Abstract: A safety node for a hydrocarbon extraction facility control system, the node comprising: a hydraulic input; a hydraulic output; a directional control valve disposed between the hydraulic input and the hydraulic output; and a functional safety electronics module containing a logic solver in operable communication with the directional control valve; wherein the logic solver is configured to operate the directional control valve to permit hydraulic communication between the hydraulic input and the hydraulic output in response to the presence of a given condition and inhibit hydraulic communication between the hydraulic input and the hydraulic output in response to the absence of a given condition.

Abstract: A system in package is provided comprising an embedded trace substrate having redistribution layers therein, at least one passive component mounted on one side of the embedded trace substrate and embedded in a first molding compound, at least one silicon die mounted on an opposite side of the embedded trace substrate and embedded in a second molding compound wherein electrical connections are made between the at least one silicon die and the at least one passive component through the redistribution layers, and solder balls mounted through openings in the second molding layer to the redistribution layers wherein the solder balls provide package output.

Abstract: At least one redistribution layer (RDL) is provided on a silicon die. A passivation layer is deposited on the RDL. First openings having a first diameter are etched in the passivation layer where copper posts are to be formed. A seed layer is deposited over the passivation layer and within the openings. A photoresist layer is coated on the seed layer and patterned to form second openings having a second diameter over the first openings larger than the first diameter. Copper is plated on the seed layer to form copper posts filling the second openings. The silicon die is die attached to a metal substrate. A lamination layer is coated over the silicon die and the copper posts. Third openings are formed through the lamination layer to the copper posts and to metal pads on the metal substrate. Metal vias are formed in the third openings.

Abstract: Systems and methods described herein allow for reliable and computationally efficient detection of fluid leak events or abnormal fluid usage/flow events. A fluid flow meter can measure fluid flow parameter values during a training phase. The fluid flow meter can generate, using the fluid flow parameter data, a training fluid flow duration pattern indicative of, for each value range of a plurality of value ranges of a respective time threshold value. The time threshold value can represent an estimate of a maximum fluid flow duration, within a given fluid flow event, for fluid flow associated with the corresponding value range. During a detection phase, the fluid flow meter can determine, for a value range, a respective fluid flow duration within a current fluid flow event. The fluid flow meter can detect a leak event upon the fluid flow duration exceeds the time threshold value for the same value range.

Abstract: According to at least one aspect, the present disclosure is directed to leak detection. There is pressure sensor for measuring pressure of fluid within a hollow structure, a shut-off valve for controlling fluid flow through the hollow structure, and a processor communicatively coupled to the pressure sensor and to the shut-off valve. The processor can acquire, from the pressure sensor, a first pressure measurement of the fluid while the shut-off valve is in an open state, and a second pressure measurement of the fluid while the shut-off valve is in a closed state. The processor can detect a fluid leak event based on the first and second pressure measurements.

Abstract: A system in package is provided comprising an embedded trace substrate having redistribution layers therein, at least one passive component mounted on one side of the embedded trace substrate and embedded in a first molding compound, at least one silicon die mounted on an opposite side of the embedded trace substrate and embedded in a second molding compound wherein electrical connections are made between the at least one silicon die and the at least one passive component through the redistribution layers, and solder balls mounted through openings in the second molding layer to the redistribution layers wherein the solder balls provide package output.

Abstract: Systems and methods described herein allow for reliable and computationally efficient detection of fluid leak events or abnormal fluid usage/flow events. A fluid flow meter can measure fluid flow parameter values during a training phase. The fluid flow meter can generate, using the fluid flow parameter data, a training fluid flow duration pattern indicative of, for each value range of a plurality of value ranges of a respective time threshold value. The time threshold value can represent an estimate of a maximum fluid flow duration, within a given fluid flow event, for fluid flow associated with the corresponding value range. During a detection phase, the fluid flow meter can determine, for a value range, a respective fluid flow duration within a current fluid flow event. The fluid flow meter can detect a leak event upon the fluid flow duration exceeds the time threshold value for the same value range.

Abstract: A system in package is provided comprising an embedded trace substrate having redistribution layers therein, at least one passive component mounted on one side of the embedded trace substrate and embedded in a first molding compound, at least one silicon die mounted on an opposite side of the embedded trace substrate and embedded in a second molding compound wherein electrical connections are made between the at least one silicon die and the at least one passive component through the redistribution layers, and solder balls mounted through openings in the second molding layer to the redistribution layers wherein the solder balls provide package output.

Abstract: At least one redistribution layer (RDL) is provided on a silicon die. A passivation layer is deposited on the RDL. First openings having a first diameter are etched in the passivation layer where copper posts are to be formed. A seed layer is deposited over the passivation layer and within the openings. A photoresist layer is coated on the seed layer and patterned to form second openings having a second diameter over the first openings larger than the first diameter. Copper is plated on the seed layer to form copper posts filling the second openings. The silicon die is die attached to a metal substrate. A lamination layer is coated over the silicon die and the copper posts. Third openings are formed through the lamination layer to the copper posts and to metal pads on the metal substrate. Metal vias are formed in the third openings.

Abstract: A method to fabricate a reconstructed panel based fan-out wafer level package is described. A reconstructed wafer panel is provided comprising a plurality of individual dies encapsulated in a first molding compound. Interconnected metal redistribution layers (RDL) separated by PSV layers are formed on top surfaces of the plurality of individual dies. Thereafter, the reconstructed wafer panel is cut into a plurality of rectangular strips. Thereafter, backend processing is performed on each of the plurality of rectangular strips.

Abstract: A system in package is provided comprising an embedded trace substrate having redistribution layers therein, at least one passive component mounted on one side of the embedded trace substrate and embedded in a first molding compound, at least one silicon die mounted on an opposite side of the embedded trace substrate and embedded in a second molding compound wherein electrical connections are made between the at least one silicon die and the at least one passive component through the redistribution layers, and solder balls mounted through openings in the second molding layer to the redistribution layers wherein the solder balls provide package output.

Abstract: A wafer level chip scale package is described. At least one redistribution layer is connected to a wafer through an opening through a first polymer layer to a metal pad on a top surface of the wafer wherein the redistribution layer has a roughened top surface and wherein holes are formed through the at least one redistribution layer in an area where the redistribution layer has an area exceeding 0.2 mm2. At least one UBM layer contacts the at least one redistribution layer through an opening in a second polymer layer wherein the second polymer layer contacts the first polymer layer within the holes promoting cohesion between the first and second polymer layers and wherein the roughened top surface promotes adhesion between the at least one redistribution layer and the second polymer layer.

Abstract: A safety node for a hydrocarbon extraction facility control system, the node comprising: a hydraulic input; a hydraulic output; a directional control valve disposed between the hydraulic input and the hydraulic output; and a functional safety electronics module containing a logic solver in operable communication with the directional control valve; wherein the logic solver is configured to operate the directional control valve to permit hydraulic communication between the hydraulic input and the hydraulic output in response to the presence of a given condition and inhibit hydraulic communication between the hydraulic input and the hydraulic output in response to the absence of a given condition.

Abstract: An integrated passive device and power management integrated circuit are directly connected, active surface to active surface, resulting in a pyramid die stack. The die stack is flip-chip attached to a laminate substrate having a cavity drilled therein wherein the smaller die fits into the cavity. The die to die attach is not limited to IPD and PMIC and can be used for other die types as required.

Abstract: A quad flat no lead package is provided comprising at least one first integrated circuit die embedded in a recess in a die paddle of a metal leadframe and a second integrated circuit chip die attached to the at least one first integrated circuit die wherein the first and second integrated circuit dies are electrically connected to each other and wherein the second integrated circuit die is connected to leads of the leadframe through copper pillars.

Abstract: The present invention relates to an inspection device and particularly to a device using an array of light sources and photo-detection devices to evaluate threaded workpieces for conformance to spatial form criteria. The invention provides for improved identification of flaws in threaded components to identify the conformance of parts.

Abstract: An integrated passive device and power management integrated circuit are directly connected, active surface to active surface, resulting in a pyramid die stack. The die stack is flip-chip attached to a laminate substrate having a cavity drilled therein wherein the smaller die fits into the cavity. The die to die attach is not limited to IPD and PMIC and can be used for other die types as required.

Abstract: The present invention relates to an inspection device and particularly to a device using an array of light sources and photo-detection devices to evaluate threaded workpieces for conformance to spatial form criteria. The invention provides for improved identification of flaws in threaded components to identify the conformance of parts.

Abstract: A communication connection in a subsea well for converting an optical signal from an optical fiber to an electrical signal, comprising a small form factor pluggable device.

Abstract: An electronic package is fabricated wherein a substrate is provided having three or more layers. A heat slug is embedded completely within the substrate. A die is attached above the substrate. Thermal paths to the heat slug are linked through the ground signal interconnects (traces, vias and planes).