Abstract: A method and an apparatus for improving three dimensional (3D) effect of a 3D image collected by a 3D photographing apparatus, and reducing visual fatigue, are provided. A feature point of a left-eye image entering through a left-eye lens and of a right-eye image entering through a right-eye lens is acquired, a disparity between the left- and right-eye images is detected, a distance between the left- and right-eye lenses is controlled so that the disparity between the left- and right-eye images becomes a previously-set reference disparity, and at least one of the left- and right-eye images is shifted so that a convergence point is placed on an object located within the left- and right-eye images.

Abstract: Disclosed are a light guide plate for a non-contact type coordinate input system, a system including the same, and a non-contact type coordinate input method using the same. More particularly, the present invention relates to a light guide plate for a non-contact type coordinate input system, which eliminates inconvenience of a conventional contact-type coordinate input system inputting coordinates through direct contact, and which can reduce use of sensors and optical loss as much as possible. The present invention also relates to a system including the same, and a non-contact type coordinate input method using the same.

Abstract: A memory module may include a module substrate having a side portion. The side portion may be adapted or configured to be inserted into a socket of a main board. A plurality of connection pads may be arranged along the side portion. The connection pads may have a step portion of a first height from a surface of the side portion and a contact portion of a second height that is greater than the first height from the surface of the side portion. At least one semiconductor package may be mounted on the module substrate and electrically connected to the connection pads.

Abstract: A printed circuit board (PCB) prevents damage to tabs of the PCB and pins of a slot by reducing insertion force when the PCB is inserted in the slot. The PCB includes a body portion including a first surface and a second surface and a metal interconnection layer formed on at least one of the first and second surfaces. The metal interconnecting layer includes tabs formed along a first edge of the body portion. An insertion force alleviation portion in which at least a portion of the body portion is removed is formed in the first edge to reduce the insertion force required to seat the PCB within the slot.

Abstract: Provided may be a semiconductor resistance element including resistance patterns disposed on an insulating substrate. The substrate may have first and second planar surfaces disposed in a first direction, third and fourth planar surfaces at least between the first and second planar surfaces in a second direction and fifth and sixth planar surfaces at least between the first and second planar surfaces in a third direction. The semiconductor resistance element may include a first resistance pattern configured to cover a selected one of the first and second planar surfaces and a second resistance pattern on at least one of the third through sixth planar surfaces.

Abstract: Provided may be a semiconductor resistance element including resistance patterns disposed on an insulating substrate. The substrate may have first and second planer surfaces disposed in a first direction, third and fourth planar surfaces at least between the first and second planar surfaces in a second direction and fifth and sixth planar surfaces at least between the first and second planar surfaces in a third direction. The semiconductor resistance element may include a first resistance pattern configured to cover a selected one of the first and second planar surfaces and a second resistance pattern on at least one of the third through sixth planar surfaces.

Abstract: There is disclosed a method of providing detailed information using a multimedia based traffic and travel information message and a terminal for executing the same. A method of providing detailed information using a multimedia based traffic in accordance with this document may comprise receiving transport protocol expert group (TPEG) information, comprising a road traffic message and a multimedia based traffic and travel information message and comprised of a hierarchical structure, displaying one or more events comprised in the road traffic message, allowing a request for detailed information about any one of the events to be input, and receiving detailed information of a multimedia type from a multimedia data providing server through specific one of bearer information comprised in the multimedia based traffic and travel information message and providing the received detailed information.

Abstract: Provided may be a semiconductor resistance element including resistance patterns disposed on an insulating substrate. The substrate may have first and second planer surfaces disposed in a first direction, third and fourth planar surfaces at least between the first and second planar surfaces in a second direction and fifth and sixth planar surfaces at least between the first and second planar surfaces in a third direction. The semiconductor resistance element may include a first resistance pattern configured to cover a selected one of the first and second planar surfaces and a second resistance pattern on at least one of the third through sixth planar surfaces.

Abstract: An image reproducing apparatus and method of controlling the image reproducing apparatus are provided. The method of controlling the image reproducing apparatus includes: determining whether external power is supplied; performing a first booting operation when the external power is supplied; and controlling the image reproducing apparatus to operate in a sleep mode if an operation start signal is not received until the booting operation is completed. The method further includes controlling the image reproducing apparatus to perform a second booting operation to operate in a normal mode after an operation start signal is received. The method further includes performing a resuming operation so that the image reproducing apparatus operates in a normal mode when the operation start signal is received while the image reproducing apparatus operates in the sleep mode. The method further includes operating in an end mode when the sleep mode continues for a predetermined time or longer.

Abstract: A digital multimedia reproducing apparatus capable of receiving and providing digital multimedia broadcasting (DMB) in addition to reproducing moving pictures and music, and a DMB providing method performed in the digital multimedia reproducing apparatus, the digital multimedia reproducing apparatus including: a tuner unit to receive a digital broadcasting signal via a predetermined channel; a channel decoding unit to convert the digital broadcasting signal received from the tuner unit into a digital signal and to produce an MPEG-2 transmission stream therefrom; a decoding unit to demultiplex the MPEG-2 transmission stream to extract video data and audio data and H.264-decode the video data; and a control unit to decode the extracted audio data using bit-sliced arithmetic coding (BSAC) software and to control the decoded audio data and the video data to be output.

Abstract: A method and an apparatus for improving three dimensional (3D) effect of a 3D image collected by a 3D photographing apparatus, and reducing visual fatigue, are provided. A feature point of a left-eye image entering through a left-eye lens and of a right-eye image entering through a right-eye lens is acquired, a disparity between the left- and right-eye images is detected, a distance between the left- and right-eye lenses is controlled so that the disparity between the left- and right-eye images becomes a previously-set reference disparity, and at least one of the left- and right-eye images is shifted so that a convergence point is placed on an object located within the left- and right-eye images.

Abstract: A memory module may include a module substrate having a side portion. The side portion may be adapted or configured to be inserted into a socket of a main board. A plurality of connection pads may be arranged along the side portion. The connection pads may have a step portion of a first height from a surface of the side portion and a contact portion of a second height that is greater than the first height from the surface of the side portion. At least one semiconductor package may be mounted on the module substrate and electrically connected to the connection pads.

Abstract: A semiconductor memory module includes a printed circuit board (PCB) including a rigid PCB part and a flexible PCB part including an overlap portion, a non-overlap portion, and memory components mounted on the PCB. The rigid PCB part includes a first surface and a second surface facing the first surface. The overlap portion of the flexible PCB part overlaps the rigid PCB part, and the non-overlap portion does not overlap the rigid PCB part. The flexible PCB part may include an overlap stacked structure including at least one doubling portion.

Abstract: A printed circuit board, a memory module having the same, and a fabrication method thereof. The printed circuit board includes an interconnection substrate on which electronic components are mounted and in which a plurality of signal lines are arranged. The signal lines are electrically coupled to the electronic components. A heat sink is disposed on one surface of the interconnection substrate to dissipate heat of the electronic components, and in which no signal lines are arranged. The printed circuit board includes a bending substrate coupling the interconnection substrate to the heat sink, and formed of a flexible material configured to be bent.

Abstract: There is provided a film having use of impact absorption capable of protecting a panel from impacts when the impacts are given to a display device, a window since it has an excellent ability to absorb impacts given to a surface of a display device, a window, or equivalent base plates. The impact absorption layer having a thickness of 30 ?m or more has a hardness of 20 to 100 as measured at a room temperature using an Asker C hardness tester. Also, the film having use of impact absorption has excellent impact resistance and includes at least one layer, wherein the film includes at least one impact absorption layer having a hardness of 20 to 100 as measured at a room temperature using an Asker C hardness tester, the impact absorption layer having the total thickness of 30 ?m or more.

Abstract: A semiconductor memory module having a reverse mounted chip resistor, and a method of fabricating the same are provided. By reverse mounting the chip resistor on the semiconductor memory module, the resistive material is protected, thereby preventing open circuits caused by damage to the resistive material. Also, a chip-resistor connection pad of a module substrate is formed to extend higher from the module substrate than other connection pads connected to other elements. Thus, the resistive material of the chip resistor does not contact the module substrate, thereby preventing poor alignment and defective connections.

Abstract: The present invention provides a method for preparing a conductive pattern, comprising a pattern forming step of forming a conductive pattern on a substrate; and a blackening processing step of blackening the surface of the conductive pattern by immersing the conductive pattern in an aqueous solution containing reducing metal ions to oxidize the surface of the conductive pattern, and a conductive pattern prepared therefrom.

Abstract: Provided may be a semiconductor resistance element including resistance patterns disposed on an insulating substrate. The substrate may have first and second planer surfaces disposed in a first direction, third and fourth planar surfaces at least between the first and second planar surfaces in a second direction and fifth and sixth planar surfaces at least between the first and second planar surfaces in a third direction. The semiconductor resistance element may include a first resistance pattern configured to cover a selected one of the first and second planar surfaces and a second resistance pattern on at least one of the third through sixth planar surfaces.

Abstract: Disclosed herein is a PDP filter having a laminated structure of a transparent conductive film type electromagnetic wave-shielding layer and one or more other functional layers, in which at least two edge portions of the surface of the transparent conductive film type electromagnetic wave-shielding layer, which is in contact with the functional layer, are not exposed outside the laminated structure of the PDP filter.

Abstract: A semiconductor package module including a self-assembled organic molecule layer and a method of manufacturing the semiconductor package module is provided. The semiconductor package module may include a module printed circuit board (PCB) having a plurality of metal line patterns and a plurality of mounting pads formed thereon. The semiconductor package may further include an insulation thin film self-assembled on at least one metal line pattern selected from among the plurality of metal line patterns. In order to manufacture the semiconductor package module, the insulation thin film is formed in a manner that the plurality of metal line patterns are formed on the module PCB wherein a plurality of via holes are formed, and then an organic compound is self-assembled on a surface of at least one metal line pattern selected from the plurality of metal line patterns.