Abstract: The present invention relates to a stripper composition for removing photoresists which comprises: a chained amine compound having a weight average molecular weight of more than 95 g/mol; a chained amine compound having a weight average molecular weight of not more than 90 g/mol; a cyclic amine compound; an amide-based compound in which a linear or branched alkyl group having 1-5 carbon atoms is mono- or di-substituted with nitrogen; and a polar organic solvent, wherein the weight ratio of the chained amine compound having a weight average molecular weight of more than 95 g/mol to the chained amine compound having the weight average molecular weight of not more than 90 g/mol is 1:1 to 1:10, and a method for stripping a photoresist using the same.

Abstract: Disclosed are an electronic device and a method for transmitting a message. A method of operating an electronic device may include: determining by a processor whether a call with a counterpart electronic device is possible; and transmitting a call wish message through a communication network to the counterpart electronic device when the call is not possible based on a result of the determination.

Abstract: The present invention relates to a stripper composition for removing photoresists which comprises: a chained amine compound having a weight average molecular weight of more than 95 g/mol; a chained amine compound having a weight average molecular weight of not more than 90 g/mol; a cyclic amine compound; an amide-based compound in which a linear or branched alkyl group having 1-5 carbon atoms is mono- or di-substituted with nitrogen; and a polar organic solvent, wherein the weight ratio of the chained amine compound having a weight average molecular weight of more than 95 g/mol to the chained amine compound having the weight average molecular weight of not more than 90 g/mol is 1:1 to 1:10, and a method for stripping a photoresist using the same.

Abstract: A front end module including an antenna configured to transmit and receive radio frequency signals; a diplexer configured to separate the radio frequency signals transmitted and received through the antenna into different frequency bands; a filter connected to the diplexer; and an inductor circuit comprising at least two inductors respectively disposed between an end of the filter and a ground.

Abstract: A dual-band filter and method thereof include a diplexer configured to process one of a first band signal and a second band signal, which includes a frequency band different from a frequency band of the first band signal, and block the other of the first band signal and the second band signal. A balun is configured to convert the first band signal from a differential signal to a single signal in response to the first band signal being transmitted, and convert the first band signal from a single signal to a differential signal in response to the first band signal being received. A direct current (DC) voltage supply port configured to supply a DC voltage to the balun when the first band signal is received.

Abstract: Disclosed are an electronic device and a method for transmitting a message. A method of operating an electronic device may include: determining by a processor whether a call with a counterpart electronic device is possible; and transmitting a call wish message through a communication network to the counterpart electronic device when the call is not possible based on a result of the determination.

Abstract: A wireless communication module can reduce the number of components through optimum design and improve transmission efficiency by implementing a short wiring. The wireless communication module may include a first front-end module, a second front-end module, and a wiring unit arranged between the first front-end module and the second front-end module to supply power to the first front-end module and the second front-end module. At least one capacitor may be connected to the wiring unit.

Abstract: Disclosed herein are a resin composition of a printed circuit board including a liquid crystal oligomer, an epoxy resin, and a phenolic curing agent having five or more functional groups, an insulating film and a prepreg manufactured using the resin composition, and a printed circuit board including the insulating film or the prepreg. The resin composition for a printed circuit board according to the present invention, and the insulating film and the prepreg manufactured using the same, may have low coefficient of thermal expansion, excellent heat resistance property, and a high glass transition temperature.

Abstract: A resin composition for a printed circuit board and a printed circuit board formed of the same. The resin composition for a printed circuit board may have: a liquid crystal oligomer including a structural unit of the Chemical Formula 1 and a structural unit of the Chemical Formula 2 and including a functional group of the Chemical Formula E on at least one end; and an ether-type naphthalene-based epoxy resin of Chemical Formula N. According to an exemplary embodiment, even though a printed circuit board becomes light, thin, and miniaturized, electric, thermal, and mechanical stability of the printed circuit board may be secured.

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board, and an insulating film, a prepreg, a copper clad laminate, or a printed circuit board manufactured by using the same. More specifically, the insulating resin composition contains an eucryptite inorganic filler having a negative coefficient of thermal expansion, such that a glass transition temperature and a coefficient of thermal expansion may be improved, and warpage of the insulating film, the prepreg, the copper clad laminate, or the printed circuit board manufactured by using the insulating resin composition for a printed circuit board may be minimized.

Abstract: A diplexer may include a diplexer circuit unit including a first branch operating in a first frequency band and a second branch operating in a second frequency band, a static-electricity protection circuit unit connected to at least one of the first branch and the second branch in parallel so as to discharge static electricity flowing in the first or second branch toward an avoidance path, and a compensation circuit unit connected to at least one of the first branch and second branch so as to compensate for degradation caused by the static-electricity protection circuit unit.

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including an amino triazine novolac curing agent having an amino group and a hydroxyl group to have improved coefficient of thermal expansion and glass transition temperature properties, and improved acid resistant property that discoloration of the product is not generated, and an insulating film and a prepreg as products manufactured by using the same.

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including a 4-functional naphthalene-based epoxy resin and having improved coefficient of thermal expansion and glass transition temperature properties, and a prepreg and a printed circuit board as products manufactured by using the same.

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board, an insulating film, a prepreg, and a printed circuit board. More specifically, disclosed herein are an insulating resin composition for a printed circuit board including a maleimide resin having three or more maleimide groups, and the like so that a glass transition temperature and a mechanical strength are improved, an insulating film and a prepreg prepared using the insulating resin composition, and a printed circuit board including the insulating film or the prepreg.

Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg.

Abstract: Disclosed herein are a resin composition of a printed circuit board including a liquid crystal oligomer, an epoxy resin, and a phenolic curing agent having five or more functional groups, an insulating film and a prepreg manufactured using the resin composition, and a printed circuit board including the insulating film or the prepreg. The resin composition for a printed circuit board according to the present invention, and the insulating film and the prepreg manufactured using the same, may have low coefficient of thermal expansion, excellent heat resistance property, and a high glass transition temperature.

Abstract: Disclosed herein is a prepreg including: a reinforcement substrate; and a polymer resin layer formed by impregnating a polymer resin containing a liquid crystal oligomer and an inorganic filler on the reinforcement substrate, wherein an impregnation ratio of the polymer resin is 60 to 85 wt., whereby a product manufactured by using the prepreg may have excellent coefficient of thermal expansion and thermal properties.

Abstract: The present invention relates to a resin composition for a package substrate and a package substrate comprising a core layer and a prepreg using the same, which include a polyester amide liquid crystal oligomer, a bisphenol tetrafunctional epoxy resin, a curing agent, and an inorganic filler, wherein the bisphenol tetrafunctional epoxy resin has a viscosity of greater than 20,000 cps. According to the resin composition for a package substrate in accordance with the present invention can provide a package substrate with reduced substrate warpage by improving heat radiation characteristics of a substrate material. Further, it is possible to improve defects by reducing delamination between a chip and the substrate or occurrence of cracks of solder balls through the reduced substrate warpage characteristics.

Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg.

Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition including a liquid crystal oligomer having a low coefficient of thermal expansion and an improved glass transition temperature, and the like.