Patents by Inventor I-Peng Yao

I-Peng Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160136778
    Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a base layer and a polishing layer. The base layer has a first surface and a second surface. The polishing layer is disposed on the first surface of the base layer and has a plurality of second fibers, a polymeric elastomer and a plurality of pores. The second fibers are arranged irregularly and cross each other to form the pores, and the polymeric elastomer is attached to the second fibers and does not fill the pores.
    Type: Application
    Filed: June 12, 2015
    Publication date: May 19, 2016
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, CHIH-YI LIN, TAI-YUN FU, YUNG-CHANG HUNG, JHIH-GONG LIN
  • Publication number: 20160089764
    Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a base layer and a polishing layer. The base layer has a first surface and a plurality of first trenches. The first trench has an opening at the first surface. The polishing layer is located on the first surface of the base layer and fills the first trenches. The polishing layer has a plurality of second trenches, the positions of the second trenches correspond to those of the first trenches, and the depth of the second trenches is less than that of the first trenches.
    Type: Application
    Filed: July 14, 2015
    Publication date: March 31, 2016
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, YUNG-CHANG HUNG, LYANG-GUNG WANG
  • Publication number: 20160082568
    Abstract: The present invention relates to a polishing pad comprising a base sheet containing a restriction layer. The invention also relates to a polishing apparatus and a method for manufacturing a polishing pad.
    Type: Application
    Filed: September 8, 2015
    Publication date: March 24, 2016
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, YUNG-CHANG HUNG, WEI-TE LIU, CHUN-TA WANG
  • Patent number: 9193028
    Abstract: The present invention relates to a sheet for mounting a workpiece, which includes a sheet body. The sheet body includes a top surface, a plurality of foamed pores, and a plurality of surface holes or at least one surface groove. The top surface is used for mounting a workpiece. The foamed pores are disposed in the interior of the sheet body. The surface holes or the surface groove have opening on the top surface but does not communicate with the foamed pores. The surface holes or the surface groove is formed by machining, and arranged in at least one pattern. Whereby, the time for taking off the workpiece from the sheet is reduced.
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: November 24, 2015
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Wen-Chieh Wu, Wei-Te Liu
  • Publication number: 20150217501
    Abstract: The present invention relates to a ball shaped product and a method for making the same. The method includes the following steps of: (a) placing a ball shaped interior material on a supporting seat, wherein a part of an outer surface of the ball shaped interior material is exposed outside the supporting seat; (b) placing the ball shaped interior material and the supporting seat in a chamber; (c) covering a wrapping material on the chamber; (d) vacuum pumping the chamber, so that the wrapping material is attached to the exposed part of the outer surface of the ball shaped interior material; (e) releasing the vacuum of the chamber; and (f) rotating the ball shaped interior material, and repeating the step (a) to step (e) at least one time.
    Type: Application
    Filed: April 15, 2015
    Publication date: August 6, 2015
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, KO-FENG WANG, KAI-FENG KANG, CHUN-YI KUO
  • Publication number: 20150202732
    Abstract: The present invention relates to a polishing pad comprising a buffer sheet containing a pressure distribution sheet. The invention also relates to a polishing apparatus and a method for manufacturing a polishing pad.
    Type: Application
    Filed: January 15, 2015
    Publication date: July 23, 2015
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, YUNG-CHANG HUNG, WEI-TE LIU, CHUN-TA WANG
  • Patent number: 9044840
    Abstract: The present invention relates to a sheet for mounting a workpiece and a method for making the same. The method includes the steps of: (a) providing a sheet body having a top surface, a bottom surface, at least one side surface and a plurality of pores, wherein some of the pores open at the side surface; and (b) sealing or narrowing the pores that open at the side surface. Since the pores that open at the side surface are sealed or narrowed, the slurry is prevented from entering into the interior of the sheet body. Therefore, the infiltration distance reaches a predetermined value slowly, thereby increasing the effective life of the sheet.
    Type: Grant
    Filed: April 21, 2011
    Date of Patent: June 2, 2015
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Chun-Ta Wang, Hsin-Ru Song
  • Publication number: 20150099439
    Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad has a grinding layer. The grinding layer includes a plurality of fibers and a main body. The fineness of the fibers is 0.001 den to 6 den. The main body is a foam and encloses the fibers. The main body has a plurality of first pores and a plurality of second pores, wherein the first pores are communicated with each other, and the second pores are independent from each other. The size of the first pores is at least 5 times greater than the size of the second pores. The hardness of the grinding layer is 30 to 90 shore D, and the compression ratio thereof is 1% to 10%.
    Type: Application
    Filed: August 26, 2014
    Publication date: April 9, 2015
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, WEN-CHIEH WU, YUNG-CHANG HUNG
  • Publication number: 20150093979
    Abstract: The present invention relates to a composite polishing pad and a method for making the same. The composite polishing pad includes a cushion layer and a polishing layer. The cushion layer includes a first polymeric elastomer with a hardness of 10 to 70 shore D, and is attached to the polishing layer directly. The polishing layer includes a second polymeric elastomer with a hardness of 30 to 90 shore D, and has a polishing surface for polishing a workpiece. Whereby, the polishing layer will not peel off from the cushion layer easily, so that the polishing quality is raised.
    Type: Application
    Filed: September 29, 2014
    Publication date: April 2, 2015
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, WEN-CHIEH WU, YUNG-CHANG HUNG
  • Publication number: 20150050866
    Abstract: The present invention relates to a polishing pad comprising a foaming resin frame and a plurality of auxiliary fiber filaments, and each of the auxiliary fiber filaments is independent and dispersed randomly in the foaming resin frame. The invention also relates to a polishing apparatus and a method for manufacturing the polishing pad.
    Type: Application
    Filed: August 11, 2014
    Publication date: February 19, 2015
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, YUNG-CHANG HUNG, WEN-CHIEH WU
  • Publication number: 20150047266
    Abstract: The present invention relates to a method for manufacturing a polishing pad. The method of the invention includes the steps of (a) providing a releasing carrier; (b) providing a foaming resin composition; (c) coating the foaming resin composition of the step (b) on the carrier of the step (a); and (d) curing the foaming resin composition of the step (c). The invention also provides a process for manufacturing a polishing apparatus.
    Type: Application
    Filed: August 8, 2014
    Publication date: February 19, 2015
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, YUNG-CHANG HUNG, WEN-CHIEH WU
  • Patent number: 8765259
    Abstract: The present invention relates to a carrier film for mounting a polishing workpiece. The carrier film comprises a surface substrate and a buffer substrate. The surface substrate consists of first elastomer, the first elastomer comprising a plurality of first holes; wherein the first holes have a drop shape, and each of the first holes has an opening. The buffer substrate consists of second elastomer, the second elastomer comprising a plurality of second holes. The surface substrate and the buffer substrate are adhered with adhesive comprising the first or the second elastomer. A method for making the carrier film is also provided. When polishing, the carrier film provides a good buffer property to conduct and release down force applied on the polishing workpiece.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: July 1, 2014
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung
  • Patent number: 8747587
    Abstract: A multi-layered material and a method for making the same are provided. The multi-layered material includes a first foamed layer, a substrate, a second foamed layer, and a surface layer. The first foamed layer has a plurality of first cells. The substrate is a fabric. The second foamed layer has a plurality of second cells. The foaming method of the second foamed layer is different from that of the first foamed layer. The size of the second cells is different from that of the first cells. The variation in size of the second cells is different from that of the first cells. The surface layer is disposed on the second foamed layer. Thus, when the multi-layered material is used as a surface cover of a ball, it can provide excellent resilience and control, and improve manufacturing efficiency.
    Type: Grant
    Filed: April 6, 2011
    Date of Patent: June 10, 2014
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, Yung-Yu Fu, Kun-Lin Chiang, Jung-Ching Chang, Chih-Chenh Lin, Chun-Wei Wu, Pei-Huo Huang, I-Peng Yao
  • Publication number: 20140147635
    Abstract: A composite coating material for covering an electronic device includes a surface layer with a surface pattern printed by a release paper, said surface layer being an outer layer of said composite coating material; structure layer made of polyurethane (PU) material, said structure layer being a middle portion of said composite coating material, and connected to said surface layer; substrate layer made of polyurethane (PU) material, said substrate layer being a lower layer of said composite coating material and connected to said structure layer.
    Type: Application
    Filed: November 29, 2012
    Publication date: May 29, 2014
    Inventors: Chung-Ching Feng, I-Peng Yao, Pei-Huo Huang, Ko-Feng Wang, Yong-Song Lin, Kai-Feng Kang
  • Publication number: 20140110058
    Abstract: The present invention relates to a polishing pad comprising a polishing surface. The polishing surface comprises a first polishing area and a second polishing area. The first polishing area comprises a plurality of first foaming holes, and the second polishing area comprises a plurality of second foaming holes, and an average pore diameter of the first foaming holes is less than an average pore diameter of the second foaming holes. The polishing pad according to the present invention uses the polishing areas with the different pore diameters of the holes to avoid unevenly removing the edge and central part of a substrate when polishing, so that a thickness of the substrate becomes uniform.
    Type: Application
    Filed: October 17, 2013
    Publication date: April 24, 2014
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, YUNG-CHANG HUNG, KUN-CHENG TSAI
  • Publication number: 20140090774
    Abstract: The present invention relates to a mounting sheet comprising a mounting layer. The mounting layer comprises a mounting surface for mounting the substrate. The mounting surface comprises a first mounting area and a second mounting area, and wherein a mounting force of the first mounting area is stronger than a mounting force of the second mounting area. The sheet according to the invention has the different mounting areas, so that the substrate is easily unloaded when polishing is completed. Furthermore, the broken of the substrate due to removal and the duration and the difficulty of removal are reduced.
    Type: Application
    Filed: October 3, 2013
    Publication date: April 3, 2014
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, LYANG-GUNG WANG, HSIN-RU SONG, WEN-CHIEH WU
  • Patent number: 8585941
    Abstract: The present invention relates to a structure with luminous and visual effects, a light transmissive sheet thereof, and a method for making the same. The light transmissive sheet includes a first layer, a light transmissive intermediate layer and a second layer. The material of the first layer, the light transmissive intermediate layer and the second layer is polyurethane resin. The light transmissive intermediate layer is disposed on the first layer, and the second layer is disposed on the light transmissive intermediate layer. At least one pattern is formed on the first layer or the second layer, and the pattern penetrates the first layer or the second layer. When light irradiates the light transmissive sheet, the pattern is shown, so the light transmissive sheet has luminous and visual effects.
    Type: Grant
    Filed: December 8, 2010
    Date of Patent: November 19, 2013
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, Chun-Yi Kuo, Kai-Feng Kang, Ko-Feng Wang, I-Peng Yao
  • Patent number: 8491359
    Abstract: The present invention relates to a polishing pad that comprises a polishing sheet for polishing a substrate, a buffer sheet comprising a plurality of holes, and adhesive for adhering the buffer sheet to the polishing sheet; wherein the adhesive is formed by polymerizing macromolecules with fluidity. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: July 23, 2013
    Assignee: Bestac Advanced Material Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Lyang-Gung Wang, Wen-Chieh Wu
  • Patent number: 8485869
    Abstract: The present invention relates to a polishing material having polishing particles and a method for making the same. The polishing material having polishing particles includes a base material, a plurality of polishing particles and a polymer elastic body. The base material has a plurality of fibers for defining a plurality of grid-spaces. The polishing particles are distributed in the grid-spaces. The polymer elastic body covers the base material and the polishing particles. Whereby, the polishing particles are uniformly distributed on a surface of a polishing workpiece during the polishing process. Furthermore, the base material prevents the polishing particles from contacting the polishing workpiece so as to avoid the scratch of the polishing workpiece. Also, the base material provides effects for sweeping the small grinded pieces.
    Type: Grant
    Filed: September 24, 2010
    Date of Patent: July 16, 2013
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung, Chao-Yuan Tsai
  • Patent number: 8414669
    Abstract: The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a first membrane with low permeability; a two-component paste formed on the upper surface of the first membrane with low permeability for adhering the base material to the first membrane with low permeability; and a polyurethane paste formed on the lower surface of the first membrane with low permeability. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. The polishing pad as mentioned above prevents the polishing pad from detaching from the polishing platen or head. The polishing pad is easy to be replaced without leaving residues on the polishing platen or head.
    Type: Grant
    Filed: September 16, 2010
    Date of Patent: April 9, 2013
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung