Abstract: An optical disk includes a disk body and a cap body. The disk body has a first surface adapted to be printed thereon, a second surface opposite to the first surface and adapted to store optical data, and a central through hole extending from the first surface through the second surface and confined by an annular hole surface. The disk body further has a cap seat flange that extends radially and inwardly from the hole surface and that is formed with a plurality of mounting holes therethrough. The cap body includes a cap plate disposed in the through hole. The cap plate has a top side adapted to be printed thereon, a bottom side, and a peripheral portion on top of the cap seat flange. The cap body further includes a plurality of hooking arms that extend from the peripheral portion at the bottom side and that extend slidably through the mounting holes.

Abstract: A method for manufacturing a semiconductor device includes the steps of preparing a semiconductor chip with a plurality of bonding pads and a plurality of conductive bumps on the bonding pads, preparing a substrate formed with a plurality of bump receiving holes and a plurality of conductive traces having contact portions adjacent to peripheries of the bump receiving holes, laying the substrate over the semiconductor chip such that the conductive bumps respectively extend through the bump receiving holes, and forming a plurality of conductive bodies, each of which encloses and electrically connects a top portion of a respective one of the conductive bumps to the contact portion of a respective one of the conductive traces.

Abstract: A method for manufacturing a semiconductor device includes the steps of providing a semiconductor chip having a pad-mounting surface with a bonding pad, forming an insulative isolating layer on the pad-mounting surface, and forming a conductive body in the insulative isolating layer. The isolating layer has a contact receiving cavity, and an access hole for access to the contact receiving cavity. The access hole is narrower than the contact receiving cavity. The conductive body has an anchor portion filling the contact receiving cavity and the access hole and connecting electrically with the bonding pad.

Abstract: A method for manufacturing a semiconductor device includes the steps of providing a semiconductor chip having a pad-mounting surface with a bonding pad, forming a first bump on the bonding pad, forming a photoresist layer on the pad-mounting surface, forming a second bump which protrudes from the first bump through an upper surface of the photoresist layer, and forming a conductive body on the second bump. The conductive body has an anchor portion connecting electrically with and encapsulating an upper portion of the second bump, and a contact portion offset from the anchor portion and adapted to be connected to a substrate.

Abstract: A method for manufacturing a semiconductor device includes the steps of providing a semiconductor chip having a pad-mounting surface with a bonding pad, forming an inner bump on the bonding pad, and forming a conductive body on the pad-mounting surface. The conductive body has an anchor portion connecting electrically with and encapsulating the inner bump, and a contact portion offset from the anchor portion and adapted to be connected to a substrate.

Abstract: A method for manufacturing a semiconductor device includes the steps of forming a first conductive bump on a substrate, forming a second conductive bump on a semiconductor chip, forming a plurality of spaced apart dielectric supporting pads on one of the substrate and the semiconductor chip, mounting the semiconductor chip on the substrate to confine therebetween a gap, bonding together the first and second conductive bumps, and forming an insulating layer that fills in the gap and that encapsulates the supporting pads and the first and second conductive bumps.

Abstract: A method for manufacturing a semiconductor device includes the steps of providing a semiconductor chip having a pad-mounting surface with a bonding pad, forming an insulative isolating layer on the pad-mounting surface, and forming a conductive body in the insulative isolating layer. The isolating layer has a contact receiving cavity, and an access hole for access to the contact receiving cavity. The access hole is narrower than the contact receiving cavity. The conductive body has an anchor portion filling the contact receiving cavity and the access hole and connecting electrically with the bonding pad.

Abstract: A solar-powered device is adapted to be disposed on a battery unit of a mobile telephone handset so as to charge the battery unit. The solar-powered device includes a light sensor, a photoelectric converting circuit coupled operably to the light sensor so as to convert light that is sensed by the light sensor into a corresponding current signal, and a current processing circuit, coupled electrically to the photoelectric converting circuit, for receiving and processing the current signal so as to result in a charging current that is adapted to charge the battery unit of the mobile telephone handset.

Abstract: A device for charging a battery unit of a mobile telephone handset includes an electric field generating unit for generating an electric field, and a charging current generating unit adapted to be disposed on the mobile telephone handset. The charging current generating unit includes a sensing coil for sensing the electric field from the electric field generating unit and for generating a current signal corresponding to the electric field sensed thereby, and a current processing circuit, coupled electrically to the sensing coil, for receiving and processing the current signal so as to result in a charging current that is adapted to charge the battery unit of the mobile telephone handset.

Abstract: A method for manufacturing a semiconductor device includes the steps of providing a semiconductor chip having a pad-mounting surface with bonding pads, attaching a printed circuit sheet to the pad-mounting surface, forming conductive bonding wires that respectively interconnect the bonding pads and conductive traces on the printed circuit sheet, forming a photoresist layer on the printed surface and the pad-mounting surface, forming access holes in the photoresist layer to expose portions of the conductive traces that are respectively offset from the bonding pads, and forming a plurality of conductive bodies in the access holes such that each of the conductive bodies is electrically connected to a respective one of the bonding pads.

Abstract: A method for manufacturing a semiconductor device includes the steps of providing a semiconductor chip having a pad-mounting surface with a bonding pad, forming an inner bump on the bonding pad, and forming a conductive body on the pad-mounting surface. The conductive body has an anchor portion connecting electrically with and encapsulating the inner bump, and a contact portion offset from the anchor portion and adapted to be connected to a substrate.

Abstract: A method for manufacturing a semiconductor device includes the steps of providing a semiconductor chip having a pad-mounting surface with a bonding pad, forming a first bump on the bonding pad, forming a photoresist layer on the pad-mounting surface, forming a second bump which protrudes from the first bump through an upper surface of the photoresist layer, and forming a conductive body on the second bump. The conductive body has an anchor portion connecting electrically with and encapsulating an upper portion of the second bump, and a contact portion offset from the anchor portion and adapted to be connected to a substrate.

Abstract: A golf training device includes a golf club, a ball receiving socket, a light emitter, and a light beam receiver. The golf club includes a golf head with a front striking face. The golf ball receiving socket has a slot adapted to receive a golf ball that was struck by the golf head. The light emitter is mounted on the golf head and is aligned vertically with the center of the front striking face for emitting a light beam substantially parallel to a line passing through the center of the front striking face and perpendicular to the front striking face. The light beam receiver is mounted on the ball receiving socket in the vicinity of the slot for receiving the light beam and for generating a signal when the slot is in alignment with the light beam.

Abstract: An optical disk includes a disk body and a cap body. The disk body has a first surface adapted to be printed thereon, and a second surface opposite to the first surface and adapted to store optical data. The first surface is formed with a central cap-receiving recess that extends downwardly and that has an inner annular surface and a recess bottom. The second surface is formed with a shaft-receiving recess that extends upwardly and that is communicated with the cap-receiving recess. The cap-receiving recess has an area larger than that of the shaft-receiving recess. The cap body is received in the cap-receiving recess, and has a top side adapted to be printed thereon, and a peripheral portion on the recess bottom. The cap body is movable from a normal position, where the top side of the cap body is flush with the first surface of the disk body, to a position of use, where the cap body protrudes relative to the first surface of the disk body.

Abstract: An apparatus is adapted for reading optically detected information stored in a data storage medium. The data storage medium is formed as a rectangular card body, at least one surface of which is provided with a data storage track having a plurality of parallel and equally spaced apart track sections stored with the optically detected information. The apparatus includes a first moving unit, associated operably with a carrier unit that has the data storage medium loaded thereon, for moving the carrier unit back and forth between first and second limit positions along a first axis parallel to the track sections, an optical detector unit for reading the optically detected information stored in one of the track sections when the carrier unit is moved by the first moving unit, a second moving unit, for moving the optical detector unit along a second axis transverse to the first axis, and a controller unit coupled to the first and second moving units and the optical detector unit.

Abstract: A semiconductor device is adapted for mounting on a substrate that has a chip-mounting region provided with a plurality of solder points. The semiconductor device includes a semiconductor chip having a pad-mounting surface provided with a plurality of bonding pads which are disposed on the pad-mounting surface at locations that are offset from locations of corresponding ones of the solder points on the chip-mounting region. Through a transfer printing unit, conductive bodies are transferred from a conductor-forming mold to the pad-mounting surface so that the required electrical connection among the bonding pads and the corresponding ones of the solder points can be established.

Abstract: A method for manufacturing a semiconductor device includes the steps of providing a semiconductor chip having a pad-mounting surface with a bonding pad, forming an inner bump on the bonding pad, and forming a conductive body on the pad-mounting surface. The conductive body has an anchor portion connecting electrically with and encapsulating the inner bump, and a contact portion offset from the anchor portion and adapted to be connected to a substrate.

Abstract: A semiconductor device is adapted for mounting on a substrate that has a chip-mounting region provided with a plurality of solder points. The semiconductor device includes a semiconductor chip having a pad-mounting surface provided with a plurality of bonding pads which are disposed on the pad-mounting surface at locations that are offset from locations of corresponding ones of the solder points on the chip-mounting region. Conductive bodies are formed on the pad-mounting surface to establish the required electrical connection among the bonding pads and the corresponding ones of the solder points.

Abstract: A semiconductor device is adapted for mounting on a substrate that has a chip-mounting region provided with a plurality of solder points. The semiconductor device includes a semiconductor chip having a pad-mounting surface provided with a plurality of bonding pads which are disposed on the pad-mounting surface at locations that are offset from locations of corresponding ones of the solder points on the chip-mounting region. Conductive bodies are formed on the pad-mounting surface to establish the required electrical connection among the bonding pads and the corresponding ones of the solder points.

Abstract: A multi-color semiconductor lamp includes a semiconductor light source activable so as to generate a light output, a dispersing prism and a lens. The prism has an input side located in front of the light source to receive the light output, and an output side, and separates the light output of the light source into a plurality of chromatic components that radiate at different angles at the output side. The lens is disposed in front of the output side of the prism such that a vertex of a conical focusing region associated with the lens is located at the output side of the prism. The light source is activated when the spatial position of one of the light source and the prism relative to the other one of the light source and the prism has been varied such that a selected one of the chromatic components is registered with the conical focusing region of the lens. The semiconductor lamp can thus be controlled so as to generate different colored light outputs.