Patents by Inventor I-Peng Yao

I-Peng Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110000141
    Abstract: The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a first membrane with low permeability; a two-component paste formed on the upper surface of the first membrane with low permeability for adhering the base material to the first membrane with low permeability; and a polyurethane paste formed on the lower surface of the first membrane with low permeability. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. The polishing pad as mentioned above prevents the polishing pad from detaching from the polishing platen or head. The polishing pad is easy to be replaced without leaving residues on the polishing platen or head.
    Type: Application
    Filed: September 16, 2010
    Publication date: January 6, 2011
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung
  • Publication number: 20110003536
    Abstract: The present invention mainly relates to a polishing pad and method of producing the same. The polishing pad comprises a base material having a surface for polishing a substrate, wherein the surface comprises a non-woven fabric and an elastomer. The elastomer is embedded into the fabric, and the non-woven fabric comprises a plurality of first long fibers randomly entangled with each other.
    Type: Application
    Filed: September 16, 2010
    Publication date: January 6, 2011
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao, Yung-Chang Hung
  • Patent number: 7824249
    Abstract: The present invention relates to a polishing material having polishing particles and a method for making the same. The polishing material having polishing particles includes a base material, a plurality of polishing particles and a polymer elastic body. The base material has a plurality of fibers for defining a plurality of grid-spaces. The polishing particles are distributed in the grid-spaces. The polymer elastic body covers the base material and the polishing particles, whereby, the polishing particles are uniformly distributed on a surface of a polishing workpiece during the polishing process. Furthermore, the base material prevents the polishing particles from contacting the polishing workpiece so as to avoid scratching of the polishing workpiece. Also, the base material provides effects for sweeping the small grinded pieces.
    Type: Grant
    Filed: February 5, 2007
    Date of Patent: November 2, 2010
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung, Chao-Yuan Tsai
  • Patent number: 7815491
    Abstract: The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a membrane with low permeability; a two-component paste formed on the upper surface of the membrane with low permeability for adhering the base material to the membrane with low permeability; and a polyurethane paste formed on the lower surface of the membrane with low permeability. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. The polishing pad as mentioned above prevents the polishing pad from detaching from the polishing platen or head. The polishing pad is easy to be replaced without leaving residues on the polishing platen or head.
    Type: Grant
    Filed: May 29, 2007
    Date of Patent: October 19, 2010
    Assignee: San Feng Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung
  • Publication number: 20100227118
    Abstract: The present invention relates to a sheet having discontinuous adhesion points and a method for making the same. The sheet includes a buffer layer, an adsorption layer, and an adhesion layer. The adhesion layer is disposed between the buffer layer and the adsorption layer. The adhesion layer has a plurality of adhesion points to bind the buffer layer and the adsorption layer together. The adhesion points are discontinuous and have gaps in between. Consequently, when the sheet is pressed, air can be vented out through the gaps between the adhesion points, so that the adsorption force is increased.
    Type: Application
    Filed: August 5, 2009
    Publication date: September 9, 2010
    Applicant: BESTAC ADVANCED MATERIAL CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Wen-Chieh Wu
  • Patent number: 7789738
    Abstract: The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate, a surface layer and a slightly rough layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a surface. The slightly rough layer is located on the surface of the surface layer to carry and mount the polishing workpiece, with no hole structure existing in the interior thereof. Accordingly, when the polishing workpiece contacts the slightly rough layer, the air therebetween is easily vented out via the slightly rough layer, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet.
    Type: Grant
    Filed: July 3, 2006
    Date of Patent: September 7, 2010
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao
  • Patent number: 7762873
    Abstract: A polishing pad includes a body having a polymer layer and a polishing layer. The polymer layer has opposite first and second faces. The polymer layer includes a plurality of first ultrafine fibers and a polymer bonding the first ultrafine fibers together. The polishing layer is formed on the first face of the polymer layer. The polishing layer includes a plurality of second ultrafine fibers and is free of the polymer. The first and second ultrafine fibers are identical to each other. The second ultrafine fibers have a first concentration of ultrafine fibers by volume higher than 80% a total volume of the polishing layer. The first ultrafine fibers of the polymer layer have a second concentration of ultrafine fibers by volume to a total volume of the polymer layer. The first concentration is higher than the second concentration.
    Type: Grant
    Filed: May 13, 2008
    Date of Patent: July 27, 2010
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, Chen-Hsiang Chao, I-Peng Yao
  • Publication number: 20100146863
    Abstract: The present invention relates to a polishing pad having an insulation layer and a method for making the same. The polishing pad includes a bottom layer, an insulation layer, and an abrasive layer. The bottom layer includes a fabric layer wrapped in a high polymer. The insulation layer is disposed on the bottom layer. The abrasive layer is disposed on the insulation layer. The abrasive layer is a high polymeric elastomer and has a plurality of columnar-like cells. The insulation layer can prevent the slurry from infiltrating into the bottom layer during the polishing processs to improve the polishing effect and quality.
    Type: Application
    Filed: August 5, 2009
    Publication date: June 17, 2010
    Applicant: BESTAC ADVANCED MATERIAL CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Chun-Ta Wang, Wei-Te Liu
  • Publication number: 20100119811
    Abstract: The present invention relates to a conductive polishing pad and a method for making the same. The conductive polishing pad includes a bottom layer, a conductive film and a polishing layer. The bottom layer includes a first high polymer and a fiber base. The first high polymer covers the fiber base, and has a plurality of first holes. The conductive film is disposed on the bottom layer. The polishing layer is disposed on the conductive film, and includes a second high polymer. The second high polymer has a plurality of second holes. Even though the bottom layer and the polishing layer are poor conductors, the conductivity thereof is raised by the conductive film, so that the polishing pad has good conductivity. Further, the polishing pad has a flexible surface, which prevents a surface of a workpiece to be polished from being scratched during polishing.
    Type: Application
    Filed: April 21, 2009
    Publication date: May 13, 2010
    Applicant: BESTAC ADVANCED MATERIAL CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Chun-Ta Wang
  • Publication number: 20100099343
    Abstract: The present invention relates to a polishing pad having abrasive grains and a method for making the same. The polishing pad having abrasive grains includes a plurality of fibers, a plurality of abrasive grains and a high polymer. The fibers intersect each other to form a fiber matrix. The abrasive grains are attached to the fibers. The high polymer covers the fibers and the abrasive grains. The abrasive grains will not easily scratch a surface of a workpiece to be polished due to the flexibility of the fibers.
    Type: Application
    Filed: June 29, 2009
    Publication date: April 22, 2010
    Applicant: BESTAC ADVANCED MATERIAL CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Kun-Cheng Tsai, Chih-Yi Lin
  • Patent number: 7662028
    Abstract: A groove structure for avoiding stripping of a polishing surface of a polishing pad, the polishing pad including a base material and a grinding layer. The base material has a surface. The grinding layer is disposed on the surface, and part of the surface around the edge of the base material is exposed. The grinding layer has a plurality of first grooves and second grooves, and the first grooves cross the second grooves to define a plurality of grinding areas. The exposed part of the surface around the edge of the base material is located between the first grooves, the second grooves and the edge of the polishing pad. The polishing pad contains more grinding liquid, to clean the small grinded pieces. The grinding layer does not have an acute structure and is not easily peeled to form the small grinded pieces. Therefore, grinding quality and grinding effect are improved.
    Type: Grant
    Filed: June 16, 2008
    Date of Patent: February 16, 2010
    Assignee: Bestac Advanced Material Co., Ltd.
    Inventors: Chung-Chih Feng, Wei-Te Liu, Yung-Chang Hung, Chun-Ta Wang, I-Peng Yao
  • Patent number: 7629554
    Abstract: The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate and a surface layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a plurality of through holes. Accordingly, when the polishing workpiece contacts the surface layer, the air therebetween is vented to the substrate via the through holes and then is easily vented out, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet, thereby improving the polishing effect of the polishing workpiece.
    Type: Grant
    Filed: March 19, 2007
    Date of Patent: December 8, 2009
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao
  • Publication number: 20090288761
    Abstract: The present invention relates to a composite with thermo-formability, a method for making the same and a method for making a casing with a texture on the surface thereof. The composite includes a PU medium layer, a thermo-formable resin layer, a base layer and a surface layer. The thermo-formable resin layer is disposed on the PU medium layer, and includes polyol. The base layer is disposed on the thermo-formable resin layer. The surface layer is disposed on the base layer. As a result, the composite has good stability after thermoforming, and plastic can be injected into the composite, so a PC film is unnecessary. Moreover, the composite may be adhered to a substrate directly or after thermoforming.
    Type: Application
    Filed: April 3, 2009
    Publication date: November 26, 2009
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Ko-Feng Wang, Kai-Feng Kang, Chun-Yi Kuo
  • Publication number: 20090258587
    Abstract: The present invention relates to a polishing pad having a groove structure for avoiding the polishing surface stripping. The polishing pad of present invention includes a base material and a grinding layer. The base material has a surface. The grinding layer is disposed on the surface, and part of the surface around the edge of the base material is exposed. The grinding layer has a plurality of first grooves and second grooves, and the first grooves cross the second grooves to define a plurality of grinding areas. The exposed part of the surface around the edge of the base material is located between the first grooves, the second grooves and the edge of the polishing pad. Whereby, the polishing pad of present invention is capable to contain more grinding liquid, and is contributive to clean the small grinded pieces. Furthermore, the grinding layer does not have acute structure and is not easy to peel to form the small grinded pieces. Therefore, the grinding quality and grinding effect can be improved.
    Type: Application
    Filed: June 16, 2008
    Publication date: October 15, 2009
    Applicant: BESTAC ADVANCED MATERIAL CO., LTD.
    Inventors: Chung-Chih Feng, Wei-Te Liu, Yung-Chang Hung, Chun-Ta Wang, I-Peng Yao
  • Publication number: 20090258136
    Abstract: The production method of the coating material comprising the steps of applying and drying liquid polyurethane (PU) material onto a release paper in order to form three polyurethane (PU) layers, rolling the composite layer and separating the release paper to form the composite coating material for covering the outer shells of electronic devices. The polyurethane (PU) composite coating material thereby produced comprises at least a colored surface layer and a substrate layer. The surface of the composite coating material is colored and has a relief-like pattern, which can provide users with a better visual or touch effect.
    Type: Application
    Filed: June 18, 2009
    Publication date: October 15, 2009
    Inventors: Chung-Ching Feng, I-Peng Yao, Pei-Huo Huang, Ko-Feng Wang, Yong-Song Lin, Kai-Feng Kang
  • Publication number: 20090258578
    Abstract: The present invention relates to a polishing pad and method for making the same. In the invention, a liquid-state polymer material is directly formed on the surface of a base material, and then the liquid-state polymer material is solidified to form a flat grinding layer. Whereby, the polishing pad has high unity and flatness. The grinding layer has attenuated structures and a plurality of holes, thus increasing the storage ability of polishing particles distributed in a polishing liquid. In addition, the polishing pad has high compression ratio, so the polishing pad can compactly contact a polishing workpiece, and will not scratch the surface of the polishing workpiece scratched. Therefore, the polishing effect and quality will be improved.
    Type: Application
    Filed: September 11, 2008
    Publication date: October 15, 2009
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, Chun-Ta Wang, Yung-Chang Hung, I-Peng Yao
  • Publication number: 20090258316
    Abstract: The present invention relates to a method for patterning a covering material by using a high-power exciting beam. The method includes the steps of (a) providing a base material having a plurality of thin layers, the neighboring thin layers having different colors; and (b) utilizing a high-power exciting beam to form at least one pattern on the base material, in which the pattern has at least one concave portion, so as to expose the thin layers with different colors. As a result, the covering material has a layered visual effect and many colors. Furthermore, the patterning method of the present invention is simple, and can form the pattern on the base material easily Therefore, the manufacturing time of the covering material with the pattern is reduced.
    Type: Application
    Filed: August 12, 2008
    Publication date: October 15, 2009
    Applicant: SANG FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih FENG, Chun-Ta WANG, Yung-Chang HUNG, Wei-Te LIU, I-Peng Yao
  • Publication number: 20090252949
    Abstract: The present invention relates to a composite sheet for mounting a workpiece and a method for making the same. The composite sheet includes a buffer layer and an adsorption layer. The buffer layer has a plurality of continuous pores. The adsorption layer is located on the buffer layer for adsorbing a workpiece, and the compression ratio of the buffer layer is higher than that of the adsorption layer. Thereby, due to low hardness, good adsorption effect, and high compression ratio, the composite sheet of the present invention has good buffer effect.
    Type: Application
    Filed: June 4, 2009
    Publication date: October 8, 2009
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Zong-Yao Ku
  • Publication number: 20090252876
    Abstract: The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate and a surface layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a surface and a slightly rough layer. The slightly rough layer is located on the surface of the surface layer to carry and mount the polishing workpiece, with no hole structure existing in the interior thereof. Accordingly, when the polishing workpiece contacts the slightly rough layer, the air therebetween is easily vented out via the slightly rough layer, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet.
    Type: Application
    Filed: June 10, 2009
    Publication date: October 8, 2009
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Chen-Hsiang Chao
  • Patent number: 7556555
    Abstract: The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a membrane with low permeability; and a buffer layer formed between the base material and an upper surface of the membrane with low permeability and embedded into the fibers of the base material. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided.
    Type: Grant
    Filed: February 15, 2007
    Date of Patent: July 7, 2009
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung