Abstract: A semiconductor memory module having a reverse mounted chip resistor, and a method of fabricating the same are provided. By reverse mounting the chip resistor on the semiconductor memory module, the resistive material is protected, thereby preventing open circuits caused by damage to the resistive material. Also, a chip-resistor connection pad of a module substrate is formed to extend higher from the module substrate than other connection pads connected to other elements. Thus, the resistive material of the chip resistor does not contact the module substrate, thereby preventing poor alignment and defective connections.

Abstract: Provided is a method of controlling an image reproducing apparatus. The method includes: determining whether a rebooting condition is satisfied, when an operation end signal is received; and selectively performing a rebooting operation based on a result of the determining.

Abstract: An image reproducing apparatus and method of controlling the image reproducing apparatus are provided. The method of controlling the image reproducing apparatus includes: determining whether external power is supplied; performing a first booting operation when the external power is supplied; and controlling the image reproducing apparatus to operate in a sleep mode if an operation start signal is not received until the booting operation is completed. The method further includes controlling the image reproducing apparatus to perform a second booting operation to operate in a normal mode after an operation start signal is received. The method further includes performing a resuming operation so that the image reproducing apparatus operates in a normal mode when the operation start signal is received while the image reproducing apparatus operates in the sleep mode. The method further includes operating in an end mode when the sleep mode continues for a predetermined time or longer.

Abstract: A power train of an automatic transmission realizes nine forward speeds and two reverse speeds. An output unit selectively receives reduced rotation speed from a speed reduction unit or selectively receives rotation speed of an input shaft and generates the nine forward speeds and two reverse speeds by operation of five clutches and three brakes.

Abstract: A power train of an automatic transmission that realizes eight forward speeds and two reverse speeds by using two or three planetary gear sets, five clutches, and one brake, wherein a speed reduction unit generates a reduced rotational speed and an output unit receives a rotational speed of an input shaft and the reduced rotational speed and generates the eight forward speeds and the two reverse speeds.

Abstract: A power train of an automatic transmission includes an input shaft connected to a torque converter; an output gear; a transmission case; a first planetary gear set including a first operating member fixedly connected to the input shaft, a second operating member fixedly connected to the transmission case, and a third operating member; a second planetary gear set including a fourth operating member selectively connected to the third operating member, a fifth operating member selectively connected to the input shaft, second or third operating members, a sixth operating member selectively connected to the input shaft or transmission case, a seventh operating member selectively connected to the transmission case, and an eighth operating member acting as an output element, wherein the second planetary gear set outputs ten forward speeds and two reverse speeds; and a plurality of friction members selectively connecting the operating members, input shaft, or transmission case.

Abstract: A temperature control system for semiconductor manufacturing equipment is disclosed, which can properly cool a process chamber adopted in the semiconductor manufacturing equipment such as a wafer etching device. The temperature control system for semiconductor manufacturing equipment includes a thermocline for cooling heat transfer fluid accommodated therein through a heat exchange with a heat exchanger and storing heat energy, a supply line for controlling the temperature of the heat transfer fluid in the thermocline through a heater and supplying the heat transfer fluid with a proper temperature to a process device, a recovery line for forwarding the heat transfer fluid having passed through the process device to the thermocline, and a bypass for forwarding a part of the heat transfer fluid passing through the recovery line to the supply line through the heater.

Abstract: A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.

Abstract: Disclosed is a method for making a film assembly used in a PDP filter positioned on the front surface of a PDP, a film assembly manufactured by the method, and a PDP filter using the film assembly. The method includes providing a roll of an EMI film formed on a surface of a long transparent polymer resin film with a predetermined spacing and mounting the wound roll of the EMI film on a first feed roller; providing a roll of at least one long transparent functional film capable of covering at least partially the effective screen portions of the EMI film and mounting the wound roll of the functional film on a second feed roller which is spaced a predetermined distance from the first feed roller; and integrating the EMI film with the functional film by feeding them into a gap between the first and second compression rollers.

Abstract: There is provided a filter of a display device capable of ensure a contrast ratio equal to or more than a predetermined value in various viewing angles. The filter of a display device includes a transparent film; and a plurality of stripe patterns formed parallel to both surfaces of the transparent film, wherein a width (a) of the stripe patterns and a thickness (t) of the transparent film are adjusted to a critical angle (?c) of 20 to 50°.

Abstract: The present invention provides an electromagnetic wave-shielding film which includes a transparent substrate, an electromagnetic wave-shielding layer which includes a conductive pattern formed in at least a portion of the transparent substrate, and an adhesive transparency layer which is formed on the electromagnetic wave-shielding layer to fill a groove of the conductive pattern and contains a near infrared-absorbing dye, and an optical filter and a plasma display panel including the electromagnetic wave-shielding film.

Abstract: A method of efficiently manufacturing a film having micro-patterns and an optical film manufactured using the same are used for various optical purposes. The method includes forming a first micro-pattern on one face of the film, and forming a second micro-pattern, which has a geometry equal to that of the first micro-pattern, on the other face of the film by a photo-lithography method using the first micro-pattern formed on one face of the film as a photomask.

Abstract: There is provided a film having use of impact absorption capable of protecting a panel from impacts when the impacts are given to a display device, a window since it has an excellent ability to absorb impacts given to a surface of a display device, a window, or equivalent base plates. The impact absorption layer having a thickness of 30 or more has a hardness of 20 to 100 as measured at a room temperature using an Asker C hardness tester. Also, the film having use of impact absorption has excellent impact resistance and includes at least one layer, wherein the film includes at least one impact absorption layer having a hardness of 20 to 100 as measured at a room temperature using an Asker C hardness tester, the impact absorption layer having the total thickness of 30 or more.

Abstract: Disclosed are a light guide plate for a non-contact type coordinate input system, a system including the same, and a non-contact type coordinate input method using the same. More particularly, the present invention relates to a light guide plate for a non-contact type coordinate input system, which eliminates inconvenience of a conventional contact-type coordinate input system inputting coordinates through direct contact, and which can reduce use of sensors and optical loss as much as possible. The present invention also relates to a system including the same, and a non-contact type coordinate input method using the same.

Abstract: A location information providing apparatus to provide a location thereof, the location information providing apparatus including: a storage unit to store location information regarding the location of the location information providing apparatus; and a transmitter to transmit the location information. Therefore, precise location information can be provided. In addition, a location-based service can be performed in a simple way because there is no need to consider a handoff depending on a movement of a location-based service supporting apparatus, and a service area can be expanded abroad because a wired network is not required. Also, various opportunities using the location-based service can be realized.

Abstract: Disclosed herein is a PDP filter having a laminated structure of a transparent conductive film type electromagnetic wave-shielding layer and one or more other functional layers, in which at least two edge portions of the surface of the transparent conductive film type electromagnetic wave-shielding layer, which is in contact with the functional layer, are not exposed outside the laminated structure of the PDP filter.

Abstract: Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.

Abstract: A method and system for sharing information between users while reproducing media in a media reproducing system, the method including: reproducing the media in the media reproducing system; capturing a part of the media in the media reproducing system; and registering a media related question including the captured part of the media in an information sharing server through a return channel of the media reproducing system. Accordingly, the users can share information in real time by generating the media related question by directly capturing the media in the media reproducing system, registering the media related question in the information sharing server, and displaying on the media reproducing system of another user that such media related question is registered. Also, since a question can be directly registered while reproducing the media, information can be conveniently shared without interrupting the media reproduction.

Abstract: A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.

Abstract: A power train of an automatic transmission realizes nine forward speeds and two reverse speeds. In the power train of this invention, an output unit selectively receives reduced rotation speed from a speed reduction unit or selectively receives rotation speed of an input shaft and generates the nine forward speeds and two reverse speeds by operation of five clutches and three brakes.