: August 26, 2010Applicant: LG Electronics Inc.Inventors: Hyuk Soo LEE, Tae Hee LEE, Young Jong KIM
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Publication number: 20100131115Abstract: The present invention relates to a controlling method of an air conditioner. The controlling method of an air conditioner having a phase separator, an expansion valve, a control valve, an evaporator, a multistage compressor, and a condenser, includes the steps of sensing an order to operate the air conditioner, stabilizing the air conditioner, setting a degree of superheat of refrigerant in the air conditioner, and setting an optimum intermediate pressure of the refrigerant of the air conditioner.Type: ApplicationFiled: October 23, 2007Publication date: May 27, 2010Inventors: Bum Suk Kim, Sang Kyoung Park, Young Hwan Ko, Hyuk Soo Lee
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Publication number: 20090218077Abstract: The present invention discloses an air conditioning system comprises a phase separator separating a gaseous refrigerant and a liquid refrigerant from a flowing refrigerant, an evaporator evaporating the liquid refrigerant separated by the phase separator, and at least one compressor including a first compressing part receiving the refrigerant via the evaporator and a second compressing part receiving both of the gaseous refrigerant separated by the phase separator and the refrigerant via the first compressing part, wherein a volume of a first cylinder of the first compressing part is different from a volume of a second cylinder of the second compressing part.Type: ApplicationFiled: January 3, 2007Publication date: September 3, 2009Applicant: LG ELECTRONICS INC.Inventors: Young Hwan Ko, Hyuk Soo Lee, Bum Suk Kim, Sang Kyoung Park, Byung Soon Kim