Abstract: An electronic package is fabricated wherein a substrate is provided having three or more layers. A heat slug is embedded completely within the substrate. A die is attached above the substrate. Thermal paths to the heat slug are linked through the ground signal interconnects (traces, vias and planes).

Abstract: An integrated passive device and power management integrated circuit are directly connected, active surface to active surface, resulting in a pyramid die stack. The die stack is flip-chip attached to a laminate substrate having a cavity drilled therein wherein the smaller die fits into the cavity. The die to die attach is not limited to IPD and PMIC and can be used for other die types as required.

Abstract: An electronics module for a well installation configured to receive software via a wireless connection and methods of installing software on an electronics module for a well installation, are provided. An example of such electronics module comprises a short-range wireless receiver for wirelessly receiving software and/or data from an external wireless source. Modem external interface wiring can be employed as an antenna for the wireless receiver to receive the wireless transmission of the software and/or data.

Abstract: A production shutdown system for an underwater hydrocarbon production facility, comprising, on the topside: a safety system, and a communications module; and, underwater; drive control means, and an underwater communications component; wherein in use safety signals are passed from the safety system to the drive control means via the topside communications module and the underwater communications component, and wherein the safety system and drive control means are rated according to a prescribed safety level but the communications module and underwater communications component are not so rated.

Abstract: A communication connection in a subsea well for converting an optical signal from an optical fiber to an electrical signal, comprising a small form factor pluggable device.

Abstract: A subsea well control system comprises: a well tree (6 or 7) having a subsea control module (10 or 11); and a power and communications distribution module (5) for communication with the subsea control module via a communication link (8 or 9) between the subsea control module and the distribution module. The link comprises a 4-wire dual twisted copper pair as part of an RS422-based interface.

Abstract: A production shutdown system for an underwater hydrocarbon production facility, comprising, on the topside: a safety system, and a communications module; and, underwater; drive control means, and an underwater communications component; wherein in use safety signals are passed from the safety system to the drive control means via the topside communications module and the underwater communications component, and wherein the safety system and drive control means are rated according to a prescribed safety level but the communications module and underwater communications component are not so rated.

Abstract: An electronics module for a well installation comprises a wireless receiver for receiving data and/or software from an external source.

Abstract: An electronics card for an electronics module comprises a wireless transceiver for communication with a second wireless transceiver external to the card. In addition, an electronics module comprises such an electronics card.

Abstract: A method of fabricating a semiconductor package comprising the step of providing a leadframe strip which defines a strip plane and a multiplicity of leadframes. Each of the leadframes includes an outer frame defining a central opening and a die pad disposed within the central opening. Each leadframe further includes a plurality of leads which are attached to the outer frame and extend toward the die pad in spaced relation to each other. The outer frames are integrally connected to each other and collectively define connecting bars which extend in multiple rows and columns and define saw streets. Semiconductor dies are attached to respective ones of the die pads, with the semiconductor dies being mechanically and electrically connected to the leads of respective ones of the leadframes. Thereafter, an encapsulant material is applied to the leadframe strip to form at least one mold cap which at least partially encapsulates the leadframes, the semiconductor dies, and the conductive wires.