Patents by Inventor Hyung-Jin Lee

Hyung-Jin Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10637822
    Abstract: A method and device for managing an identifier of an embedded universal integrated circuit card (eUICC) is disclosed. The eUICC receives an identifier information request, determines whether there is a network carrier profile in an enabled state, and provides a response with identifier information corresponding to the identifier information request based on the results of the determination. According to the method, it is possible to separately manage the unique identifier of the eUICC and a network carrier ICCID and to dynamically manage the identifier of the eUICC according to the state of the network carrier profile of the eUICC.
    Type: Grant
    Filed: September 12, 2013
    Date of Patent: April 28, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myoung Hee Seo, Kwan Lae Kim, Chul Hyun Park, Jin Hyoung Lee, Hyung Jin Lee, Youn Pil Jeong
  • Patent number: 10623106
    Abstract: Embodiments herein may relate to an interconnect that includes a transceiver, where the transceiver is configured to receive a data stream, convert the data stream to a quadrature amplitude modulation (QAM) mapping/shaping signal, where the QAM mapping/shaping signal is a frequency component of the data stream, convert the QAM mapping/shaping signal to a Hilbert transform signal, where the Hilbert transform signal includes a reverse order of an in-phase component of the QAM mapping/shaping signal and a reverse order of a quadrature component of the QAM mapping/shaping signal, convert the Hilbert transform signal to a QAM mapping/shaping signal, where the QAM mapping/shaping signal is a single sideband (SSB) time domain mm wave signal, where the SSB time domain mm wave signal is the Hilbert transform signal converted to a time domain signal, and communicate the SSB time domain mm wave signal over a waveguide using a waveguide interconnect.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: April 14, 2020
    Assignee: Intel Corporation
    Inventors: Hyung-Jin Lee, Cho-ying Lu, Henning Braunisch, Telesphor Kamgaing, Georgios Dogiamis, Richard Dischler
  • Publication number: 20200105747
    Abstract: An integrated circuit structure comprises one or more fins extending above a surface of a substrate over an N-type well. A gate is over and in contact with the one or more fins. A second shallow N-type doping is below the gate and above the N-type well.
    Type: Application
    Filed: September 28, 2018
    Publication date: April 2, 2020
    Inventors: Hyung-Jin LEE, Mark ARMSTRONG, Saurabh MORARKA, Carlos NIEVA-LOZANO, Ayan KAR
  • Publication number: 20200091887
    Abstract: A band pass filter includes: a first circuit unit including a first series LC resonant circuit disposed between a first terminal and a second terminal; a second circuit unit disposed between the first circuit unit and the second terminal, and including a first parallel LC resonant circuit; and a third circuit unit disposed between the first terminal and a ground, and including a second series LC resonant circuit, wherein a resonant frequency of the first circuit unit is in a pass band.
    Type: Application
    Filed: February 15, 2019
    Publication date: March 19, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyung Jin LEE, Seong Jong CHEON, Jeong Hae KIM
  • Patent number: 10462667
    Abstract: A method for providing mobile communication provider information and a device for performing the same are disclosed. A terminal having an eUICC receives data, in which mobile communication provider information is capsulized and included, and stores the received data in the eUICC. Therefore, the mobile communication provider information can be transferred by applying the highest security scheme, and duplication of the eUICC due to the exposure of an authentication key by external hacking attacks can be prevented.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: October 29, 2019
    Assignee: KT Corporation
    Inventors: Hyung Jin Lee, Kwan Lae Kim, Joo Young Kim, Chul Hyun Park, Jin Hyoung Lee, Youn Pil Jeung
  • Publication number: 20190326883
    Abstract: A high pass filter includes: a first resonant circuit including an inductor and a capacitor in parallel between first and second terminals; a second resonant circuit including an inductor and a capacitor in series between a first end of the first resonant circuit and a ground; a third resonant circuit including an inductor and a capacitor in series between a second end of the first resonant circuit and the ground; a fourth resonant circuit disposed between the first end of the first resonant circuit and the first terminal, and including a first acoustic resonator; and a fifth resonant circuit disposed between the second end of the first resonant circuit and the second terminal, and including a second acoustic resonator. Attenuation regions respectively formed by the first, second, and third resonant circuits are arranged in lower frequency regions than attenuation regions respectively formed by the fourth and fifth resonant circuits.
    Type: Application
    Filed: November 5, 2018
    Publication date: October 24, 2019
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong Hae KIM, Seong Jong CHEON, Hyung Jin LEE
  • Publication number: 20190306942
    Abstract: A lighting apparatus including an LED circuit including a plurality of serially connected stages configured to receive a modulated rectified voltage, each of the stages including a first path including a first resistor and a first LED connected in series, and a second path connected to the first path in parallel and including a second LED configured to emit light having a color temperature different from that emitted from the first LED, and a driving current controller configured to adjust an intensity of light output from the LED circuit by adjusting currents applied to driving nodes connected to the stages, depending on a dimming signal associated with a dimming level of the rectified voltage, in which a threshold voltage of the first LED is lower than that of the second LED.
    Type: Application
    Filed: March 29, 2019
    Publication date: October 3, 2019
    Inventors: Keith HOPWOOD, Hyung Jin LEE, Sung Ho JIN, Sang Wook HAN, In Seok BAEK
  • Patent number: 10394063
    Abstract: A display apparatus, particularly a display apparatus having a supporter member to improve the cooling efficiency, is provided. The display apparatus includes a display panel configured to display an image; a light source configured to emit a light to the display panel; a bottom chassis in which the light source is installed; and a supporter member configured to support the display panel, wherein the supporter member includes a cooling flow path configured to allow an air to flow to the inside of the supporter member.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: August 27, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jeong Shan Na, Yong-Hun Kwon, Jong Bin Kim, Hyung Jin Lee
  • Patent number: 10367518
    Abstract: An apparatus is provided which comprises: a thermal sensor comprising one or more n-type devices or p-type devices that suffer from subthreshold factor variation, wherein the thermal sensor is to generate an output digital code representing a temperature; and a calibration circuitry coupled to the thermal sensor, wherein the calibration circuitry is to trim the effects of subthreshold factor variation from the output digital code.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: July 30, 2019
    Assignee: Intel Corporation
    Inventors: Cho-Ying Lu, Hyung-Jin Lee
  • Patent number: 10342080
    Abstract: A light-emitting diode (LED) lighting apparatus including at least one LED group including a plurality of LEDs, a rectifier configured to rectify an alternating current (AC) voltage and generate a driving voltage for the at least one LED group, and a system-in-package (SIP) configured to drive and control the at least one LED group, in which the SIP is connected to the at least one LED group and the rectifier, and includes a driving module, a functional module, and a first resistor disposed on a single substrate.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: July 2, 2019
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Sung Ho Jin, Sang Wook Han, Hyung Jin Lee
  • Patent number: 10341869
    Abstract: An embedded universal integrated circuit card (eUICC) configured to control and enforce policy rules includes a policy rule storage configured to define actions and conditions required to enforce a plurality of policies and store a plurality of policy rules; a policy controller configured to control the plurality of policy rules; and a policy enforcer configured to enforce the plurality of policy rules. The policy is a principle reflecting rules for controlling the eUICC and an external entity remotely managing the eUICC. The plurality of policy rules includes a first type of policy rules and a second type of policy rules, the first type of policy rules and the second type of policy rules being managed in physically different places.
    Type: Grant
    Filed: May 2, 2017
    Date of Patent: July 2, 2019
    Assignee: KT CORPORATION
    Inventors: Hyung Jin Lee, Youn Pil Jeung, Sung Chul Kim
  • Patent number: 10334443
    Abstract: A method for configuring a profile of a subscriber authenticating module embedded and installed in a terminal device, and an apparatus using same, are disclosed. The subscriber authenticating module embedded and installed in the terminal device according to an exemplary embodiment includes one or more network access application related data sets and one or more profiles having unique identifiers. The present invention enables an eco-system provider such as a network service provider, a eUICC manufacturer, or a terminal manufacturer to develop an efficient and rapid eUICC and provide a eUICC service.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: June 25, 2019
    Assignee: KT Corporation
    Inventors: Myoung Hee Seo, Kwan Lae Kim, Chul Hyun Park, Jin Hyoung Lee, Hyung Jin Lee, Youn Pil Jeung
  • Publication number: 20190144332
    Abstract: According to an embodiment, a cover glass includes a glass plate forming at least a portion of an electronic device, and a first coat layer deposited on a surface of the glass plate, the first coat layer at least partially including a network structure. The first coat layer includes silicon (Si), oxygen (O), and at least one impurity, and such that Si—O bonds are 80% or more by weight of the first coat layer. A polysilazane-applied coat is laid over one surface of the reinforced glass plate, providing an elegant haze glass cover.
    Type: Application
    Filed: October 26, 2018
    Publication date: May 16, 2019
    Inventors: Wook-Tae KIM, In-Gi KIM, Ji-Won LEE, Chang-Soo LEE, Hyung-Jin LEE, Gyu-Ha JO, Yong-Hyun CHO
  • Publication number: 20190149243
    Abstract: Embodiments herein may relate to an interconnect that includes a transceiver, where the transceiver is configured to receive a data stream, convert the data stream to a quadrature amplitude modulation (QAM) mapping/shaping signal, where the QAM mapping/shaping signal is a frequency component of the data stream, convert the QAM mapping/shaping signal to a Hilbert transform signal, where the Hilbert transform signal includes a reverse order of an in-phase component of the QAM mapping/shaping signal and a reverse order of a quadrature component of the QAM mapping/shaping signal, convert the Hilbert transform signal to a QAM mapping/shaping signal, where the QAM mapping/shaping signal is a single sideband (SSB) time domain mm wave signal, where the SSB time domain mm wave signal is the Hilbert transform signal converted to a time domain signal, and communicate the SSB time domain mm wave signal over a waveguide using a waveguide interconnect.
    Type: Application
    Filed: December 18, 2018
    Publication date: May 16, 2019
    Applicant: Intel Corporation
    Inventors: Hyung-Jin Lee, Cho-ying Lu, Henning Braunisch, Telesphor Kamgaing, Georgios Dogiamis, Richard Dischler
  • Publication number: 20190147577
    Abstract: In a device for detecting a defect, the device includes: an image pickup unit including pixels, the image pickup unit generating a substrate image by picking up an image of a substrate having patterns formed on a top surface thereof; and a controller for detecting a defect located on the substrate, based on the substrate image, wherein the substrate image includes pattern images corresponding to the patterns, wherein each of the pattern images includes pixel values, wherein the controller detects the defect by comparing weights of pixel values for each of the pattern images.
    Type: Application
    Filed: September 19, 2018
    Publication date: May 16, 2019
    Inventors: Hyung Jin Lee, Dae Hong Kim, Sung Hoon Yang, Se Yoon Oh
  • Publication number: 20190115951
    Abstract: Embodiments herein may relate to an interconnect that includes a transceiver, wherein the transceiver is configured to generate a single side band (SSB) signal for communication over a waveguide and a waveguide interconnect to communicate the SSB signal over the waveguide. In an example, an SSB operator is configured to generate the SSB signal and the SSB signal can be generated by use of a finite-impulse response filter. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: November 30, 2018
    Publication date: April 18, 2019
    Applicant: Intel Corporation
    Inventors: Henning Braunisch, Georgios Dogiamis, Jeff C. Morriss, Hyung-Jin Lee, Richard Dischler, Ajay Balankutty, Telesphor Kamgaing, Said Rami
  • Publication number: 20190097293
    Abstract: There is disclosed in one example an electromagnetic wave launcher apparatus, including: an interface to an electromagnetic waveguide; a first launcher configured to launch a high-frequency electromagnetic signal onto a first cross-sectional portion of the waveguide; and a second launcher configured to launch a lower-frequency electromagnetic signal onto a second cross-sectional portion of the waveguide.
    Type: Application
    Filed: November 9, 2018
    Publication date: March 28, 2019
    Applicant: Intel Corporation
    Inventors: Georgios Dogiamis, Adel A. Elsherbini, Henning Braunisch, Gilbert W. Dewey, Telesphor Kamgaing, Hyung-Jin Lee, Johanna M. Swan
  • Patent number: 10244596
    Abstract: Disclosed are a light emitting diode (LED) driver circuit having improved flicker performance and an alternating current-driving type LED lighting device including the same. The LED driver circuit can remove an LED off period using a charging and discharging circuit during a compensation period so as to reduce light output deviation of an LED lighting device, and provide a driving voltage to another element of the LED lighting device, using the charging and discharging circuit during an additional discharging period so as to simultaneously improve power efficiency.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: March 26, 2019
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Sung Ho Jin, Sang Wook Han, Young Do Jung, Hyung Jin Lee
  • Publication number: 20190089036
    Abstract: Embodiments may relate to a dielectric waveguide that includes a substrate and a waveguide material disposed within the substrate. The dielectric waveguide may further include a waveguide launcher electromagnetically and physically coupled with the waveguide material, wherein the waveguide launcher is exposed at a side of the dielectric substrate. Other embodiments may be described or claimed.
    Type: Application
    Filed: November 15, 2018
    Publication date: March 21, 2019
    Applicant: Intel Corporation
    Inventors: Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov, Gilbert W. Dewey, Hyung-Jin Lee
  • Publication number: 20190089409
    Abstract: Embodiments may relate to a transceiver chip. The transceiver chip may include a substrate that has a first transceiver component and a second transceiver component positioned therein. The transceiver chip may further include a well material that is positioned between the first transceiver component and the second transceiver component. The well material may mitigate cross-talk between the first transceiver component and the second transceiver component. Other embodiments may be described or claimed.
    Type: Application
    Filed: November 20, 2018
    Publication date: March 21, 2019
    Applicant: Intel Corporation
    Inventors: Telesphor Kamgaing, Georgios Dogiamis, Henning Braunisch, Hyung-Jin Lee, Richard Dischler