Abstract: A power-switching circuit includes an interface, a voltage regulator, a voltage detector and a power switch. The interface is for coupling a peripheral device. The voltage regulator provides constant-power output at an output end. An input end of the voltage detector is coupled to the output end of the voltage regulator for generating trigger signals based on voltages established at the output end of the voltage regulator. An input end of the power switch is coupled to the output end of the voltage regulator. A trigger end of the power switch is coupled to the output end of the voltage detector for receiving trigger signals generated by the voltage detector. An output end of the power switch is coupled to the interface for providing output voltages to the interface based on signals received at the input and trigger ends of the power switch.

Abstract: A card-reading device with port and protection mechanism including an upper lid pivoted to one side of the device to close upon its top and a latch is provided to the free end of the upper lid; and the latch being engaged with the side edge of the device when the upper lid closing upon its top to secure the upper lid to the top of the card-reading device to fend off ingression of foreign matters including water containment and dust while prevent a memory card plugged to the card-reading device from getting lost.

Abstract: A USB drive mass storage device has a housing provided at an end with, for example, a USB connector, and at the other end with at least one card slot for different types of memory cards, such as SD, mini SD, MMC cards, etc. At least one side of the housing is provided with a receiving space openably closed with a cover for holding memory cards not in use. When a memory card is currently not in use, it may be conveniently positioned in the receiving space on the housing of the USB drive mass storage device without the risk of being carelessly lost or discarded.

Abstract: A Bluetooth telecommunication headphone with detachable battery module comprises a wireless headphone of Bluetooth telecommunication module and battery module; wherein, the wireless headphone contains a casing and the electronic elements necessitated to Bluetooth communication module while the casing has been mounted a recessed slot for battery box with power supply contacts fitted in the recessed slot for battery box and a power supply jack for external power connection at designated locations; the battery module has a battery box mated with the slot-recessed battery box to receive lithium battery and a power supply contact fitted at selected location to be externally powered so that the said battery module can be embedded into the foregoing recessed slot of battery box and combined with the casing to integrally form the Bluetooth telecommunication headphone with the electrically charging effect achieved by its battery module alone or by its externally connected power supply jack.

Abstract: A communication assembly includes a body having a socket and a circular projection formed around the socket, and an ear set having a terminal formed on a first distal end of the ear set to correspond to the socket, an arcuate cap formed around the terminal to be inserted into the circular projection, a microphone formed on a second distal end of the ear set and an earphone rotatably mounted on the ear set.

Abstract: A sealed memory IC chip is confined within a case with a digital signal processor, a digital-analog converter, and an amplifier, together capable of producing audible sound from the digitally recorded sound on the sealed memory IC chip. The sound is transmitted to a headphone jack and to a headphone. The case is shaped and has the image of the recording artist whose music or other sound data is stored on the chip.

Abstract: An optical disk includes a disk body and a cap body. The disk body has a first surface adapted to be printed thereon, and a second surface opposite to the first surface and adapted to store optical data. The first surface is formed with a central cap-receiving recess that extends downwardly and that has an inner annular surface and a recess bottom. The second surface is formed with a shaft-receiving recess that extends upwardly and that is communicated with the cap-receiving recess. The cap-receiving recess has an area larger than that of the shaft-receiving recess. The cap body is received in the cap-receiving recess, and has a top side adapted to be printed thereon, and a peripheral portion on the recess bottom. The cap body is movable from a normal position, where the top side of the cap body is flush with the first surface of the disk body, to a position of use, where the cap body protrudes relative to the first surface of the disk body.

Abstract: The present invention provides a small-scaled portable electrical power generator comprising a base, which includes an assembly surface, a fuel chamber, and at least one fuel delivery channels connected to the fuel chamber and placed under the assembly surface; a power generation means which includes at least one solar battery packs placed on the assembly surface of the base, a solar battery pack contains two opposing solar batteries which face each other with their light-collecting surfaces and their power outputs being connected; a light generation means placed on the assembly surface of the base, which includes at least one hollow tube that is placed in-between the solar batteries of the solar battery packs and includes at least one hollow tube capable of capillarity that is connected to the at least one fuel delivery channels so that fuel can always be filled into them; and an igniting means which includes at least one operative igniters placed nearby the at least one hollow tubes, and can be manipulated

Abstract: A method for manufacturing a semiconductor device includes the steps of forming a first conductive bump on a substrate, forming a second conductive bump on a semiconductor chip, forming a plurality of spaced apart dielectric supporting pads on one of the substrate and the semiconductor chip, mounting the semiconductor chip on the substrate to confine therebetween a gap, bonding together the first and second conductive bumps, and forming an insulating layer that fills in the gap and that encapsulates the supporting pads and the first and second conductive bumps.

Abstract: A method for manufacturing a semiconductor device includes the steps of providing a semiconductor chip having a pad-mounting surface with a bonding pad, forming an insulative isolating layer on the pad-mounting surface, and forming a conductive body in the insulative isolating layer. The isolating layer has a contact receiving cavity, and an access hole for access to the contact receiving cavity. The access hole is narrower than the contact receiving cavity. The conductive body has an anchor portion filling the contact receiving cavity and the access hole and connecting electrically with the bonding pad.

Abstract: A method for manufacturing a semiconductor device includes the steps of providing a semiconductor chip having a pad-mounting surface with a bonding pad, forming an inner bump on the bonding pad, and forming a conductive body on the pad-mounting surface. The conductive body has an anchor portion connecting electrically with and encapsulating the inner bump, and a contact portion offset from the anchor portion and adapted to be connected to a substrate.

Abstract: The present invention provides a small-scaled portable electrical power generator comprising a base, which includes an assembly surface, a fuel chamber, and at least one fuel delivery channels connected to the fuel chamber and placed under the assembly surface; a power generation means which includes at least one solar battery packs placed on the assembly surface of the base, a solar battery packs contains two opposing solar batteries which face each other with their light-collecting surfaces and their power outputs being connected; a light generation means placed on the assembly surface of the base, which includes at least one hollow tube that is placed in-between the solar batteries of the solar battery packs and includes at least one hollow tube capable of capillarity that is connected to the at least one fuel delivery channels so that fuel can always be filled into them; and an igniting means which includes at least one operative igniters placed nearby the at least one hollow tubes, and can be manipulated

Abstract: A method for manufacturing a semiconductor device includes the steps of forming a hardened photoresist layer on a bonding pad of a semiconductor chip, forming a conductive layer on the hardened photoresist layer to form a conductive bump on the bonding pad, forming a plurality of supporting pads on the semiconductor chip, attaching a chip-mounting substrate on the semiconductor chip such that the supporting pads interconnect the semiconductor chip and the substrate, and forming an insulating layer that fills a space between the semiconductor chip and the substrate and that encloses the conductive bump.

Abstract: A method for manufacturing a semiconductor device includes the steps of forming a first conductive bump on a substrate, forming a second conductive bump on a semiconductor chip, forming a plurality of spaced apart dielectric supporting pads on one of the substrate and the semiconductor chip, mounting the semiconductor chip on the substrate to confine therebetween a gap, bonding together the first and second conductive bumps, and forming an insulating layer that fills in the gap and that encapsulates the supporting pads and the first and second conductive bumps.

Abstract: A method for manufacturing a semiconductor device includes the steps of forming a first conductive bump on a substrate, forming a second conductive bump on a semiconductor chip, forming a plurality of spaced apart dielectric supporting pads on one of the substrate and the semiconductor chip, mounting the semiconductor chip on the substrate to confine therebetween a gap, bonding together the first and second conductive bumps, and forming an insulating layer that fills in the gap and that encapsulates the supporting pads and the first and second conductive bumps.

Abstract: A method for manufacturing a semiconductor device includes the steps of forming a hardened photoresist layer on a bonding pad of a semiconductor chip, forming a conductive layer on the hardened photoresist layer to form a conductive bump on the bonding pad, forming a plurality of supporting pads on the semiconductor chip, attaching a chip-mounting substrate on the semiconductor chip such that the supporting pads interconnect the semiconductor chip and the substrate, and forming an insulating layer that fills a space between the semiconductor chip and the substrate and that encloses the conductive bump.

Abstract: A method for manufacturing a semiconductor device includes the steps of preparing a semiconductor chip with a plurality of bonding pads and a plurality of conductive bumps on the bonding pads, preparing a substrate formed with a plurality of bump receiving holes and a plurality of conductive traces having contact portions adjacent to peripheries of the bump receiving holes, laying the substrate over the semiconductor chip such that the conductive bumps respectively extend through the bump receiving holes, and forming a plurality of conductive bodies, each of which encloses and electrically connects a top portion of a respective one of the conductive bumps to the contact portion of a respective one of the conductive traces.